公开(公告)号：EP1189282A4

公开(公告)日：2006-02-15

申请号：EP01912489

申请日：2001-03-19

Applicant: MITSUBISHI ELECTRIC CORP

Inventor： HAMAGUCHI TSUNEO ,  KAGATA KENJI

IPC: H01L23/13 ,  H01L23/498 ,  H01L25/065 ,  H01L27/146 ,  H05K3/34 ,  H01L23/12

CPC classification number: H05K3/3436 ,  H01L23/13 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L27/14609 ,  H01L27/14618 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10162 ,  H01L2924/10253 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K2201/09018 ,  H05K2201/094 ,  H05K2203/0465 ,  H05K2203/306 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: A low cost semiconductor device, a method of manufacturing an electronic device, electronic devices, and a portable information terminal; the semiconductor device, comprising projected electrodes located on one surface of a circuit board and having a specified height, semiconductor chips smaller than the height of the projected electrodes, and electronic parts larger than the thickness of the semiconductor chips located on the other surface of the circuit board so that the one surface side is bent in the direction thereof, whereby the rigidly of the device and a clearance between the semiconductor chips and a mounting substrate are assured; electronic devices and a portable information terminal, wherein the semiconductor device having a logic LSI installed on both surfaces of the circuit board is installed on a mounting substrate disposed in a cabinet through the projected electrodes having a specified height and formed so that the projected electrode side of the circuit board is bent in the direction thereof, whereby the rigidity and clearance can be assured and a damage is not given to the logic LSI even when an external pressure is applied thereto.

公开(公告)号：EP1445998A1

公开(公告)日：2004-08-11

申请号：EP03388024.6

申请日：2003-04-25

Applicant: Sony Ericsson Mobile Communications AB

Inventor： Fagrenius, Gustav ,  Bengtsson, Henrik ,  Sandevi, Tommy ,  Hermann, Frederik Per ,  Andersson, Niklas ,  Meynert, Hans

IPC: H05K9/00

CPC classification number: H05K9/003 ,  H05K1/0284 ,  H05K1/0393 ,  H05K3/341 ,  H05K2201/09018 ,  H05K2201/10371 ,  Y02P70/613

Abstract: A shield can (1) for shielding electronic components on a PWB (printed wired board) (6) in an electronic device. In order to compensate for any non-planarity of the PWB, the shield can (1) is divided into sections (2) that are linked together in a flexible manner.

Abstract translation: 屏蔽罩可以（1）用于屏蔽电子设备中PWB（印刷电路板）（6）上的电子部件。 为了补偿PWB的任何非平面性，屏蔽罐（1）被分成以柔性方式连接在一起的部分（2）。

公开(公告)号：EP0805492B1

公开(公告)日：2004-06-30

申请号：EP97104225.4

申请日：1997-03-13

Applicant: Schulz-Harder, Jürgen, Dr.-Ing. ,  Maier, Peter H.

Inventor： Schulz-Harder, Jürgen, Dr.-Ing. ,  Maier, Peter H.

IPC: H01L23/14 ,  H01L23/15 ,  H01L23/367 ,  H01L21/48 ,  H01L23/13

CPC classification number: H05K3/0061 ,  C04B37/021 ,  C04B37/026 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/70 ,  C04B2237/706 ,  H01L23/13 ,  H01L23/367 ,  H01L23/3735 ,  H01L2224/16 ,  H01L2924/0102 ,  H01L2924/01322 ,  H01L2924/3511 ,  H05K1/0306 ,  H05K2201/0355 ,  H05K2201/09018 ,  Y10S428/901 ,  Y10T428/24802 ,  Y10T428/24917 ,  Y10T428/31678

公开(公告)号：EP1019654A4

公开(公告)日：2004-03-03

申请号：EP98922244

申请日：1998-05-12

Applicant: ROBOTIC VISION SYSTEMS

Inventor： WHITE TIMOTHY P ,  MESSINA MICHAEL C

IPC: F21S8/04 ,  F21Y101/02 ,  G01N21/88 ,  H05K1/18 ,  F21V21/00 ,  G06K9/00

CPC classification number: G01N21/8806 ,  G09F9/301 ,  H05K1/189 ,  H05K2201/052 ,  H05K2201/053 ,  H05K2201/09018 ,  H05K2201/10106

Abstract: An apparatus and method for forming a conical or domed ring light (20) having a plurality of light sources (36) arranged at a desired angle with respect to the optical axis. The light sources are installed at desired locations on a first surface of the flexible circuit board (22) and are each coupled to a common electrical connector (37), having one or a plurality of power sources, to facilitate supplying electrical power to each one of the light sources. The circuit board is then folded into a conical or domed configuration (39), with the light sources facing inward, and each abutted end and lateral surfaces of the folded circuit board is suitably secured or fastened to one another to permanently retain the flexible circuit board in its folded state.

