公开(公告)号：EP2773792A4

公开(公告)日：2015-04-22

申请号：EP12866275

申请日：2012-11-02

申请人： INTEVAC INC ,  BROWN DAVID WARD ,  SHAH VINAY ,  PEDERSON TERRY ,  BLUCK TERRY

发明人： BROWN DAVID WARD ,  SHAH VINAY ,  PEDERSON TERRY ,  BLUCK TERRY

IPC分类号： C23C14/35

CPC分类号： H01J37/3455 ,  C23C14/35 ,  C23C14/56 ,  H01J37/32779 ,  H01J37/32899 ,  H01J37/3405 ,  H01J37/3417 ,  H01J37/3452

公开(公告)号：EP3108030A4

公开(公告)日：2017-08-23

申请号：EP15751417

申请日：2015-02-20

申请人： INTEVAC INC ,  BLUCK TERRY ,  SHAH VINAY ,  LATCHFORD IAN ,  RIPOSAN ALEX

发明人： BLUCK TERRY ,  SHAH VINAY ,  LATCHFORD IAN ,  RIPOSAN ALEXANDRU

IPC分类号： C23C14/50 ,  H01L21/67 ,  H01L21/677

CPC分类号： C23C14/50 ,  C23C14/568 ,  H01L21/67173 ,  H01L21/67271 ,  H01L21/67709 ,  H01L21/67718 ,  H01L21/67748 ,  H01L21/6776

摘要： A system for processing substrates in plasma chambers, such that all substrates transport and loading/unloading operations are performed in atmospheric environment, but processing is performed in vacuum environment. The substrates are transported throughout the system on carriers. The system's chambers are arranged linearly, such that carriers move from one chamber directly to the next. A conveyor, placed above or below the system's chambers, returns the carriers to the system's entry area after processing is completed. The carriers are configured for supporting substrates of different sizes. The carriers are also configured for flipping the substrates such that both surfaces of the substrates may be processed.

摘要翻译： 一种用于在等离子体室中处理基板的系统，使得所有的基板运输和装载/卸载操作在大气环境中进行，但是处理在真空环境中进行。 基材在载体上通过系统运输。 系统的腔室线性排列，使得载体从一个腔室直接移动到下一个腔室。 放置在系统腔室上方或下方的传送带在处理完成后将载体返回到系统的入口区域。 载体被配置用于支撑不同尺寸的衬底。 载体还被配置用于翻转衬底，使得衬底的两个表面都可以被处理。

公开(公告)号：EP2777069A4

公开(公告)日：2015-01-14

申请号：EP12847303

申请日：2012-11-08

申请人： INTEVAC INC ,  PEDERSON TERRY ,  HIESLMAIR HENRY ,  CHUN MOON ,  PRABHAKAR VINAY ,  ADIBI BABAK ,  BLUCK TERRY

发明人： PEDERSON TERRY ,  HIESLMAIR HENRY ,  CHUN MOON ,  PRABHAKAR VINAY ,  ADIBI BABAK ,  BLUCK TERRY

IPC分类号： H01L21/677 ,  H01L21/68 ,  H01L21/683 ,  H01L31/18

CPC分类号： H01L21/6833 ,  H01L21/26506 ,  H01L21/67745 ,  H01L21/6776 ,  H01L21/681 ,  H01L21/6831 ,  H01L31/1876 ,  H02N13/00 ,  Y02E10/50 ,  Y02P70/521

摘要： A system for processing substrates has a vacuum enclosure and a processing chamber situated to process wafers in a processing zone inside the vacuum enclosure. Two rail assemblies are provided, one on each side of the processing zone. Two chuck arrays ride, each on one of the rail assemblies, such that each is cantilevered on one rail assemblies and support a plurality of chucks. The rail assemblies are coupled to an elevation mechanism that places the rails in upper position for processing and at lower position for returning the chuck assemblies for loading new wafers. A pickup head assembly loads wafers from a conveyor onto the chuck assemblies. The pickup head has plurality of electrostatic chucks that pick up the wafers from the front side of the wafers. Cooling channels in the processing chucks are used to create air cushion to assist in aligning the wafers when delivered by the pickup head.

公开(公告)号：EP2852469A4

公开(公告)日：2015-09-02

申请号：EP13780965

申请日：2013-04-26

申请人： INTEVAC INC ,  BLUCK TERRY ,  SHAH VINAY ,  RIPOSAN ALEX

发明人： BLUCK TERRY ,  SHAH VINAY ,  RIPOSAN ALEX

IPC分类号： C23C14/04 ,  H01L21/673 ,  H01L21/677 ,  H01L31/18

CPC分类号： H01L21/67709 ,  H01L21/67173 ,  H01L21/67736 ,  H01L21/67739 ,  H01L21/67754 ,  H01L21/67769 ,  H01L21/67775 ,  H01L21/67778 ,  H01L21/67781 ,  H01L21/68742 ,  H01L21/68785

摘要： A system for processing substrates in plasma chambers, such that all substrates transport and loading/unloading operations are performed in atmospheric environment, but processing is performed in vacuum environment. The substrates are transported throughout the system on carriers. The system's chambers are arranged linearly, such that carriers move from one chamber directly to the next. A conveyor, placed above or below the system's chambers, returns the carriers to the system's entry area after processing is completed. Loading and unloading of substrates may be performed at one side of the system, or loading can be done at the entry side and unloading at the exit side.

