公开(公告)号：EP0996321B1

公开(公告)日：2007-05-16

申请号：EP99306548.1

申请日：1999-08-19

Applicant: SONY CHEMICALS CORPORATION

Inventor： Yamada, Yukio, Sony Chemicals Corporation ,  Saito, Masao, Sony Chemicals Corporation ,  Shinozaki, Junji, Sony Chemicals Corporation ,  Takeichi, Motohide, c/o Sony Chemicals Corporation

IPC: H05K3/32 ,  H01L21/60 ,  H01R4/04

CPC classification number: H01L24/83 ,  H01L24/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29399 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H01R4/04 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0233 ,  H05K2201/0266 ,  H05K2201/10674 ,  H01L2924/00

公开(公告)号：EP0996321A3

公开(公告)日：2003-02-12

申请号：EP99306548.1

申请日：1999-08-19

Applicant: SONY CHEMICALS CORPORATION

Inventor： Yamada, Yukio, Sony Chemicals Corporation ,  Saito, Masao, Sony Chemicals Corporation ,  Shinozaki, Junji, Sony Chemicals Corporation ,  Takeichi, Motohide, c/o Sony Chemicals Corporation

IPC: H05K3/32 ,  H01L21/60 ,  H01R4/04

CPC classification number: H01L24/83 ,  H01L24/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29399 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H01R4/04 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0233 ,  H05K2201/0266 ,  H05K2201/10674 ,  H01L2924/00

Abstract: An anisotropically electroconductive adhesive to be used for establishing electric connection between terminals (15) of, for example, an IC chip (14) and of a circuit pattern (17), at a low cost with high reliabilities both in the establishment of electric connection and in the insulation upon the connection without suffering from short-circuiting between circuit lines in the circuit and without causing any obstruction on the circuit, even when the terminals (15) or the circuit lines (17) are disposed at close intervals, which adhesive (10) comprises an electrically insulating adhesive matrix (13) and electroconductive particles (11,12) dispersed in the matrix (13), wherein the electroconductive particles (11,12) comprise at least two electroconductive particulate products of different average particle sizes and wherein each particle of both the particulate products (11,12) is coated with an electrically insulating resin insoluble in the insulating adhesive matrix (13).

Abstract translation: 用于在例如IC芯片和电路图案的端子之间建立电连接的各向异性导电粘合剂以低成本建立电连接并且在连接时的绝缘性中不受损害 即使当端子或电路线以紧密的间隔设置时，即使在电路中的电路线之间短路并且不引起电路上的任何障碍，该粘合剂包括电绝缘粘合剂基质和分散在基质中的导电颗粒，其中 导电颗粒包含至少两种不同平均粒径的导电颗粒产品，并且其中两种颗粒产品的每个颗粒都涂覆有不溶于绝缘粘合剂基质的电绝缘树脂。

公开(公告)号：EP0346525B1

公开(公告)日：1996-09-04

申请号：EP88118473.3

申请日：1988-11-05

Applicant: Sheldahl, Inc.

Inventor： Gilleo, Kenneth B., Dr. ,  Dowdle, Deanna M.

IPC: H05K3/46 ,  H01R4/04 ,  H05K1/00

CPC classification number: H05K3/462 ,  H01L2224/293 ,  H01L2924/01079 ,  H01L2924/09701 ,  H05K3/28 ,  H05K3/323 ,  H05K3/4623 ,  H05K2201/0233 ,  H05K2201/0266 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2203/0425 ,  H05K2203/061 ,  H05K2203/1572

公开(公告)号：EP0605689A1

公开(公告)日：1994-07-13

申请号：EP93914917.0

申请日：1993-07-12

Applicant: CENTRAL RESEARCH LABORATORIES LIMITED

Inventor： NAYLOR, Malcolm

IPC: H01R4 ,  H05K3

CPC classification number: H05K3/323 ,  H01L2224/29499 ,  H01L2924/01079 ,  H01R4/04 ,  H05K3/361 ,  H05K2201/0218 ,  H05K2201/0233 ,  H05K2201/0272 ,  H05K2201/0281 ,  H05K2201/0323

Abstract: L'invention concerne un procédé de formation d'une connexion électrique anisotrope entre des éléments conducteurs (22, 24) possédant une couche d'oxyde (28). Le procédé consiste à utiliser un adhésif (30) comportant des fibres de carbone (32) et des particules métalliques (34). Lorsqu'on applique une pression, les fibres de carbone (32) pénètrent dans la couche d'oxyde (28), tandis que les particules métalliques (34) se déforment de telle façon qu'une bonne connexion électrique se fasse entre les éléments de recouvrement (22, 24).

