-
公开(公告)号：EP2915415A1
公开(公告)日：2015-09-09
申请号：EP13850174.7
申请日：2013-05-09
申请人： LG Innotek Co., Ltd.
发明人： JUNG, Won Suk , LEE, Kyu Won , AN, Yun Ho , LEE, Woo Young
CPC分类号： H05K1/186 , H01L21/4857 , H01L21/486 , H01L23/3135 , H01L23/49822 , H01L23/49827 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/97 , H01L2224/04105 , H01L2224/2402 , H01L2224/32225 , H01L2224/32245 , H01L2224/82039 , H01L2224/83005 , H01L2224/8314 , H01L2224/83191 , H01L2224/92144 , H01L2224/97 , H01L2924/15787 , H01L2924/15788 , H05K1/0298 , H05K1/0366 , H05K1/115 , H05K1/185 , H05K3/305 , H05K3/4602 , H05K2201/0195 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10984 , Y02P70/613 , H01L2924/00 , H01L2224/83 , H01L2224/82
摘要： Provided is a printed circuit board including: an insulating layer; electronic devices embedded in the insulating layer; and an adhesive layer for fixing the electronic devices.
摘要翻译： 提供一种印刷电路板，包括：绝缘层; 嵌入在绝缘层中的电子器件; 以及用于固定电子器件的粘合剂层。
-
公开(公告)号：EP2710075A2
公开(公告)日：2014-03-26
申请号：EP12789163.8
申请日：2012-05-21
申请人： LG Innotek Co., Ltd.
发明人： PARK, Jae Man , KIM, Eun Jin , KIM, Hae Yeon , PARK, Hyun Gyu , AN, Yun Ho , CHO, In Hee
摘要： An epoxy resin composition having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin composition can be increased because the epoxy resin has a mesogen structure that facilitates crystallizability. In addition, a high radiant heat board can be provided by using the above-mentioned epoxy resin as an insulating material for a printed circuit board.
-
3.发明公开RADIANT HEAT CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME, HEAT GENERATING DEVICE PACKAGE HAVING THE SAME, AND BACKLIGHT 审中-公开辐射热电路板，制造方法，具有发热装置及背光PACKAGE
公开(公告)号：EP2628176A2
公开(公告)日：2013-08-21
申请号：EP11832720.4
申请日：2011-10-10
申请人： LG Innotek Co., Ltd.
发明人： PARK, Hyun Gyu , CHO, In Hee , AN, Yun Ho , PARK, Jae Man , KIM, Eun Jin , KIM, Hae Yeon , LEE, Hyuk Soo
CPC分类号： H05K7/205 , F21V29/70 , G02F1/133615 , H01L23/3677 , H01L25/0753 , H01L33/647 , H01L2224/16225 , H05K1/0204 , H05K1/056 , H05K1/113 , H05K3/30 , H05K3/4608 , H05K13/00 , H05K2201/09054 , H05K2201/10106 , H05K2201/10969 , Y10T29/4913
摘要： Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate comprising an integrated metal projection to which the plurality of heat generating devices are attached, an insulation member exposing the integrated metal projection, the insulation member comprising a plurality of insulation layers disposed on the metal plate, and first and second electrode pads disposed on the insulation member, the first and second electrode pads disposed being electrically separated from each other. The first and second electrode pads receives a voltage from circuit wires disposed on the insulation layers different from each other of the insulation member. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.
-
公开(公告)号：EP2710075B1
公开(公告)日：2019-10-16
申请号：EP12789163.8
申请日：2012-05-21
申请人： LG Innotek Co., Ltd.
发明人： PARK, Jae Man , KIM, Eun Jin , KIM, Hae Yeon , PARK, Hyun Gyu , AN, Yun Ho , CHO, In Hee
-
5.发明公开RADIANT HEAT CIRCUIT BOARD, HEAT GENERATING DEVICE PACKAGE HAVING THE SAME, AND BACKLIGHT UNIT 有权辐射热电路板，具有发热装置及背光单元封装
公开(公告)号：EP2625712A2
公开(公告)日：2013-08-14
申请号：EP11830887.3
申请日：2011-10-05
申请人： LG Innotek Co., Ltd.
发明人： PARK, Hyun Gyu , CHO, In Hee , AN, Yun Ho , PARK, Jae Man , KIM, Eun Jin , KIM, Hae Yeon , LEE, Hyuk Soo
CPC分类号： H05K1/021 , H01L23/3677 , H01L23/49838 , H01L25/0753 , H01L33/642 , H01L2224/73203 , H05K1/0204 , H05K1/056 , H05K2201/09054 , H05K2201/10106
摘要： Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate including an integrated metal projection to which the plurality of heat generating devices are attached, an insulation layer exposing the integrated metal projection, the insulation layer being disposed on the metal plate, and a plurality of electrode pads disposed on the insulation layer, the plurality of electrode pads applying a voltage into each of the heat generating devices. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.
-
公开(公告)号：EP2596691A2
公开(公告)日：2013-05-29
申请号：EP11809828.4
申请日：2011-07-15
申请人： LG Innotek Co., Ltd.
发明人： AN, Yun Ho , KIM, Eun Jin , LEE, Hyuk Soo , PARK, Jae Man , CHO, In Hee , PARK, Hyun Gyu , KIM, Hae Yeon
CPC分类号： H05K1/181 , H01L23/3677 , H01L2224/48227 , H05K1/0204 , H05K1/03 , H05K1/09 , H05K3/0061 , H05K2201/10106 , H05K2203/0369
摘要： Disclosed are a radiant heat circuit board and a method for manufacturing the same. The radiant heat circuit board, which is used to mount a heat emitting device thereon, includes a metallic plate including a metallic protrusion having a solder to which the heat emitting device is attached, a bonding layer on the metallic protrusion, an insulating layer on the metallic plate to expose the metallic protrusion, and a circuit pattern on the insulating layer. Heat emitted from the heat emitting device is directly transferred to the metallic plate by providing the metallic plate including a heat radiation protrusion under the mounting pad, so that heat radiation efficiency is increased. The surface of the heat radiation protrusion is plated with an alloy including copper, thereby improving the adhesive property with respect to the solder, so that the failure rate is reduced.
-
-
-
-
-
搜索结果
6 条记录 (耗时 0.018 秒)