公开(公告)号：EP2839052A4

公开(公告)日：2015-06-10

申请号：EP13777473

申请日：2013-04-19

申请人： INTEVAC INC ,  BLUCK TERRY ,  LATCHFORD IAN ,  SHAH VINAY ,  RIPOSAN ALEX

发明人： BLUCK TERRY ,  LATCHFORD IAN ,  SHAH VINAY ,  RIPOSAN ALEX

IPC分类号： C23C14/04 ,  H01L21/673 ,  H01L31/18

CPC分类号： H01L31/1892 ,  C23C14/042 ,  C23C14/50 ,  C23C16/042 ,  C23C16/4585 ,  H01L21/6734 ,  H01L21/67346 ,  H01L31/18

公开(公告)号：EP1592822A4

公开(公告)日：2006-05-24

申请号：EP04703559

申请日：2004-01-20

申请人： INTEVAC INC

发明人： FAIRBAIRN KEVIN P ,  BLUCK TERRY ,  MARION CRAIG ,  WEISS ROBERT E

IPC分类号： C23C14/56 ,  C23C16/458 ,  C23C16/54 ,  G11B5/84 ,  H01L21/00 ,  C23C14/00

CPC分类号： C23C16/4587 ,  C23C14/568 ,  C23C16/54 ,  G11B5/00 ,  G11B5/8404 ,  H01L21/67161 ,  H01L21/67178 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67207 ,  H01L21/67236 ,  H01L21/67276

摘要： There is described a disk processing and manufacturing equipment in which the processing chambers are stacked on top of each other and in which the disks move through the system on disk carriers which are adjustable to take disks of varying sizes. The disks enter the system through a load zone and are then installed into disk carriers. They move in the carriers sequentially through processing chambers at one level and then move to the other level in a lift or elevator. At this other level, the disks again move sequentially through the system on that level and then exit at an unload zone.

公开(公告)号：EP3108027A4

公开(公告)日：2017-08-30

申请号：EP15752108

申请日：2015-02-19

申请人： INTEVAC INC

发明人： BROWN DAVID WARD ,  BLUCK TERRY

IPC分类号： C23C14/00 ,  C23C14/35 ,  C23C14/54 ,  G11B5/851 ,  H01F41/18 ,  H01J37/34

CPC分类号： H01J37/3455 ,  C23C14/35 ,  C23C14/56 ,  G11B5/851 ,  H01F41/183 ,  H01J37/3405 ,  H01J37/3408 ,  H01J37/3417 ,  H01J37/3426 ,  H01J37/3435 ,  H01J37/3452 ,  H01J37/347

公开(公告)号：EP3108028A4

公开(公告)日：2017-08-23

申请号：EP15752686

申请日：2015-02-19

申请人： INTEVAC INC

发明人： SHAH VINAY ,  RIPOSAN ALEXANDRU ,  BLUCK TERRY

IPC分类号： C23C14/00 ,  C23C14/35 ,  C23C14/54 ,  H01J37/34

CPC分类号： C23C14/35 ,  C23C14/352 ,  C23C14/542 ,  C23C14/562 ,  H01J37/3405 ,  H01J37/3408 ,  H01J37/345 ,  H01J37/3455 ,  H01J37/347

摘要： A system for depositing material from a target onto substrates, comprising a processing chamber; a sputtering target having length L and having sputtering material provided on front surface thereof; a magnet operable to reciprocally scan across the length L in close proximity to rear surface of the target; and a counterweight operable to reciprocally scan at same speed but opposite direction of the magnet.

摘要翻译： 一种用于将来自目标的材料沉积到衬底上的系统，包括处理室; 具有长度L并且在其前表面上设置有溅射材料的溅射靶; 磁体，其可操作以在接近靶的后表面的整个长度L上往复扫描; 以及可操作成以相同的速度但相反方向对磁体进行往复扫描的配重。

公开(公告)号：EP2841619A4

公开(公告)日：2015-06-03

申请号：EP13781653

申请日：2013-04-26

申请人： INTEVAC INC

发明人： BLUCK TERRY ,  RIPOSAN ALEX

IPC分类号： C23C14/35 ,  H01J37/32 ,  H01J37/34

CPC分类号： H01J37/3423 ,  C23C14/3407 ,  C23C14/352 ,  C23C14/56 ,  C23C14/566 ,  H01J37/32779 ,  H01J37/3408 ,  H01J37/3411 ,  H01J37/3417 ,  H01J37/3435 ,  H01J37/3497

摘要： A narrow sputtering source and target which are designed to be installed in a series on a sputtering chamber. Each of the narrow sputtering source has length sufficient to traverse one direction of the sputtering zone, but is much narrower than the orthogonal direction of the sputtering zone. When the sputtering chamber performs a pass-by sputtering process, each of the narrow sputtering sources is sufficiently long to traverse the sputtering zone in the direction orthogonal to the substrate travel direction, but is much narrower than the sputtering zone in the direction of substrate travel. Several narrow sputtering sources are installed so as to traverse the entire sputtering zone in all directions.

公开(公告)号：EP1815041A4

公开(公告)日：2009-07-29

申请号：EP05825763

申请日：2005-10-31

申请人： INTEVAC INC

发明人： FAIRBAIRN KEVIN P ,  PONNEKANTI HARI ,  LANE CHRISTOPHER ,  WEISS ROBERT EDWARD ,  LATCHFORD IAN ,  BLUCK TERRY

IPC分类号： C23C16/00 ,  H01L21/306

CPC分类号： H01L21/67201 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67745

摘要： Described is a method for manufacturing wafers and a manufacturing system in which the footprint is substantially contained in a size approximating the processing chambers. Single wafers move horizontally through the system and processing occurs simultaneously in groups of processing chambers. Various manufacturing processes employed in making semiconductor wafers are included as processing chambers in the system.