摘要:
A method for manufacturing a semiconductor device includes a step of forming a trench (2) in a surface of a semiconductor substrate (1) of a first conductivity type in a depth direction; a step of forming a conductive layer (4) in the trench, with a first insulating film (3a) interposed therebetween; a step of dividing the conductive layer into a gate electrode (4a) and an in-trench wiring layer (4b) which face each other in the trench and filling a gap between the gate electrode and the in-trench wiring layer with a second insulating film (3e); a step of introducing second-conductivity-type impurities into the entire surface of the semiconductor substrate to form a channel forming region (7) of a second conductivity type; and a step of selectively forming a main electrode region (8) of the first conductivity type in a portion of the channel forming region which is provided along an opening portion of the trench so as to come into contact with the opening portion.
摘要:
Three tubular bodies (2-4) having different lengths and diameters are inserted and connected to each other by pins so that they project over the edges (7) of the next larger tubular body. The pins are inserted by press-fitting through the holes of the tubular bodies and are secured by their hooks. The length of the multi-walled placeholder (1) is adjusted by pushing the tubular bodies along the longitudinal axis when the pins are removed. The tubular bodies have uniformly arranged hexagonal openings at their jacket surface that define a honeycomb structure. An independent claim is included for the method of producing a multi-walled placeholder.
摘要:
Disclosed herein is a GaN-based transistor including source electrodes (72), first switch semiconductor layers (40) of a first conductivity type formed under the respective source electrodes, second switch semiconductor layers (50) of a second conductivity type formed under the respective first switch semiconductor layers, third switch semiconductor layers (60) of the first conductivity type configured to surround lower parts of the second switch semiconductor layers and sides of the first switch semiconductor layers and the second switch semiconductor layers, gates (75, 76) each having vertical faces or inclined faces in which a channel is formed on sides of the first switch semiconductor layer and the second switch semiconductor layer, gate insulating layers (74) formed under the gates, and a drain electrode (20) electrically coupled to the source electrodes along a flow of charges in a vertical direction that passes through the channels.
摘要:
The present invention relates to an electrochemically-gated field-effect transistor (FET) in which the channel length is independent from the printing resolution. The FET comprises an arrangement (11) placed on top of a substrate (10) which consists of a first electrode (1), a second electrode (2) and a transistor channel (4), located between the two electrodes (1, 2), an electrolyte (5), covering the transistor channel (4) completely, and a gate electrode (3). The first electrode (1), comprising a first solid or porous metallic conducting body, is placed on top of the substrate (10). The transistor channel (4), comprising a porous semiconducting material, is placed on top of the first electrode (1), partially covering the first electrode (1). The second electrode (2), comprising a second solid or porous metallic conducting body, is placed on top of the transistor channel (4) which is placed on top of the first electrode (1), at least partially covering the transistor channel (4). The electrolyte (5) penetrates at least through the transistor channel (4) down to the first electrode (1) while leaving a part of each electrode (1, 2) uncovered. The gate electrode (3), comprising a third solid or porous metallic conducting body, is placed in contact with the electrolyte (5) but without any contact to the arrangement (11).
摘要:
A semiconductor device comprises a first insulating film provided over a substrate and heat-treated, a second insulating film provided over the first insulating film, and a semiconductor film provided over the second insulating film, the second insulating film and the semiconductor film being formed successively without exposing them to the atmosphere.
摘要:
L'invention concerne un transistor MOS comprenant, au-dessus d'un isolant de grille (4), un empilement conducteur de grille (6-7) ayant une hauteur, une longueur et une largeur, cet empilement ayant une partie basse (6) voisine de l'isolant de grille et une partie haute (7 ; 27 ; 50), dans lequel ledit empilement a une première longueur (L1) dans sa partie basse, et une deuxième longueur (L2) inférieure à la première longueur dans sa partie haute.
摘要:
The present invention discloses an array substrate, a method for fabricating an array substrate, and a display device, the array substrate includes: a base substrate; a TFT, a gate line, a data line and a pixel electrode formed on the base substrate, the TFT includes: a bottom gate, a first gate insulating layer, an active layer, a second gate insulating layer, a top gate, a gate isolation layer and a source electrode and a drain electrode sequentially formed on the base substrate; wherein, the source electrode and the drain electrode are in contact with the active layer through a first via hole and a second via hole passing through the gate isolation layer and the second insulating layer, respectively; the pixel electrode is in contact with the drain electrode. The present invention can form inversion layers at both upper and lower surfaces at the same time in a situation where a proper silicon film is selected, carrier concentrations in the inversion layers at both upper and lower surfaces increase rapidly with increase of gate voltage in a situation where the silicon film is fully depleted, and driving ability, and sub-threshold and frequency response characteristics of the array substrate are closer to an ideal state.
摘要:
A transistor with superior electric characteristics is manufactured. An oxide insulating film is formed over a substrate, an oxide semiconductor film is formed over the oxide insulating film, heat treatment is then conducted at a temperature at which hydrogen contained in the oxide semiconductor film is desorbed and part of oxygen contained in the oxide insulating film is desorbed, then the heated oxide semiconductor film is etched into a predetermined shape to form an island-shaped oxide semiconductor film, a pair of electrodes is formed over the island-shaped oxide semiconductor film, a gate insulating film is formed over the pair of electrodes and the island-shaped oxide semiconductor film, and a gate electrode is formed over the gate insulating film.
摘要:
Embodiments of the present invention provide a thin film transistor and its manufacturing method, an array substrate and a display device, to improve the electrical performance of the thin film transistor and improve the picture quality of images displayed by the display device. The thin film transistor includes: a substrate; a gate, a source, a drain and a semiconductor layer formed on the substrate; a first gate protection layer; a gate isolation layer; and a second gate protection layer. The first gate protection layer is at least partly located between the gate and the semiconductor layer, and is an insulating layer. The gate isolation layer is at least partly located between the first gate protection layer and the second gate protection layer, and is a conductive layer. The second gate protection layer is at least partly located between the gate isolation layer and the semiconductor layer, and is an insulating layer.