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61.发明公开
公开(公告)号：EP3288246A1
公开(公告)日：2018-02-28
申请号：EP17185937.4
申请日：2017-08-11
Inventor： ZHANG, Wenzhen
CPC classification number: H05K1/189 , G06F1/1684 , G06F2203/0338 , G06K9/00006 , H04M1/026 , H04M2250/12 , H05K1/0281 , H05K1/111 , H05K1/144 , H05K3/301 , H05K3/305 , H05K3/363 , H05K5/03 , H05K2201/041 , H05K2201/10151 , H05K2201/10318 , H05K2201/10325 , H05K2201/10757
Abstract: A fingerprint module includes a cover plate, a fingerprint chip, an intermediate board, and a circuit board. An assembling region is disposed on the cover plate. The fingerprint chip is fixed in the assembling region. The intermediate board is bonded to one surface of the fingerprint chip opposite to the cover plate to press the fingerprint chip. The circuit board is electrically connected to the fingerprint chip via the intermediate board.
Abstract translation: 指纹模块包括盖板，指纹芯片，中间板和电路板。 装配区域设置在盖板上。 指纹芯片固定在组装区域。 将中间板键合到指纹芯片的与盖板相对的一个表面以按压指纹芯片。 电路板通过中间板电连接到指纹芯片。
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公开(公告)号：EP3193406A1
公开(公告)日：2017-07-19
申请号：EP15839537.6
申请日：2015-09-10
Applicant: NSK Ltd.
Inventor： MORIMOTO Masakazu , KANEKO Noboru , OSAKABE Tadayoshi
CPC classification number: H05K1/18 , H01R12/52 , H01R12/57 , H01R12/58 , H01R12/707 , H01R13/405 , H01R43/24 , H01R2201/26 , H05K1/144 , H05K3/3426 , H05K7/1432 , H05K2201/042 , H05K2201/10318
Abstract: [Problem]
To solve a deformation and a position aberration of the multipolar lead parts used in a connection with a board.
[Means for solving the problem]
The present invention is multipolar lead parts having plural leads and a retaining member, wherein the retaining member includes a cylindrical portion so as to cover peripheries of the leads, the cylindrical portion facing in a board direction; wherein the leads each include an upper-side board coupling portion and a lower-side board coupling portion; wherein the lower-side board coupling portion comprises a forward protruding portion that the other end side of each of the leads is bent in a direction orthogonal to an arrangement face of the leads, a vertical portion extending downward from a front end, a solder coupling portion extending backward from a lower end, and a rising portion extending upward from the solder coupling portion; and wherein a bending angle of the rising portion with respect to the solder coupling portion is formed so as to be substantially identical to a bending angle of the vertical portion with respect to the solder coupling portion.Abstract translation: [问题]解决用于与电路板连接的多极引线部件的变形和位置偏差。 解决问题的手段本发明是具有多个引线和保持构件的多极引线部件，其中保持构件包括圆柱形部分以覆盖引线的周边，圆柱形部分面向基板方向; 其中所述引线每个都包括上侧板联接部分和下侧板联接部分; 其中所述下侧板连接部分包括前突出部分和后突出部分，所述前突出部分的每一个的所述另一端侧沿与所述引线的布置面正交的方向弯曲，从前端向下延伸的竖直部分， 从下端向后延伸的部分以及从焊料连接部分向上延伸的升高部分; 所述立起部相对于所述焊料结合部的弯曲角度形成为与所述垂直部相对于所述焊料结合部的弯曲角度大致相同。
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公开(公告)号：EP3030061A1
公开(公告)日：2016-06-08
申请号：EP14832561.6
申请日：2014-07-28
Applicant: Kyocera Corporation
Inventor： OTOMARU,Hidekazu , KIMURA,Takashi
CPC classification number: H05K1/09 , H01L23/15 , H01L23/498 , H01L23/49811 , H01L23/49827 , H01L23/49866 , H01L2224/16225 , H05K1/097 , H05K1/111 , H05K1/113 , H05K1/181 , H05K3/34 , H05K3/4007 , H05K3/4015 , H05K2201/0376 , H05K2201/09745 , H05K2201/09827 , H05K2201/10318 , H05K2203/121
