公开(公告)号：EP2581220A4

公开(公告)日：2014-05-14

申请号：EP11806591

申请日：2011-06-16

Applicant: JX NIPPON MINING & METALS CORP

Inventor： KAMMURI KAZUKI

IPC: B32B15/08 ,  H05K1/02

CPC classification number: H05K3/022 ,  B32B15/08 ,  B32B15/085 ,  B32B15/09 ,  B32B15/20 ,  B32B2457/08 ,  H05K1/0393 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0358 ,  Y10T428/31678

公开(公告)号：EP2678156A1

公开(公告)日：2014-01-01

申请号：EP12716772.4

申请日：2012-02-24

Applicant: Isola USA Corp.

Inventor： SCHUMACHER, Johann, R. ,  SCHULTZ, Steven, M. ,  WILSON, Stanley, E. ,  AMLA, Tarun

IPC: B32B15/08 ,  B32B15/14 ,  H05K1/03

CPC classification number: B32B15/14 ,  B32B5/024 ,  B32B15/20 ,  B32B2038/0076 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2309/105 ,  B32B2311/12 ,  B32B2315/085 ,  B32B2457/08 ,  H05K1/0366 ,  H05K3/022 ,  H05K2201/029 ,  H05K2201/0358 ,  H05K2203/1545 ,  Y10T428/24975

Abstract: Ultrathin copper clad laminates including a fabric sheet material layer having a first planar surface, a second planar surface and an original thickness of from about 10 to about 30 microns and at least one copper foil sheet that is adhered to a planar surface of the fabric sheet material by a cured resin wherein the base laminate has a thickness of from about 1.0 to about 1.75 mils.

Abstract translation: 超薄铜箔层压板包括具有第一平表面，第二平面表面和约10至约30微米的原始厚度的织物片材层，以及粘附到织物片的平坦表面上的至少一个铜箔片 材料通过固化树脂，其中基底层压板具有约1.0至约1.75密耳的厚度。

公开(公告)号：EP2671920A1

公开(公告)日：2013-12-11

申请号：EP12741911.7

申请日：2012-01-31

Applicant: DIC Corporation

Inventor： MURAKAMI, Kouichi ,  ICHINOSE, Eijyu ,  MIYAGAKI, Atsushi ,  MIHARA, Takashi ,  HAZAMA, Masaki

IPC: C08L63/00 ,  C08G59/40 ,  C08K5/53 ,  C08L79/08 ,  C09J11/06 ,  C09J163/00 ,  C09J179/08 ,  H05K1/03

CPC classification number: C09J179/08 ,  C08G59/4042 ,  C08G73/1035 ,  C08G73/1042 ,  C08G73/14 ,  C08K5/0066 ,  C08K5/5313 ,  C08L63/00 ,  C08L79/08 ,  C08L79/085 ,  C08L2205/02 ,  C09J7/35 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  C09J2479/08 ,  H05K3/022 ,  H05K3/386 ,  H05K3/4652 ,  H05K2201/012 ,  H05K2201/0154 ,  H05K2201/0358 ,  Y10T428/2887

Abstract: There is provided a thermosetting polyimide resin composition which enables production of a cured product exhibiting excellent dimensional stability and which exhibits excellent meltability at low temperature in a semicured state (in the B-stage) and excellent flame resistance in a completely cured state; there are also provided a cured product of such a composition and an interlaminar adhesive film used for a printed wiring board, the interlaminar adhesive film being formed of the composition. In particular, there are provided a thermosetting polyimide resin composition containing a thermosetting polyimide resin (A) having a biphenyl backbone directly linked to a nitrogen atom of a five-membered cyclic imide backbone and a weight-average molecular weight (Mw) of 3,000 to 150,000, a phosphorus compound (B) represented by specific Formula (bl) or (b2), and an epoxy resin (C); a cured product of such a composition; and an interlaminar adhesive film used for a printed wiring board, the interlaminar adhesive film including a layer formed of the composition, the layer being formed on a carrier film.

