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1.发明公开公开(公告)号：EP2525398A1
公开(公告)日：2012-11-21
申请号：EP11732925.0
申请日：2011-01-13
Applicant: Kyocera Corporation
Inventor： ISHIMINE,Yuusaku , MORIYAMA,Masayuki , KOMATSUBARA,Kenji
CPC classification number: H01L23/13 , C04B35/587 , C04B37/026 , C04B2235/3206 , C04B2235/3217 , C04B2235/3224 , C04B2235/3878 , C04B2235/3882 , C04B2235/5276 , C04B2235/5436 , C04B2235/5445 , C04B2235/604 , C04B2235/6581 , C04B2235/6582 , C04B2235/6587 , C04B2235/721 , C04B2235/723 , C04B2235/77 , C04B2235/786 , C04B2235/80 , C04B2235/945 , C04B2235/9607 , C04B2237/125 , C04B2237/368 , C04B2237/407 , C04B2237/74 , H01L23/15 , H01L23/3731 , H01L23/3735 , H01L35/32 , H01L2924/0002 , H05K1/0306 , H05K3/38 , H05K2201/0248 , H05K2201/0266 , H05K2201/0269 , Y10T428/24413 , Y10T428/24421 , Y10T428/25 , Y10T428/259 , H01L2924/00
Abstract: Provided is a silicon nitride substrate capable of enhancing the bond strength when a member made of a metal is bonded to the substrate, and a circuit substrate and an electronic device capable of improving reliability by using the silicon nitride substrate. The silicon nitride substrate 1 comprises a substrate 1a comprising a silicon nitride sintered body, and a plurality of granular bodies 1b containing silicon and integrated to a principal surface of the substrate 1a, wherein a plurality of needle crystals 1c or column crystals 1d comprising mainly silicon nitride are extended from a portion of the granular bodies 1b. A brazing material is applied to a principal surface of the substrate 1a, and a circuit member and a heat radiation member are arranged on the applied brazing material, and bonded by heating. Because of a plurality of granular bodies 1b integrated to the principal surface of the substrate 1a, and a plurality of the needle crystals 1c or the column crystals 1d extended from a portion of the granular bodies 1b, a high anchor effect is produced so that the circuit member and the heat radiation member are firmly bonded to the silicon nitride substrate 1.
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2.发明公开ADHESIVE FOR ELECTROLESS PLATING, FEEDSTOCK COMPOSITION FOR PREPARING ADHESIVE FOR ELECTROLESS PLATING, AND PRINTED WIRING BOARD 失效粘合剂的无电解电镀，输出合成FOR胶粘剂的无电解电镀用的生产，和印刷电路板
公开(公告)号：EP1005261A4
公开(公告)日：2000-11-15
申请号：EP98914031
申请日：1998-04-15
Applicant: IBIDEN CO LTD
Inventor： ASAI MOTOO , ONO YOSHITAKA , KAWADE MASATO , NODA KOUTA , NISHIWAKI YOUKO
CPC classification number: H05K3/4676 , C23C18/1608 , C23C18/1651 , C23C18/1653 , C23C18/1844 , C23C18/24 , C23C18/405 , C23C18/50 , C23C18/54 , H05K3/4673 , H05K2201/0212 , H05K2201/0269 , H05K2203/0773 , Y10S428/901 , Y10T428/24893 , Y10T428/24917
Abstract: An adhesive for electroless plating which is advantageous for ensuring the reliability of insulation between lines and between layers while maintaining the practical peeling strength. The adhesive comprises an uncured heat-resistant resin matrix which becomes difficultly soluble in acid or oxidant when cured and cured heat-resistant resin particles which are soluble in acid or oxidant and dispersed in the matrix. The adhesive is characterized in that the average particle diameter of the heat-resistant resin particles is not larger than 1.5 mu m.