Abstract: A wiring board includes an insulating substrate (1) composed of a ceramic sintered compact; and a connection pad (2) disposed on a surface part of the insulating substrate. The connection pad includes a first portion (2a) disposed on the surface part of the insulating substrate and a second portion (2b) disposed on the first portion and an outer periphery of the second portion being located on an inner side of an outer periphery of the first portion. The second portion (2b) of the connection pad is composed of platinum, and at least an exposed surface part of the first portion (2a) of the connection pad is composed of platinum containing a ceramic component. Since a brazing material used when a lead terminal is joined to the connection pad does not readily flow onto the second portion (2b), an outer periphery of the brazing material and the outer periphery of the connection pad are located at different positions, and fracture in the connection pad caused by thermal stress concentration on the outer periphery of the connection pad, or the like is suppressed. Further, an exposed surface of the connection pad is composed of platinum or platinum containing a ceramic component, and therefore does not readily oxidize. Thereby, an excellent heat-resistant wiring board or the like can be obtained.
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公开(公告)号：EP1351302B1
公开(公告)日：2016-02-24
申请号：EP03005024.9
申请日：2003-03-06
Applicant: SEMIKRON Elektronik GmbH & Co. KG
Inventor： Göbl, Christian
CPC classification number: H05K1/181 , H01L24/72 , H01L25/072 , H01L25/115 , H01L2224/48227 , H01L2224/4846 , H01L2224/48472 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/15787 , H01L2924/19043 , H05K1/0306 , H05K3/0061 , H05K3/325 , H05K2201/10166 , H05K2201/10318 , Y02P70/611 , H01L2924/00
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公开(公告)号：EP2273129B1
公开(公告)日：2015-08-26
申请号：EP10006762.8
申请日：2010-06-30
Applicant: LTi Motion GmbH
Inventor： Wiesing, Josef, Dr. , Wagner, Martin
CPC classification number: F04D19/042 , F04D19/04 , F04D25/0693 , F04D29/083 , H01R13/533 , H05K1/144 , H05K2201/042 , H05K2201/10189 , H05K2201/10303 , H05K2201/10318 , H05K2203/1147
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Patent Agency Ranking
公开(公告)号：EP2328392B1
公开(公告)日：2013-06-05
申请号：EP10014505.1
申请日：2010-11-11
Applicant: STILL GmbH
Inventor： Wilhoeft, Adolf , Schmidt, Niels , Schettgen, Nils Christoph
CPC classification number: H05K1/144 , H02M7/003 , H05K1/0263 , H05K3/0061 , H05K3/368 , H05K7/1432 , H05K7/209 , H05K2201/042 , H05K2201/10015 , H05K2201/10166 , H05K2201/10272 , H05K2201/10303 , H05K2201/10318 , H05K2201/10409 , H05K2201/2036
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公开(公告)号：EP2328390A3
公开(公告)日：2011-09-07
申请号：EP10014503.6
申请日：2010-11-11
Applicant: STILL GmbH
Inventor： Wilhoeft, Adolf , Schmidt, Niels , Schettgen, Nils Christoph
CPC classification number: H05K1/0203 , H01L2924/19041 , H02M7/003 , H05K1/05 , H05K3/0061 , H05K3/368 , H05K7/209 , H05K2201/042 , H05K2201/10015 , H05K2201/10166 , H05K2201/10272 , H05K2201/10303 , H05K2201/10318 , H05K2201/10409 , H05K2201/10871 , H05K2201/2036