Abstract translation: 本发明提供能够制造的固化物表现出优异的尺寸稳定性的热固性聚酰亚胺树脂组合物，并且其表现出在低温下在半固化状态下在完全呼叫固化状态优异熔融性（在B阶段）和优异的阻燃性; 所以，提供有一种组合物和层间搜索的粘合剂的固化物薄膜用于印刷布线板，该组合物的层间粘接膜形成的存在。 特别地，提供了包含具有联苯骨架直接连接到一个五元环状酰亚胺骨架的氮原子和3000的重均分子量（Mw）与热固性聚酰亚胺树脂（A）热固性聚酰亚胺树脂组合物 150,000，由特定式（BL）或（B2）表示的磷化合物（B），以及环氧树脂（C）; 测试的组合物的固化产物; 并且层间粘接膜，用于印刷电路板中，层间粘接膜的，包括形成组合物的层，所述层形成在载体成膜。

公开(公告)号：EP2204079B1

公开(公告)日：2013-05-01

申请号：EP08843006.1

申请日：2008-10-23

Applicant: E. I. du Pont de Nemours and Company

Inventor： INNOCENZO, Jeffrey, Glenn ,  LIN, Pui-Yan ,  OLIVER, Richard, C. ,  RAJENDRAN, Govindasamy, Paramasivam ,  ZAHR, George, Elias

IPC: H05K1/03 ,  H05K3/46

CPC classification number: H05K3/4673 ,  H05K3/4652 ,  H05K3/4655 ,  H05K3/4661 ,  H05K2201/0209 ,  H05K2201/0269 ,  H05K2201/0358 ,  H05K2201/068 ,  Y10T428/25 ,  Y10T428/31511

公开(公告)号：EP2571342A1

公开(公告)日：2013-03-20

申请号：EP11780455.9

申请日：2011-04-06

Applicant: Denki Kagaku Kogyo Kabushiki Kaisha

Inventor： NISHI Taiki ,  MIYAKAWA Takeshi ,  YASHIMA Katsunori ,  Okoshi Kensuke ,  ISHIKURA Hidenori

IPC: H05K3/44

CPC classification number: H05K1/056 ,  H05K3/022 ,  H05K2201/0209 ,  H05K2201/0358 ,  H05K2203/1545 ,  Y10T156/10 ,  Y10T156/1052 ,  Y10T156/1062

Abstract: Provided are a method of manufacturing a high-quality and high-heat-dissipation metal-base substrate that contains no void remaining in the insulative adhesive layer for mounting heat-generating electronic parts and also a method of manufacturing a circuit board.
A metal-base substrate 14 is prepared by processing in a dispersing step S1 of dispersing a disperse phase in an insulative adhesive-dispersing medium containing a wetting dispersant, an insulative adhesive-laminating step S2 of laminating the insulative adhesive 2 on a conductor foil 1 as feeding the roll-shaped conductor foil 1, a first curing step S3 of heating the insulative adhesive 2 on the conductor foil 1 and thus forming a composite 5 of the conductor foil 1 and the insulative adhesive layer 2a in the B stage state, a metal-based material-laminating step S5 of laminating a metal-based material 6 on the insulative adhesive layer 2a in the B stage state and thus forming a laminate 7, and a second curing step S6 of converting the insulative adhesive layer 2a in the B stage state into an insulative adhesive layer 2b in the C stage state by heat pressurization of the laminate 7 under a particular condition. The composite 5 or the laminate 7 is also processed, as needed, in a sheet-cutting step S4 or S 15 of cutting it into sheet-shaped articles.

