公开(公告)号：EP2180505A3

公开(公告)日：2013-02-27

申请号：EP09252154.1

申请日：2009-09-10

申请人： Carsem (M) Sdn. Bhd.

发明人： Khor, Lily ,  Yong, Lam Wai ,  Lau, Choong Keong

IPC分类号： H01L21/60 ,  H01L23/485

CPC分类号： H01L21/561 ,  H01L23/291 ,  H01L23/293 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/74 ,  H01L24/78 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05573 ,  H01L2224/0558 ,  H01L2224/05624 ,  H01L2224/0612 ,  H01L2224/1132 ,  H01L2224/1134 ,  H01L2224/1181 ,  H01L2224/11822 ,  H01L2224/1184 ,  H01L2224/11849 ,  H01L2224/119 ,  H01L2224/11901 ,  H01L2224/1191 ,  H01L2224/13007 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13562 ,  H01L2224/1357 ,  H01L2224/13611 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/742 ,  H01L2224/78267 ,  H01L2224/78303 ,  H01L2224/78611 ,  H01L2224/85 ,  H01L2224/85207 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00011 ,  H01L2224/13099 ,  H01L2924/00

摘要： A method of fabricating a wafer-level package is described. The method includes providing an active device on a semiconductor wafer (300) that has not been singulated, the active device having a plurality of bonding pads (104) exposed at an upper surface of the wafer (300). Prior to singulating the semiconductor wafer (300), a plurality of stud bumps (106,610) are formed with a wire bonding tool on the plurality of bonding pads (104,612). Thereafter, a moulding encapsulation layer (108) is applied over the semiconductor wafer (300), leaving an upper portion of each of the plurality of stud bumps (106) exposed.

公开(公告)号：EP2590208A2

公开(公告)日：2013-05-08

申请号：EP12190624.2

申请日：2012-10-30

申请人： Carsem (M) Sdn. Bhd.

发明人： Yong, Lam Wai ,  Chan, Boon Meng ,  Phang, Hon Keat

IPC分类号： H01L21/58 ,  H01L21/56 ,  H01L21/683 ,  H01L23/495 ,  B29C43/18

CPC分类号： H01L21/6835 ,  B29C43/021 ,  B29C43/18 ,  B29C2043/3433 ,  H01L21/561 ,  H01L21/568 ,  H01L23/49503 ,  H01L23/49541 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L24/97 ,  H01L33/54 ,  H01L2221/68331 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/45099 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2224/85013 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2933/005 ,  H01L2224/85 ,  H01L2924/0665 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00

摘要： A method of manufacturing an integrated circuit package includes mounting a large panel leadframe having a substantially square shape to a ring. The large panel leadframe includes a plurality of die pads and a corresponding plurality of leads arranged in a matrix pattern. An integrated circuit chip is attached to each of the die pads. An encapsulant material is applied over the integrated circuit chips and at least a part of the large panel leadframe. Each of the die pads and its corresponding leads are separated from the large panel leadframe to form individual integrated circuit packages. The steps of attaching the integrated circuit chips and applying the encapsulant material are performed while the large panel leadframe is mounted to a taped ring.

摘要翻译： 一种制造集成电路封装的方法包括将具有大致正方形形状的大型面板引线框安装到环上。 大面板引线框架包括多个管芯焊盘和以矩阵图案布置的对应的多个引线。 集成电路芯片附接到每个管芯焊盘。 在集成电路芯片和大面板引线框架的至少一部分上施加密封剂材料。 每个管芯焊盘及其对应的引线与大型引线框架分离以形成单独的集成电路封装。 在将大面板引线框架安装到带状环上时，执行安装集成电路芯片和施加密封剂材料的步骤。

公开(公告)号：EP2590208A3

公开(公告)日：2014-03-19

申请号：EP12190624.2

申请日：2012-10-30

申请人： Carsem (M) Sdn. Bhd.

发明人： Yong, Lam Wai ,  Chan, Boon Meng ,  Phang, Hon Keat

IPC分类号： H01L21/56 ,  H01L21/683 ,  H01L23/495 ,  B29C43/18 ,  H01L21/58 ,  H01L21/677

CPC分类号： H01L21/6835 ,  B29C43/021 ,  B29C43/18 ,  B29C2043/3433 ,  H01L21/561 ,  H01L21/568 ,  H01L23/49503 ,  H01L23/49541 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L24/97 ,  H01L33/54 ,  H01L2221/68331 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/45099 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2224/85013 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2933/005 ,  H01L2224/85 ,  H01L2924/0665 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00

摘要： A method of manufacturing an integrated circuit package includes mounting a large panel leadframe having a substantially square shape to a ring. The large panel leadframe includes a plurality of die pads and a corresponding plurality of leads arranged in a matrix pattern. An integrated circuit chip is attached to each of the die pads. An encapsulant material is applied over the integrated circuit chips and at least a part of the large panel leadframe. Each of the die pads and its corresponding leads are separated from the large panel leadframe to form individual integrated circuit packages. The steps of attaching the integrated circuit chips and applying the encapsulant material are performed while the large panel leadframe is mounted to a taped ring.

公开(公告)号：EP2180505A2

公开(公告)日：2010-04-28

申请号：EP09252154.1

申请日：2009-09-10

申请人： Carsem (M) Sdn. Bhd.

发明人： Khor, Lily ,  Yong, Lam Wai ,  Lau, Choong Keong

IPC分类号： H01L21/60 ,  H01L23/485

CPC分类号： H01L21/561 ,  H01L23/291 ,  H01L23/293 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/74 ,  H01L24/78 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05573 ,  H01L2224/0558 ,  H01L2224/05624 ,  H01L2224/0612 ,  H01L2224/1132 ,  H01L2224/1134 ,  H01L2224/1181 ,  H01L2224/11822 ,  H01L2224/1184 ,  H01L2224/11849 ,  H01L2224/119 ,  H01L2224/11901 ,  H01L2224/1191 ,  H01L2224/13007 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13562 ,  H01L2224/1357 ,  H01L2224/13611 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/742 ,  H01L2224/78267 ,  H01L2224/78303 ,  H01L2224/78611 ,  H01L2224/85 ,  H01L2224/85207 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00011 ,  H01L2224/13099 ,  H01L2924/00

摘要： A method of fabricating a wafer-level package is described. The method includes providing an active device on a semiconductor wafer (300) that has not been singulated, the active device having a plurality of bonding pads (104) exposed at an upper surface of the wafer (300). Prior to singulating the semiconductor wafer (300), a plurality of stud bumps (106,610) are formed with a wire bonding tool on the plurality of bonding pads (104,612). Thereafter, a moulding encapsulation layer (108) is applied over the semiconductor wafer (300), leaving an upper portion of each of the plurality of stud bumps (106) exposed.

摘要翻译： 描述了制造晶片级封装的方法。 所述方法包括在半导体晶片（300）上提供有源器件，所述半导体晶片（300）未被单个化，所述有源器件具有在所述晶片（300）的上表面处暴露的多个接合焊盘（104）。 在分离半导体晶片（300）之前，在多个焊盘（104,612）上形成多个柱状凸起（106,610），其具有引线接合工具。 此后，在半导体晶片（300）上施加模制封装层（108），留下多个柱形突起（106）中的每一个凸起的上部。