Abstract translation: 一种用于形成具有相对于光轴以期望的角度布置的多个光源的圆锥形或圆顶环形光的装置和方法。 首先确定照明装置的一些尺寸，然后使用适当的公式计算电路板的剩余尺寸。 此后，使用计算的尺寸从平面柔性电路板切割所需的弓形部分。 然后将光源安装在柔性电路板的第一表面上的期望位置处，并且每个光源都耦合到具有一个或多个电源的公共电连接器，以便于向每个光源提供电力。 然后将电路板折叠成圆锥形或圆顶形结构，其中光源面向内，并且折叠电路板的每个邻接端和侧表面被适当地固定或紧固到彼此以将柔性电路板永久地保持在折叠状态 州。

公开(公告)号：EP1210725A1

公开(公告)日：2002-06-05

申请号：EP00954074.1

申请日：2000-08-16

Applicant: The Johns Hopkins University

Inventor： CORNISH, Timothy, J. ,  CHARLES, Harry, K. ,  WIENHOLD, Paul, D.

IPC: H01J49/40 ,  H05K1/00

CPC classification number: H01J49/405 ,  G21K1/06 ,  H05K1/118 ,  H05K3/0014 ,  H05K2201/09018 ,  H05K2203/1327

Abstract: A novel technique utilizing the precision of printed circuit board design and the physical versatility of thin, fexible substrates is disclosed to produce a new type of ion reflector. A precisely defined series of thin conductive strips (traces) are etched onto a flat, flexible circuit board substrate. Preferably, the thin conductive strips are further apart at one end of the substrate and get increasingly closer towards the other end of the substrate. The flexible substrate is then rolled into a tube to form the reflector body, with the conductive strips forming the rings of the ion reflector. The spacing between the traces, and hence the ring spacing, can be readily varied by adjusting the conductor pattern on the substrate sheet during the etching process. By adjusting the spacing between the rings, the characteristics of the field created by the reflectron can be easily customized to the needs of the user.

公开(公告)号：EP0878355A3

公开(公告)日：2001-10-24

申请号：EP98303300.2

申请日：1998-04-28

Applicant: Ford Motor Company

Inventor： Belke, Robert Edward ,  Trublowski, John ,  Todd, Michael George

IPC: B60R16/02

CPC classification number: H05K3/3484 ,  H02G3/266 ,  H05K1/0284 ,  H05K3/3478 ,  H05K2201/09018 ,  H05K2203/0195 ,  H05K2203/0338

Abstract: A method and apparatus is provided for applying a fluid to a plurality of locations on a non-planar substrate (26) . The apparatus includes a movable base (28) and an array of pins (30) connected to the base (24). Each pin (30) has a distal end (32) which is vertically movable with respect to the base (24) independently of the rest of the array of pins. Each distal end (32) is adapted to transfer fluid to a location on the substrate (26) by having a greater affinity for the fluid than the fluid has for itself and a lesser affinity for the fluid than the fluid has for the substrate. Accordingly, the distal ends (32) may be dipped in the fluid and moved into contact with the substrate (26) such that the distal ends may collapse toward the base (28) as the distal ends (32) engage the substrate (26) to facilitate further movement of the base toward the substrate for application of fluid to each of the plurality of locations.

Abstract translation: 提供了一种用于将流体施加到非平面基底（26）上的多个位置的方法和装置。 该装置包括可移动基座（28）和连接到基座（24）的销（30）阵列。 每个销（30）具有远离端部（32），该远端可相对于基座（24）垂直移动，而与引脚阵列的其余部分无关。 每个远端（32）适于通过对流体具有比流体本身更大的亲和力并且对流体具有比流体对底物更小的亲和力，将流体传递到基底（26）上的位置。 因此，远端（32）可以浸入流体中并与衬底（26）接触，使得当远端（32）接合衬底（26）时，远端可能朝着基部（28）折叠， 以促进底座朝向衬底的进一步运动，以将流体施加到多个位置中的每个位置。

公开(公告)号：EP1075782A1

公开(公告)日：2001-02-14

申请号：EP99947066.9

申请日：1999-04-27

Applicant: Telefonaktiebolaget L M Ericsson (Publ)

Inventor： HOLMBERG, Per ,  ERIKSSON, Lars

IPC: H05K9/00 ,  G12B17/02

CPC classification number: H05K9/0092 ,  H05K1/0284 ,  H05K1/095 ,  H05K3/12 ,  H05K3/1275 ,  H05K2201/09018 ,  H05K2201/09045 ,  H05K2201/0999 ,  H05K2203/0534

Abstract: The invention relates to an electrically conductive unit (1) extending by means of electrically conductive paths (10, 29), which are directly or indirectly applied onto a case (2), for creating a screening against electromagnetic radiation and/or for the draining of electrical currents.