公开(公告)号：EP2100987A4

公开(公告)日：2012-12-26

申请号：EP07830832

申请日：2007-10-30

Applicant: MITSUI MINING & SMELTING CO

Inventor： MATSUNAGA TETSUHIRO ,  MATSUSHIMA TOSHIFUMI ,  SATO TETSURO

IPC: C23C28/00 ,  B32B15/08 ,  C25D5/10 ,  C25D7/06 ,  H05K1/09

CPC classification number: H05K3/384 ,  C25D5/12 ,  C25D5/34 ,  C25D5/48 ,  C25D5/50 ,  C25D5/56 ,  C25D7/12 ,  H05K3/386 ,  H05K3/389 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/072 ,  H05K2203/0723 ,  Y10T428/265 ,  Y10T428/27

公开(公告)号：EP2282622A1

公开(公告)日：2011-02-09

申请号：EP09754687.3

申请日：2009-05-26

Applicant: Mitsui Mining & Smelting Co., Ltd

Inventor： SATO, Tetsuro ,  MATSUSHIMA, Toshifumi ,  SHIRAI, Takeshi

IPC: H05K3/46 ,  C08G59/20 ,  C08L63/00 ,  C08L79/08 ,  H05K1/03 ,  H05K3/38

CPC classification number: C09J163/00 ,  C08G73/14 ,  C08L63/00 ,  C08L79/08 ,  C08L2203/20 ,  C08L2666/20 ,  C08L2666/22 ,  C09J179/08 ,  H05K1/0393 ,  H05K3/386 ,  H05K3/4635 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/012 ,  H05K2201/0154 ,  H05K2201/0358

Abstract: An object of the present invention is to enable formation of a resin layer which reduces the thickness of a multilayered flexible printed wiring board without causing problems in the process of multilayer forming, and is excellent in flexibility. To achieve the object, a resin compound for forming an adhesive layer of a multilayered flexible printed wiring board which is used for formation of an adhesive layer for bonding an outer layer of a printed wiring board onto a surface of an inner layer flexible printed wiring board, the resin compound is made to comprise components A (an epoxy resin composed of one or more selected from the group consisting of bisphenol epoxy resins of which epoxy equivalents are 200 or less and are liquid at room temperature), B (an epoxy resin performing high thermal resistance), C (a phosphorus-containing flame-retardant epoxy resin), D (a rubber-modified polyamide-imide resin, the resin having the property of being soluble in a solvent having a boiling point in the range of 50 to 200°C), and E (a resin curing agent composed of one or more selected from the group consisting of biphenyl type phenol resin and a phenol aralkyl type phenol resin) and a resin-coated copper foil and the like in which the resin layer is formed by using the resin compound is used.

Abstract translation: 本发明的目的是能够形成多层柔性印刷电路板的厚度降低的树脂层，而不会在多层形成过程中引起问题，并且柔性优异。 为了实现该目的，用于形成多层柔性印刷线路板的粘合剂层的树脂化合物，其用于形成用于将印刷线路板的外层粘合到内层柔性印刷线路板的表面上的粘合剂层 树脂化合物被制成包含成分A（由环氧当量为200以下的双酚环氧树脂，室温下为液体的一种以上组成的环氧树脂），B（环氧树脂， 高耐热性），C（含磷阻燃性环氧树脂），D（橡胶改性聚酰胺酰亚胺树脂，具有溶于沸点在50〜 200℃）和E（由联苯型酚醛树脂和苯酚芳烷基型酚醛树脂组成的组中的一种以上组成的树脂固化剂）和树脂被覆铜箔等，其中， 使用树脂化合物形成树脂层。

公开(公告)号：EP2237898A1

公开(公告)日：2010-10-13

申请号：EP10713555.0

申请日：2010-02-19

Applicant: ATOTECH Deutschland GmbH

Inventor： BRUDERER, Alex ,  HERBERT, Jürgen ,  HUNZIKER, Max ,  PROBST, Michel

IPC: B05D1/30 ,  B05D3/00

CPC classification number: B05C19/04 ,  B05C9/12 ,  B05C9/14 ,  B05C19/02 ,  B05C19/06 ,  B05D1/30 ,  B05D3/007 ,  B05D3/0254 ,  B05D2401/32 ,  H05K3/022 ,  H05K2201/0358 ,  H05K2203/1355 ,  H05K2203/1545

Abstract: The invention relates to a method for producing a plastic coating with a thickness of less than 200μm on the upper face of a substrate, said method comprising the following steps: application of a plastic powder to the upper face of the substrate by means of a powder spray unit; subsequent cleaning of the underside of the substrate; subsequent melting of the applied powder in an oven, forming the plastic coating on the substrate; and cooling of the substrate, the latter being continuously transported from method step to method step.