Abstract: Die vorliegende Erfindung betrifft einen Umrichter (1), insbesondere mehrphasiger Drehstromumrichter, mit einem mindestens einen Leistungshalbleiter (7) aufweisenden Leistungsmodul (3) und einem Kühlkörper (21), wobei das Leistungsmodul (3) von einer Leiterplatte (6) gebildet sind, die mit einer den Leistungshalbleitern (7) gegenüberliegenden Seite an einem Kühlkörper (21) anliegt und mittels mindestens eines Befestigungsmittels (20a; 20b), insbesondere einer Verschraubung, mit dem Kühlkörper (21) in thermischen Kontakt bringbar und an dem Kühlkörper (21) befestigt ist. Zur Lösung der Aufgabe, einen derartigen Umrichter zur Verfügung zu stellen, bei dem mit geringem Bauaufwand ein vollflächiges Anliegen der Leiterplatte an dem Kühlkörper erzielt werden kann und ein verbesserter thermischer Kontakt der Leiterplatte mit dem Kühlkörper erzielbar ist, wird erfindungsgemäß vorgeschlagen, dass zur zusätzlichen Anpressung der Leiterplatte (6) an dem Kühlkörper (21) ein Druckrahmen (25) vorgesehen ist. Der Druckrahmen (25) steht gemäß einer bevorzugten Ausführungsform der Erfindung mit dem Umfang der Leiterplatte (6) in Wirkverbindung.
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公开(公告)号：EP2328390A2
公开(公告)日：2011-06-01
申请号：EP10014503.6
申请日：2010-11-11
Applicant: STILL GmbH
Inventor： Wilhoeft, Adolf , Schmidt, Niels , Schettgen, Nils Christoph
CPC classification number: H05K1/0203 , H01L2924/19041 , H02M7/003 , H05K1/05 , H05K3/0061 , H05K3/368 , H05K7/209 , H05K2201/042 , H05K2201/10015 , H05K2201/10166 , H05K2201/10272 , H05K2201/10303 , H05K2201/10318 , H05K2201/10409 , H05K2201/10871 , H05K2201/2036
Abstract: Die vorliegende Erfindung betrifft einen Umrichter (1), insbesondere mehrphasiger Drehstromumrichter, mit einem mindestens einen Leistungshalbleiter (7) aufweisenden Leistungsmodul (3) und einem Kühlkörper (21), wobei das Leistungsmodul (3) von einer Leiterplatte (6) gebildet sind, die mit einer den Leistungshalbleitern (7) gegenüberliegenden Seite an einem Kühlkörper (21) anliegt und mittels mindestens eines Befestigungsmittels (20a; 20b), insbesondere einer Verschraubung, mit dem Kühlkörper (21) in thermischen Kontakt bringbar und an dem Kühlkörper (21) befestigt ist. Zur Lösung der Aufgabe, einen derartigen Umrichter zur Verfügung zu stellen, bei dem mit geringem Bauaufwand ein vollflächiges Anliegen der Leiterplatte an dem Kühlkörper erzielt werden kann und ein verbesserter thermischer Kontakt der Leiterplatte mit dem Kühlkörper erzielbar ist, wird erfindungsgemäß vorgeschlagen, dass zur zusätzlichen Anpressung der Leiterplatte (6) an dem Kühlkörper (21) ein Druckrahmen (25) vorgesehen ist. Der Druckrahmen (25) steht gemäß einer bevorzugten Ausführungsform der Erfindung mit dem Umfang der Leiterplatte (6) in Wirkverbindung.
Abstract translation: 转换器（1）具有由设计为绝缘金属基板印刷电路板的印刷电路板（6）形成的电源模块（3）。 电路板搁置在具有与功率半导体（7）相对的一侧的冷却体（21）上。 电路板通过螺纹连接与本体热接触并固定在机体上。 提供压力框架（25），用于将电路板抵靠身体的附加压力。 板状板（4）和电路板通过表面安装的焊脚（10a，10b）电气和机械地互连。
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公开(公告)号：EP1924130A3
公开(公告)日：2010-11-17
申请号：EP08151537.1
申请日：1999-11-17
Applicant: IBIDEN CO., LTD.
