公开(公告)号：EP0838136A1

公开(公告)日：1998-04-29

申请号：EP96914834.0

申请日：1996-05-28

Applicant: Optiprint AG

Inventor： ETTER, Kurt

IPC: H05K3 ,  H05K7 ,  H05K9

CPC classification number: H05K7/205 ,  H05K3/0061 ,  H05K3/321 ,  H05K7/20509 ,  H05K9/0039 ,  H05K2201/0373

Abstract: A conductive connection with a first and a second conductive layer (1, 2) provides for the electrical and mechanical connection of spatially separate connection regions. Thus, the juts (4) from at least one conductive layer (2), which are preferably arranged in a grid, establish the conductive connection between the layers (1, 2) through their contact with the surface of the opposite conductive layer. For the mechanical connection at least one partial layer is formed between the juts (4) as a bonding layer (3). Conductive connections as per the invention are used preferably to enlarge the earthing layer in high-frequency switches. Thus, the first conductive layer (1) is mounted on the back side of a carrier plate (10) and connected on its side opposite the carrier plate (10) to a second conductive layer (2) of great thickness.

公开(公告)号：EP0831682A1

公开(公告)日：1998-03-25

申请号：EP97114008.2

申请日：1997-08-13

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： Bandmann, Joachim ,  Cohaupt, Ulrich ,  Holtkamp, Klaus ,  Redwitz, Klaus

IPC: H05K1/11

CPC classification number: H05K3/246 ,  H05K1/117 ,  H05K2201/0373 ,  H05K2203/044

Abstract: Die Leiterplatte (1) weist an mindestens einem ihrer Randbereiche (4) Kontaktflächen (2) auf, die mit einzelnen Leiterbahnen (3) verbunden sind. Sie dienen dazu, mit einem Gegenkontakt zu kontaktieren. Jede Kontaktfläche (2) ist in mehrere miteinander verbundene Teilflächen (5) strukturiert. Vorzugsweise ist eine kammartige Strukturierung vorgesehen. Damit wird erreicht, daß bei dem für die bestückte Leiterplatte notwendigen Lötvorgang (z.B. Schwall-Löten) im Gegensatz zu einem vollflächigen Kontaktbereich die erfindungsgemäß strukturierten Kontaktteilflächen (2) eine gleichmäßig dünne Lotschicht annehmen. Dadurch wird eine sehr gute Kontaktierfähigkeit mit dem jeweiligen Gegenkontakt sichergestellt. Dies gilt sowohl für Leiterplatten mit bereits vorverzinnten Leiterbahnen, als auch für Leiterplatten, die mit einem Schutzlack überzogen sind.

Abstract translation: 电路板，其设置有多个边缘连接器，每个边缘连接器各自与防腐蚀导体路径相连接，在其边缘区域中的至少一个上，所述边缘连接器各自用于接触插头装置的反接触元件，这取决于使用 规定，并且每个都具有接触可行的保护层。 每个边缘连接器（2）被构造成由长度和宽度选择的若干相互连接的部分区域（5），使得在不受控制的过程中， 当应用接触存活的保护层时，与相应的反接触元件的无瑕疵的接触功能不超过可能的厚度。 部分表面由具有沿插入方向延伸的分立尖头的梳型结构特别地形成。

公开(公告)号：EP0696074A1

公开(公告)日：1996-02-07

申请号：EP95112108.6

申请日：1995-08-02

Applicant: VALEO ELECTRONIQUE

Inventor： Etienne, Denis

IPC: H01M2/20 ,  H01M2/10 ,  E05B49/00 ,  H05K1/18 ,  H01R23/72

CPC classification number: H01M2/20 ,  E05B2047/0062 ,  G07C9/00944 ,  H01M2/1044 ,  H01R12/714 ,  H05K1/11 ,  H05K3/325 ,  H05K2201/0373

Abstract: La présente l'invention concerne une borne collectrice pour la mise en contact électrique d'une source de tension, telle qu'une pile (10,200,40), pour l'alimentation d'un circuit électronique, la pile étant posée et/ou pressée contre la borne collectrice dans le but de réaliser le contact électrique.
Selon l'invention, la borne est sensiblement plane et comporte une structure maillée, autrement appelée structure tramée ou bien encore structure grillagée. Ainsi, le sommet d'une courbure convexe existant au moins localement à la surface de la pile, vient se loger dans une maille lorsque le pile est pressée contre la borne, ce qui réalise un contact amélioré par une pluralité de points de contact.

Abstract translation: 在用于例如典型的手持式遥控单元 汽车锁定，手表型电池磁盘驱动器的印刷电路。 网格采用镍/金合金铺设在分配给所述电池连接电路板的面积。 作为电池的基础上，压靠该区域中，是基因反弹稍微凸起，一个常规的接触仅提供不可靠的单点连接。 与网格中合金的凸起啮合的形状布置的板连接，电池基座（41），如果相邻的合金的脊（48,49）之间的最远突出部（42）。 网格确保没有另外连接的二维性质将上其它轴来建立。

公开(公告)号：EP0455891B1

公开(公告)日：1995-04-19

申请号：EP90125727.9

申请日：1990-12-28

Applicant: International Business Machines Corporation

Inventor： Burns, Francis C. ,  Kaufman, John J. ,  King, David E. ,  Knight, Alan D.