公开(公告)号：EP0387066A1

公开(公告)日：1990-09-12

申请号：EP90302493.3

申请日：1990-03-08

Applicant: Hitachi Chemical Co., Ltd.

Inventor： Tsukagoshi, Isao ,  Yamaguchi, Yutaka ,  Nakajima, Atsuo ,  Goto, Yasushi

IPC: H01L21/60 ,  H01L21/58

CPC classification number: H01L24/83 ,  H01L21/563 ,  H01L23/4828 ,  H01L24/13 ,  H01L24/29 ,  H01L2224/13019 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/29399 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2224/83136 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01054 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/351 ,  H05K3/321 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/10674 ,  H05K2203/1163 ,  Y10T29/4913 ,  Y10T156/1075 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/13111

Abstract: A process for electrically connecting circuits wherein at least one circuit (4) is provided on an insulating layer (3) and has a plurality of projecting electrodes (2) which are deformable under pressure in the circuit connecting operation, wherein an insulating adhesive having a volatile content of 0.5% or less by weight and comprising

(i) a liquid epoxy resin,
(ii) a solid resin having one or more functional groups and
(iii) a microcapsule type curing agent, in the form of a film (5) having a thickness of 50µm or less,
is interposed between the circuits and is substantially cured after the projecting electrodes have been contacted with the opposing circuits by applying heat and pressure at the time of connection.

Abstract translation: 一种用于电连接电路的方法，其中至少一个电路（4）设置在绝缘层（3）上并且具有多个在电路连接操作中在压力下可变形的突出电极（2），其中绝缘粘合剂具有 挥发物含量为0.5重量％以下，并且包含（i）液体环氧树脂，（ii）具有一个或多个官能团的固体树脂和（iii）薄膜（5）形式的微胶囊型固化剂， 厚度为50μm以下，插入在电路之间，并且在连接后通过施加热和压力使突出电极与相对电路接触后基本固化。

公开(公告)号：EP0242025A1

公开(公告)日：1987-10-21

申请号：EP87301263.7

申请日：1987-02-13

Applicant: Hitachi Chemical Co., Ltd.

Inventor： Tsukagoshi, Isao ,  Yamaguchi, Yutaka ,  Nakajima, Atsuo ,  Mikami, Yoshikatsu ,  Muto, Kuniteru ,  Ikezoe, Yoshiyuki

IPC: H01B1/22 ,  H01R4/04

CPC classification number: H01R4/04 ,  H01B1/22 ,  H01L2224/293 ,  H01L2224/29399 ,  H01L2224/81903 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2924/01019 ,  H01L2924/01079 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/068 ,  Y10T29/49194

Abstract: Excellent connection of conductors with high reliability can be accomplished by using an adhesive composition or film capable of exhibiting anisotropic-­electroconductivity comprising an electrically insulating adhesive component and electroconductive particles each particle comprising a polymeric core material coated with a thin metal layer.

Abstract translation: 具有高可靠性的导体良好的连接可以通过使用粘接剂组合物或薄膜能够显示出各向异性导电包括电绝缘粘合剂组分和导电颗粒每个颗粒包含涂覆有薄金属层的聚合物芯材来完成。

公开(公告)号：EP0179805A1

公开(公告)日：1986-05-07

申请号：EP85901804.0

申请日：1985-04-16

Applicant: AMP INCORPORATED (a New Jersey corporation)

Inventor： DERY, Ronald, Allen ,  JONES, Warren, Charlie ,  LYNN, William, Joseph ,  ROWLETTE, John, Robert

IPC: H01B1 ,  H05K3 ,  H01H1

CPC classification number: H05K3/323 ,  H01B1/20 ,  H01B1/22 ,  H01B1/24 ,  H01H1/029 ,  H05K3/361 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2201/0233

Abstract: Composition adhésive anisotropiquement conductrice (10) à utiliser pour connecter électriquement au moins une zone conductrice (14) placée sur un substrat (12) à au moins une zone conductrice (20) placée sur un second substrat (18). La composition (10) consiste en un mélange de particules conductrices et d'un liant adhésif non conducteur (26). Les particules conductrices sont dispersées à travers le liant dans plusieurs éléments conducteurs non contigus (24), de manière que, en appliquant une couche (30) de la composition (10) sur la zone conductrice et la zone isolante (14, 16) sur un substrat (12) et en plaçant dans une relation de conductivité et en faisant adhérer au moins ladite zone conductrice (20) sur le second substrat (18) à au moins ladite zone conductrice (14) sur le premier substrat (12), les éléments (24) établissent une connexion électrique entre les zones conductrices adhérées (14, 20) sur les deux substrats (12, 18). Les éléments (24), toutefois, sont suffisamment espacés entre eux pour empêcher une conductivité électrique entre les zones adjacentes sur le même substrat. Sont également décrits un procédé de connexion électrique des zones conductrices sur deux substrats au moyen de cette composition adhésive anisotropiquement conductrice (0) ainsi que des produits fabriqués en utilisant ce procédé.

