Abstract:
A controller for measuring the concentration of consumable ingredients in a plating solution characterized by the use of a plating poison introduced into the analysate stream to prevent autocatalytic decomposition and deposition of copper onto the walls and sensors of the controller.
Abstract:
An electroless nickel plating composition characterized by the addition of a polymer formed from a 2-acrylamido or 2-methacrylamido alkyl sulfonic acid monomer. The polymer additive increases the rate of deposition from solution, and to a minor extent, improves the appearance of a nickel deposited from the solution.
Abstract:
An aqueous metal ion-free developer composition for developing photoresists comprising a metal ion-free alkali and a metal ion-free surfactant that is quaternary ammonium compound. The developer permits a reduction of from 40-50% in the energy necessary to expose the photoresist without deleterious effect on image quality and image resolution.
Abstract:
A novel stripping composition and method of using same is disclosed, which stripping composition comprises:
a) a solvent comprising one or more compounds of formula (I) wherein R and R' are each selected independently from straight and branched alkyl having 1 to 3 carbon atoms, and phenyl, each of which phenyl is optionally substituted with one or more hydroxyl, or R and R' together are alkylene of 3 to 6 carbon atoms; and b) a suitable organosulfonic acid.
The stripping composition is especially useful for stripping positive photoresists faster and at lower temperatures than known strippers. A preferred composition comprises 10% by weight para-toluene sulfonic acid in dimethyl sulfoxide.