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公开(公告)号：EP0589813B1
公开(公告)日：1995-11-29
申请号：EP93480118.4
申请日：1993-08-24
Applicant: International Business Machines Corporation
CPC classification number: H05K3/4061 , H01L21/486 , H01L23/49827 , H01L23/5384 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K3/4611 , H05K3/4629 , H05K2201/0269 , H05K2201/096 , H01L2924/00
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公开(公告)号：EP3305853A1
公开(公告)日：2018-04-11
申请号：EP16803481.7
申请日：2016-06-02
Applicant: Asahi Kasei Kabushiki Kaisha
Inventor： OOI, Hirotaka , OHNO, Eiichi
IPC: C08L71/02 , C08K3/08 , C08K3/22 , C09D5/24 , C09D17/00 , C09D201/00 , H01B1/22 , H01B13/00 , H05K1/09 , H05K3/12 , H01B5/14
CPC classification number: C09D5/24 , B22F1/0022 , C08F8/00 , C08K3/08 , C08K3/22 , C08K2003/0806 , C08K2003/2248 , C08K2201/001 , C08K2201/005 , C08K2201/011 , C08L71/02 , C09D7/40 , C09D7/45 , C09D7/67 , C09D7/68 , C09D17/00 , C09D171/02 , C09D201/00 , H01B1/22 , H01B5/14 , H01B13/00 , H01B13/0036 , H05K1/092 , H05K1/097 , H05K3/1283 , H05K2201/0269
Abstract: A dispersion which contains a dispersant and particles selected from among metal particles and metal oxide particles, and which is characterized in that: the dispersant has a chemical structure that is able to be bonded or adsorbed to the particles; and the dispersant contains a low-molecular-weight dispersant that has at least one peak within a molecular weight region of 31 or more but less than 1,000 in the molecular weight distribution curve in terms of polyethylene glycol as determined by gel permeation chromatography and a high-molecular-weight dispersant that has at least one peak within a molecular weight region of 1,000 or more but 40,000 or less in the above-described molecular weight distribution curve.
Abstract translation: 一种含有分散剂和选自金属颗粒和金属氧化物颗粒的颗粒的分散体，其特征在于：分散剂具有能够与颗粒结合或吸附的化学结构; 并且分散剂含有低分子量分散剂，所述低分子量分散剂在通过凝胶渗透色谱法测定的聚乙二醇方面在分子量分布曲线中具有在31或更大但小于1,000的分子量范围内的至少一个峰， 在上述分子量分布曲线中在分子量区域中具有至少一个在1,000以上至40,000以下的峰值的分子量分散剂。
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公开(公告)号：EP3166372A1
公开(公告)日：2017-05-10
申请号：EP15821293.6
申请日：2015-07-10
Applicant: Material Concept, Inc.
Inventor： KOIKE, Junichi , ANDO, Daisuke , SUTOU, Yuji
IPC: H05K3/38 , H01G2/06 , H05K1/09 , H01L31/0224
CPC classification number: H05K1/09 , H01G2/06 , H01G4/008 , H05K1/0306 , H05K1/092 , H05K1/11 , H05K3/10 , H05K3/388 , H05K3/389 , H05K3/4007 , H05K2201/0269 , H05K2201/0272 , H05K2203/086 , H05K2203/087
Abstract: To provide: an electronic component which comprises a copper electrode on an inorganic material substrate and wherein the adhesion strength between the substrate and the copper electrode is high, thereby achieving improved adhesion of the copper electrode; and a method for manufacturing this electronic component. An electronic component which comprises a copper electrode on an inorganic material substrate and wherein an interface layer containing copper, manganese, silicon and oxygen is provided at the interface between the substrate and the copper electrode, and the interface layer contains crystal grains that are mainly formed of copper and dispersed in the interface layer. A method for manufacturing this electronic component comprises: an interface layer formation step for forming an interface layer on the substrate; and an electrode formation step for forming the copper electrode on the interface layer.
Abstract translation: 本发明提供一种电子部件，该电子部件在无机材料基板上具有铜电极，该基板与铜电极之间的密合强度高，能够提高铜电极的密合性。 以及该电子部件的制造方法。 一种电子部件，在无机材料基板上具有铜电极，在基板和铜电极的界面设置含有铜，锰，硅和氧的界面层，界面层含有主要形成的晶粒 的铜并分散在界面层中。 该电子部件的制造方法包括：界面层形成工序，在基板上形成界面层; 以及用于在界面层上形成铜电极的电极形成步骤。
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6.发明公开
公开(公告)号：EP2745657A4
公开(公告)日：2015-04-29
申请号：EP12825349
申请日：2012-08-16
Applicant: FUJIFILM CORP
Inventor： KASAI SEISHI
CPC classification number: C09D11/52 , B41M5/0023 , H05K1/097 , H05K3/125 , H05K2201/0269 , H05K2203/1476
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7.发明公开CIRCUIT BOARD AND ELECTRONIC APPARATUS PROVIDED WITH SAME 审中-公开LELERPLATTE UND ELEKTRONISCHE VORRICHTUNG DAMIT
公开(公告)号：EP2773169A1
公开(公告)日：2014-09-03
申请号：EP12842736.6
申请日：2012-09-28
Applicant: Kyocera Corporation
Inventor： NAKAMURA,Kiyotaka , OHASHI,Yoshio , SHIKATA,Kunihide
CPC classification number: H05K1/09 , C04B41/009 , C04B41/52 , C04B41/90 , C04B2111/00405 , C04B2111/00844 , H01L23/15 , H01L23/3731 , H01L23/3735 , H01L23/3736 , H01L2924/0002 , H05K1/0306 , H05K1/092 , H05K3/245 , H05K3/38 , H05K2201/0269 , H05K2201/0338 , H05K2201/035 , H05K2203/1126 , C04B35/00 , C04B35/10 , C04B35/185 , C04B35/48 , C04B35/581 , C04B35/584 , C04B41/4539 , C04B41/4572 , C04B41/5022 , C04B41/5127 , C04B41/5116 , C04B41/522 , C04B41/5155 , H01L2924/00
Abstract: [Object] To provide a circuit board having good heat dissipation characteristics capable of promptly dissipating the heat generated by a metal wiring layer on the basis of operations of an electronic component and exhibiting high reliability enabling a long term of use by improving the adhesion strength between a ceramic sintered body and a metal wiring layer and, thereby, reducing peeling of the metal wiring layer due to cooling/heating cycles when operation and non-operation of the electronic component are repeated, and an electronic apparatus in which an electronic component is mounted on the circuit board.