公开(公告)号：EP2175706A1

公开(公告)日：2010-04-14

申请号：EP08791641.7

申请日：2008-07-25

Applicant: Zeon Corporation

Inventor： KOJIMA, Kiyoshige ,  KODEMURA, Junji

IPC: H05K3/46

CPC classification number: H05K3/4655 ,  H05K3/386 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0358 ,  H05K2203/1105 ,  H05K2203/1476 ,  Y10T428/2848

Abstract: A crosslinkable and polymerizable composition containing a monomer and a cross-linking agent is applied onto a metal foil to form a coated film of the composition, and heat is applied to the coated film to firstly bulk polymerize the entire coated film of the crosslinkable and polymerizable composition. Then, by applying heat to the coated film from the metal foil side, cooling a surface far from the metal foil as needed, and subjecting a limited region adjacent to the metal foil in the thickness direction of the coated film to a cross-linking reaction, a composite for multilayer circuit board is obtained, in which the metal foil layer, a hard resin layer containing a hard resin obtained by bulk polymerization reaction and cross-linking reaction, and an adhesive resin layer containing an adhesive resin obtained by bulk polymerization reaction are laminated in this order.

Abstract translation: 将含有单体和交联剂的交联性和可聚合组合物施加到金属箔上以形成组合物的涂膜，并将热量施加到涂膜上，首先将可交联和可聚合的整个涂膜 组成。 然后，通过从金属箔侧向涂膜施加热量，根据需要对远离金属箔的表面进行冷却，并且使与金属箔相邻的金属箔沿着涂膜厚度方向的有限区域进行交联反应 得到金属箔层，含有通过本体聚合反应和交联反应得到的硬质树脂的硬质树脂层和含有通过本体聚合反应得到的粘合性树脂的粘合性树脂层的多层电路板用复合体 按顺序层压。

公开(公告)号：EP1905133A2

公开(公告)日：2008-04-02

申请号：EP06766113.2

申请日：2006-07-03

Applicant: Ostrovsky, Valery ,  C.L.P. Industries Ltd.

Inventor： Ostrovsky, Valery ,  C.L.P. Industries Ltd.

IPC: H01R13/514

CPC classification number: H05K3/386 ,  B32B15/085 ,  B32B15/20 ,  B32B27/08 ,  B32B27/18 ,  B32B27/32 ,  B32B37/153 ,  B32B2250/40 ,  B32B2264/102 ,  B32B2311/12 ,  B32B2323/10 ,  B32B2457/08 ,  H05K1/032 ,  H05K3/022 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0143 ,  H05K2203/0759 ,  H05K2203/1545 ,  Y10T428/264 ,  Y10T428/265 ,  Y10T428/269 ,  Y10T428/31692

Abstract: The invention provides a low energy loss, multi-layered polypropylene/metal foil product useful for further processing into printed circuit boards and antenna boards for microwave circuitry. A continuous process for manufacturing the product comprises the steps of: providing metal foil; optionally, extrusion coating molten polypropylene upon the metal foil to obtain a foil coated with a polypropylene foundation layer; unwinding the foil from an unwinding station (10) to an oven (30) before casting a molten polypropylene tie-layer upon the metal foil or the coated foil using extrusion lamination machinery such as a slot die (40) extruder (50); laminating a polypropylene sheet from unwinding station (18) on the tie-layer using compression between rollers (14),(16) in the heated nip area (12) to ensure fusing of the polypropylene layers; and rewinding the multi-layered product on a rewinding station (18). In the process, heat may be applied in one of several ways to induce fusing.