Inventor： Ito, Hitoshi , Iwata, Yoshiyuki , Kawade, Masanori , Yazu, Hajime , Hirose, Naohiro
IPC: H05K1/11 , H01L23/498
CPC classification number: H01L23/49811 , H01L2224/05001 , H01L2224/05572 , H01L2224/1134 , H01L2224/13099 , H01L2924/00013 , H01L2924/01019 , H01L2924/01322 , H01L2924/15312 , H05K1/111 , H05K1/112 , H05K3/28 , H05K3/321 , H05K3/3421 , H05K3/384 , H05K3/4602 , H05K2201/09381 , H05K2201/09472 , H05K2201/09509 , H05K2201/096 , H05K2201/0979 , H05K2201/10318 , Y10T428/239
Abstract: A package substrate (231) incorporating a build-up substrate having at least one structure in which a conductor layer and interlayer resin insulating layer are alternately laminated such that a conductive connecting pin (110) for establishing the electrical connection with another substrate is secured to said build-up substrate. Said package substrate comprises a pad (16) for securing said conductive connecting pin (110), wherein said pad (16) is covered with an organic resin insulating layer (15) having an opening (18) and connected to an inner conductor layer through a via hole, and said conductive connecting pin (110) is secured to said pad exposed to the outside through the opening through a conductive adhesive agent (17) formed in the opening.
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70.发明公开LAMINATED MOUNTING STRUCTURE AND METHOD FOR MANUFACTURING LAMINATED MOUNTING STRUCTURE 有权层压安装结构和制造层压安装结构的方法
公开(公告)号：EP2194576A1
公开(公告)日：2010-06-09
申请号：EP08832607.9
申请日：2008-09-16
Applicant: Olympus Corporation
Inventor： NAKAMURA, Mikio , KONDO, Yu
IPC: H01L25/065 , H01L25/07 , H01L25/18 , H05K1/14
CPC classification number: H05K3/30 , H01L21/56 , H01L23/3121 , H01L24/19 , H01L25/0657 , H01L25/105 , H01L2224/04105 , H01L2224/12105 , H01L2224/274 , H01L2225/0652 , H01L2225/06541 , H01L2225/1023 , H01L2225/1035 , H01L2225/1058 , H01L2924/0002 , H01L2924/01079 , H05K1/144 , H05K3/284 , H05K3/3426 , H05K3/3436 , H05K3/368 , H05K2201/042 , H05K2201/10242 , H05K2201/10318 , H05K2203/025 , H05K2203/1316 , Y10T29/49117 , Y10T29/4913 , H01L2924/00
Abstract: There is provided a stacked mounting structure in which, it is possible to realize a narrowing of pitch and to secure a height which enables to mount components to be mounted, and a method of manufacturing stacked mounting structure.
The stacked mounting structure includes a plurality of members provided with a mounting area which is necessary for installing and operating components to be mounted on at least one principal surface, and an area for connections for signal transfer for operating the components to be mounted, and an electroconductive member which is disposed on the area for connections between the mutually facing members, and a cross section of the electroconductive member is same as or smaller than the area for connections, and an end portion of the electroconductive member is extended from a principal surface of one member up to a principal surface of the other member, and a height of the electroconductive member regulates a distance of the mounting area.Abstract translation: 提供了一种堆叠式安装结构，其中可以实现节距变窄并且确保能够安装待安装部件的高度，以及一种制造堆叠式安装结构的方法。 堆叠安装结构包括多个构件，该多个构件设置有用于安装和操作要被安装在至少一个主表面上的部件所需的安装区域以及用于操作待安装的部件的信号传输的连接区域以及 导电性构件，该导电性构件设置在相互面对的构件之间的连接区域上，并且导电性构件的截面与连接用面积相同或比其小，并且导电性构件的端部从 一个部件直到另一个部件的主表面，并且导电部件的高度调节安装区域的距离。
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