[Solution] A circuit board is provided with a metal wiring layer 12 on at least one principal surface of a ceramic sintered body 11, wherein the above-described metal wiring layer includes a first region 12a which is in contact with the principal surface and which contains a glass component and a second region 12b which is located on the first region 12a and which does not contain a glass component, the thickness of the first region 12a is 35% or more and 70% or less of the thickness of the metal wiring layer 12, and the average grain size in the first region 12b is smaller than the average grain size in the second region 12b.Abstract translation: 本发明提供一种具有良好的散热特性的电路板，其能够基于电子部件的操作迅速地消散由金属布线层产生的热量，并且具有高的可靠性，能够长期使用，从而提高第 陶瓷烧结体和金属布线层，并且由此在电子部件的操作和不操作被重复时由于冷却/加热循环而减少金属布线层的剥离;以及电子装置，其中安装电子部件 在电路板上。 电路板在陶瓷烧结体11的至少一个主面上设置有金属布线层12，其中上述金属布线层包括与主面接触的第一区域12a， 包含位于第一区域12a上并且不含有玻璃成分的玻璃成分和第二区域12b，第一区域12a的厚度为金属布线的厚度的35％以上且70％以下 层12，第一区域12b的平均粒径小于第二区域12b的平均粒径。
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8.发明公开
公开(公告)号：EP2745657A1
公开(公告)日：2014-06-25
申请号：EP12825349.9
申请日：2012-08-16
Applicant: Fujifilm Corporation
Inventor： KASAI, Seishi
CPC classification number: C09D11/52 , B41M5/0023 , H05K1/097 , H05K3/125 , H05K2201/0269 , H05K2203/1476
Abstract: A forming method of a conductive pattern including a base material and a pattern of a composition gradient layer in which the composition continuously changes from a metal to a resin in a thickness direction from the farthest side to the base material toward the nearest side to the base material, includes: ejecting at least two kinds of ink compositions of an ink composition containing a metal and an ink composition containing a compound capable of being cured with active energy ray, or a polymer or oligomer, onto the base material by an inkjet method to fabricate the composition gradient layer.
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公开(公告)号：EP2204079B1
公开(公告)日：2013-05-01
申请号：EP08843006.1
申请日：2008-10-23
Applicant: E. I. du Pont de Nemours and Company
Inventor： INNOCENZO, Jeffrey, Glenn , LIN, Pui-Yan , OLIVER, Richard, C. , RAJENDRAN, Govindasamy, Paramasivam , ZAHR, George, Elias
CPC classification number: H05K3/4673 , H05K3/4652 , H05K3/4655 , H05K3/4661 , H05K2201/0209 , H05K2201/0269 , H05K2201/0358 , H05K2201/068 , Y10T428/25 , Y10T428/31511
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公开(公告)号：EP2928080B1
公开(公告)日：2018-11-28
申请号：EP15161767.7
申请日：2015-03-30
Applicant: TPK Universal Solutions Limited
Inventor： Kao, Kuo-Feng , Huang, Sung-Chien , Leong, Wee-Hong , Wu, Shiang-Ting
CPC classification number: G06F3/044 , C09J9/02 , H03K17/962 , H03K2217/94094 , H03K2217/960755 , H05K3/323 , H05K3/361 , H05K2201/0269
Abstract: A capacitive touch-sensitive device includes a sensor electrode layer, a signal trace layer, a flexible circuit board and an electrically-conductive adhesive layer. The sensor electrode layer includes electrically isolated sensor lines. The signal trace layer includes electrically isolated signal lines, each having an outer terminal portion coupled to a respective one of the sensor lines. The flexible circuit board has isolated mutually bonding pads, each corresponding to the outer terminal portion. The electrically-conductive adhesive layer includes a plurality of zones, each having a first adhesive matrix and first conductors dispersed therein. The first conductors bridge the outer terminal portion to the bonding pad.