公开(公告)号：EP1019654A2

公开(公告)日：2000-07-19

申请号：EP98922244.3

申请日：1998-05-12

Applicant: NORTHEAST ROBOTICS, INC.

Inventor： WHITE, Timothy, P. ,  MESSINA, Michael, C.

IPC: F21V21/00 ,  G06K9/00

CPC classification number: G01N21/8806 ,  G09F9/301 ,  H05K1/189 ,  H05K2201/052 ,  H05K2201/053 ,  H05K2201/09018 ,  H05K2201/10106

Abstract: An apparatus and method for forming a conical or domed ring light (20) having a plurality of light sources (36) arranged at a desired angle with respect to the optical axis. The light sources are installed at desired locations on a first surface of the flexible circuit board (22) and are each coupled to a common electrical connector (37), having one or a plurality of power sources, to facilitate supplying electrical power to each one of the light sources. The circuit board is then folded into a conical or domed configuration (39), with the light sources facing inward, and each abutted end and lateral surfaces of the folded circuit board is suitably secured or fastened to one another to permanently retain the flexible circuit board in its folded state.

公开(公告)号：EP0872882A2

公开(公告)日：1998-10-21

申请号：EP98105261.6

申请日：1998-03-24

Applicant: Curamik Electronics GmbH

Inventor： Schulz-Harder, Jürgen, Dr. ,  Exel, Karl, Dr.

IPC: H01L21/48 ,  H01L23/13

CPC classification number: H01L23/13 ,  C04B37/001 ,  C04B37/021 ,  C04B37/023 ,  C04B2235/6562 ,  C04B2235/6565 ,  C04B2237/124 ,  C04B2237/34 ,  C04B2237/343 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/407 ,  C04B2237/54 ,  C04B2237/70 ,  C04B2237/76 ,  C04B2237/82 ,  H01L21/4807 ,  H01L23/3735 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01039 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/3511 ,  H05K1/0306 ,  H05K3/0014 ,  H05K2201/09018 ,  H05K2203/1105 ,  H05K2203/302 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49158 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: Die Erfindung bezieht sich auf ein neuartiges Verfahren zum Herstellen eines gewölbten Metall-Keramik-Substrates mit einer von einer Keramikplatte gebildeten Keramikschicht, die an wenigstens einer Oberflächenseite mit einer Metallisierung versehen ist, welche auf die vorgewölbte Keramikplatte aufgebracht wird.

Abstract translation: 生产用于电气或电子部件或回路的弯曲金属化陶瓷基板（1）包括将生片（2）放置在模具元件的凹陷顶表面上，例如， 耐热材料的模板，然后在≥1200℃下热处理预定时间。 优选地，将一个或多个生片放置在模具元件的凹曲面上，将重量（厚板或对模元件）放置在片材或片材堆叠上，并且在两个连续步骤中进行热处理 ，第二步是在比第一步低的温度（例如低于100摄氏度）的温度下进行。 金属化（3,4）优选通过铜箔的直接铜键（DCB）施加到弯曲陶瓷片（2）上，或者通过使用活性焊膏（例如40％Ag，55％Cu 和5％Ti）或焊锡箔（优选薄氧化铜箔）。

公开(公告)号：EP0650189B1

公开(公告)日：1996-08-21

申请号：EP93117215.9

申请日：1993-10-22

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： Kuhnert, Reinhold, Dr., Dipl.-Phys. ,  Schwarzbauer, Herbert, Dr., Dipl.-Min.

IPC: H01L21/603 ,  B23K20/02

CPC classification number: B30B5/02 ,  B23K20/002 ,  B23K2201/40 ,  B30B15/024 ,  H01L21/4878 ,  H01L23/13 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/75315 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2224/8383 ,  H01L2224/8384 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15787 ,  H01L2924/3511 ,  H05K1/0306 ,  H05K3/0014 ,  H05K2201/09018 ,  H05K2203/1105 ,  H05K2203/302 ,  H01L2924/00