IPC: H01L23/485 ,  H01R4/58 ,  H01R13/22

CPC classification number: H05K3/325 ,  H01L23/32 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01R4/58 ,  H01R13/03 ,  H01R43/16 ,  H05K3/0035 ,  H05K3/365 ,  H05K3/4007 ,  H05K2201/0317 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/209 ,  H05K2203/0307 ,  H05K2203/072 ,  H05K2203/0723 ,  H01L2924/00

公开(公告)号：EP0568313A3

公开(公告)日：1994-04-20

申请号：EP93303272.4

申请日：1993-04-27

Applicant: Nippon CMK Corp.

Inventor： Kawakami, Shin, c/o Nippon CMK Corp.

IPC: H05K3/46 ,  H05K3/40 ,  H01R9/09

CPC classification number: H05K3/4046 ,  H01R12/523 ,  H05K3/3447 ,  H05K3/3468 ,  H05K3/4038 ,  H05K3/4602 ,  H05K2201/0305 ,  H05K2201/0355 ,  H05K2201/0373 ,  H05K2201/09845 ,  H05K2201/10287 ,  H05K2203/063 ,  Y10T29/49126 ,  Y10T29/49149

Abstract: A method of manufacturing multilayer printed wiring board is disclosed. In the described method, respective layers of a multilayer printed wiring board are formed with respective printed wiring boards (2, 3, 5 and 7), respective printed wiring boards are laminated and pasted up, and necessary circuits of the printed wiring board are electrically connected by means of through-holes (12, 13, 14) punched into the respective printed wiring boards. The method comprises the steps of: inserting a plurality of fine wires (16) into respective through-holes punched in the respective printed wiring boards; filling up solder (17) into the through-holes of the connecting lands by capillary action; and electrically connecting the necessary circuits between the respective printed wiring boards (2, 3, 5 and 7) with each other.

Abstract translation: 公开了一种制造多层印刷线路板的方法。 在所描述的方法中，多层印刷线路板的相应层由相应的印刷线路板（2,3,5和7）形成，相应的印刷线路板被层压和粘贴，并且印刷线路板的必要电路电气地 通过冲压到相应印刷线路板中的通孔（12,13,14）连接。 该方法包括以下步骤：将多根细线（16）插入冲压在各个印刷线路板中的相应通孔中; 通过毛细管作用将焊料（17）填充到连接区域的通孔中; 并且将各个印刷线路板（2,3,5和7）之间的必要电路彼此电连接。

公开(公告)号：EP0480194A3

公开(公告)日：1993-08-04

申请号：EP91115460.7

申请日：1991-09-12

Applicant: International Business Machines Corporation

Inventor： Datta, Madhav ,  King, David E. ,  Knight, Alan D. ,  Sambucetti, Carlos J.

IPC: H05K1/00 ,  H05K3/00 ,  H01R23/72 ,  H01R13/24 ,  C23F1/02 ,  H05K3/38

CPC classification number: H05K3/07 ,  H01L2924/0002 ,  H01R13/03 ,  H01R13/22 ,  H01R43/16 ,  H05K3/064 ,  H05K3/383 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2203/0369 ,  Y10T29/49222 ,  H01L2924/00

Abstract: An electrical interconnection, which includes a method for fabricating the device, is disclosed. The interconnection comprises two contact surfaces, on at least one of which is disposed at least one solid metal conical projection in predetermined dimension and location. Rather than necessarily being permanently cojoined, the contact surfaces are attachable and detachable when desired. The conical projections on one contact surface make ohmic contact, either by wiping with an intermeshing like structure on a second contact surface or by contacting a second contact surface which is a substantially flat contact pad. An interconnection, in this invention, is the combination of at least one contact having individual conical projections and another contact, optionally having individual conical projections. The conical projections are formed in metal by electrochemical machining in neutral salt solution, optionally in a continuous foil. The conical projections are also optionally formed on the head of a contact pin.

公开(公告)号：EP0455891A1

公开(公告)日：1991-11-13

申请号：EP90125727.9

申请日：1990-12-28

Applicant: International Business Machines Corporation

Inventor： Burns, Francis C. ,  Kaufman, John J. ,  King, David E. ,  Knight, Alan D.