公开(公告)号：EP1426979A4

公开(公告)日：2009-02-18

申请号：EP02765567

申请日：2002-09-17

Applicant: SEKISUI CHEMICAL CO LTD

Inventor： WAKIYA TAKESHI ,  YONEDA YOSHIKAZU ,  UEBA MASAKO

IPC: H01R13/03 ,  H01R13/24 ,  H05K3/32 ,  H01B5/00 ,  B01J19/00 ,  C08K9/04 ,  C08L101/00 ,  C09C3/06 ,  C09J9/02 ,  H01B1/00 ,  H01B5/16 ,  H01R11/01

CPC classification number: H05K3/323 ,  B22F1/0062 ,  B22F2998/00 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0233 ,  Y10T428/2991 ,  Y10T428/2998 ,  B22F1/025

Abstract: A coated conductive particle excellent in connection reliability, a coated conductive particle manufacturing method, an anisotropic conductive material, and an electrical connection structure. A coated conductive particle composed of a particle having a surface of a conductive metal and insulating particles covering the particle having the conductive metal surface, wherein the insulating particles form a single coating layer by chemically bonding with the particle having the conductive metal surface through a functional group (A) having a bondability with the conductive metal.

公开(公告)号：EP0692137B1

公开(公告)日：2002-04-10

申请号：EP95907808.0

申请日：1995-01-26

Applicant: LOCTITE (IRELAND) LIMITED

Inventor： McARDLE, Ciaran, Bernard ,  BURKE, Joseph

IPC: H01F1/44 ,  H01R4/04

CPC classification number: H05K3/323 ,  H01F1/44 ,  H01F41/16 ,  H01L2224/293 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01R4/04 ,  H01R12/57 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2201/0233 ,  H05K2201/083 ,  H05K2203/104 ,  Y10T428/12069 ,  Y10T428/12347 ,  H01L2924/00

Abstract: The invention provides a composition (3) comprising: (i) a ferrofluid comprising a colloidal suspension (4) of ferromagnetic particles in a non-magnetic carrier liquid, and (ii) a plurality of electrically-conductive particles (5) having substantially uniform sizes and shapes, dispersed in the ferrofluid. Various types of substantially non-magnetic electrically-conductive particles (5) are described. Application of a substantially uniform magnetic field by magnet means (8) to the composition (3) causes the electrically-conductive particles (5) to form a regular pattern (9). The composition is used for providing anisotropic conductive pathways (9a, 9b) between two sets of conductors (2a, 2b; 7a, 7b) in the electronics industry. The composition may be a curable adhesive composition which bonds the conductors. Alternatively or in addition the electrically-conductive particles may have a latent adhesive property e.g. the particles may be solder particles. The ferrofluid may be a colloidal suspension of ferromagnetic particles in a liquid monomer.

公开(公告)号：EP1051265A1

公开(公告)日：2000-11-15

申请号：EP99905459.6

申请日：1999-01-29

Applicant: LOCTITE CORPORATION

Inventor： MCARDLE, Ciaran, B. ,  BARNES, Rory, B.

IPC: B05D1/36 ,  B05D3/02 ,  B05D5/12 ,  B05D7/00 ,  B32B5/16 ,  B32B9/00 ,  B32B15/04 ,  B32B27/00 ,  B32B27/06 ,  B32B27/08 ,  B32B27/38 ,  B32B31/00 ,  C08F2/46 ,  C08F2/48 ,  H01F1/00

CPC classification number: B05D3/207 ,  B05D3/067 ,  B05D7/00 ,  C23C24/08 ,  C23C24/10 ,  C23C26/00 ,  C23C26/02 ,  H01F41/16 ,  H01F41/18 ,  H01F41/34 ,  H05K3/323 ,  H05K2201/0218 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/083 ,  H05K2203/0425 ,  H05K2203/104

Abstract: The present invention provides a variety of interrelated methods of coating non-random and ordered arrays of particles, as well as films containing such arrays. The present invention also relates to the coated non-random and ordered arrays of particles and films prepared therefrom. The coated non-random and ordered arrays are obtained by the use of ferrofluid compositions which may be curable. The arrays and films may contain electrically-conductive particles useful in electronic applications for effecting contact between conductors.