IPC: H01L23/485 ,  H01R4/58 ,  H01R13/22

CPC classification number: H05K3/325 ,  H01L23/32 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01R4/58 ,  H01R13/03 ,  H01R43/16 ,  H05K3/0035 ,  H05K3/365 ,  H05K3/4007 ,  H05K2201/0317 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/209 ,  H05K2203/0307 ,  H05K2203/072 ,  H05K2203/0723 ,  H01L2924/00

Abstract: An electrical interconnection, which includes a method for fabricating the device, is disclosed. The interconnection comprises two contact surfaces, on at least one of which is disposed at least one conical projection in predetermined dimension and location. Rather than being permanently cojoined, the contact surfaces are attachable and detachable when desired. The individual conical projections are comprised of an ablative material, and at least some of the conical projections include a surface which is substantially comprised of material in a thickness capable of making ohmic contact, either by wiping with an intermeshing like structure or by contacting a substantially flat contact pad. An interconnection, in this invention, is the combination of at least one contact having individual conical projections and another contact, optionally having individual conical projections. The conical projections are formed by laser. The conical projections are optionally formed on the head of a contact pin.

Abstract translation: 公开了一种包括制造该装置的方法的电互连。 互连包括两个接触表面，其中至少一个接触表面设置有至少一个预定尺寸和位置的锥形突起。 不是永久地共同接合，所以接触表面可以在需要的时候是可附接的和可拆卸的。 各个圆锥形突起由可消融材料组成，并且至少一些锥形突起包括基本上由能够进行欧姆接触的厚度的材料构成的表面，或者通过用相互啮合的结构擦拭或者通过使基本上 扁平接触垫。 在本发明中的互连是至少一个具有单个锥形突起的接触件和另一接触件的组合，可选地具有各自的锥形突出部。 锥形突起通过激光形成。 锥形突出部可选地形成在接触销的头部上。

公开(公告)号：EP0385787A3

公开(公告)日：1990-10-31

申请号：EP90302214.3

申请日：1990-03-01

Applicant: SHARP KABUSHIKI KAISHA

Inventor： Matsubara, Hiroshi

IPC: H01L21/60 ,  H01L23/485

CPC classification number: H01L24/10 ,  G02F1/13452 ,  H01L21/563 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05124 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/11015 ,  H01L2224/11332 ,  H01L2224/11334 ,  H01L2224/13 ,  H01L2224/1319 ,  H01L2224/136 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/29399 ,  H01L2224/29409 ,  H01L2224/29411 ,  H01L2224/29416 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/29464 ,  H01L2224/29469 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K3/06 ,  H05K3/102 ,  H05K3/247 ,  H05K3/321 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/0373 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/01014

Abstract: A connection electrodes (12) producing method has a step of forming resin layer (13) which can be softened after hardened, on a circuit substrate (11) on which an electrode pattern is formed. Then, only the resin layer material on the electrode pattern is cured and left. Thereafter, conductive particles (14) are adhered to only the resin layer on the electrode pattern by softening the resin layer and by scattering the conductive particles on the circuit substrate with the softened resin layer.

公开(公告)号：EP0133752A3

公开(公告)日：1988-08-10

申请号：EP84304532

申请日：1984-07-02

Applicant: RAYCHEM CORPORATION (a Delaware corporation)

Inventor： Allen, Leslie John ,  Cherian, Gabe ,  Diaz, Stephen H.

IPC: B23K03/00

CPC classification number: B23K35/0222 ,  B23K3/06 ,  H01L2924/00013 ,  H01L2924/0002 ,  H05K3/325 ,  H05K3/3421 ,  H05K3/3436 ,  H05K3/3442 ,  H05K3/4015 ,  H05K13/0465 ,  H05K2201/0215 ,  H05K2201/0314 ,  H05K2201/0373 ,  H05K2201/1028 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10727 ,  H05K2201/10946 ,  H05K2203/0415 ,  H05K2203/0769 ,  Y02P70/613 ,  H01L2224/29099 ,  H01L2924/00

Abstract: A chip carrier mounting device includes a retaining member having a predefined pattern of apertures in which are positioned preforms of joint-forming matenal such as solder. The preform retains its general configuration after the interconnection or soldering process to form a resilient joint which is more capable of withstanding stress, strain and fatigue. The joint-forming material may be filled solder composition or a supported solder which substantially maintain their physical shape when the solder is molten, or a conductive elastomer.

公开(公告)号：EP0260483A3

公开(公告)日：1988-07-20

申请号：EP87112271

申请日：1987-08-25

Applicant: KOLLMORGEN CORPORATION

Inventor： Karla, Helmut,

IPC: H05K03/44

CPC classification number: H05K3/44 ,  H05K3/427 ,  H05K3/445 ,  H05K2201/0373 ,  H05K2203/068 ,  H05K2203/1178 ,  H05K2203/1476

Abstract: Die Erfindung betrifft Metallkern-Leiterplatten, deren Metallkern mindestens eine Oberfläche aufweist, die mit Kanälen versehen ist, die den Luftaustritt aus Lochungen beim Beschichten mit Isolierstoff und damit die blasen freie Füllung der Lochungen bewirken, sowie auf Ver fahren zum Herstellen solcher Metallkern-Leiterplatten.