公开(公告)号：EP4323877A1

公开(公告)日：2024-02-21

申请号：EP22714299.9

申请日：2022-03-11

申请人： QUALCOMM INCORPORATED

发明人： SUH, Jungwon ,  DESHMUKH, Pankaj ,  LO, Michael Hawjing ,  THOZIYOOR, Shyamkumar

IPC分类号： G06F13/16

公开(公告)号：EP4022438A1

公开(公告)日：2022-07-06

申请号：EP20761452.0

申请日：2020-08-11

申请人： QUALCOMM INCORPORATED

发明人： SUH, Jungwon ,  LO, Michael Hawjing ,  CHUN, Dexter Tamio ,  LELOUP, Xavier Loic ,  MOLL, Laurent Rene

IPC分类号： G06F11/10

公开(公告)号：EP3317766A1

公开(公告)日：2018-05-09

申请号：EP16721333.9

申请日：2016-04-27

申请人： Qualcomm Incorporated

发明人： SUH, Jungwon ,  WEST, David Ian

IPC分类号： G06F11/10

CPC分类号： G06F11/1068 ,  G06F11/1048 ,  G11C29/52

摘要： A method of memory array and link error correction in a low power memory sub-system includes embedding error correction code (ECC) parity bits within unused data mask bits during a normal write operation and during a read operation. The method also includes embedding the ECC parity bits in a mask write data byte corresponding to an asserted data mask bit during a mask write operation.

公开(公告)号：EP3108367A1

公开(公告)日：2016-12-28

申请号：EP15708993.9

申请日：2015-02-20

申请人： Qualcomm Incorporated

发明人： CHUN, Dexter T. ,  LI, Yanru ,  DONG, Xiangyu ,  SUH, Jungwon ,  KIM, Jung Pill ,  SRIRAMAGIRI, Deepti Vijayalakshmi

IPC分类号： G06F11/10 ,  G06F12/00

CPC分类号： G11C29/44 ,  G06F11/1048 ,  G06F11/1076 ,  G06F11/2053 ,  G06F12/0246 ,  G06F2212/7209 ,  G11C2029/4402

摘要： Systems, methods, and computer programs are disclosed for kernel masking dynamic random access memory (DRAM) defects. One such method comprises: detecting and correcting a single-bit error associated with a physical address in a dynamic random access memory (DRAM); receiving error data associated with the physical address from the DRAM; storing the received error data in a failed address table located in a non-volatile memory; and retiring a kernel page corresponding to the physical address if a number of errors associated with the physical address exceeds an error count threshold.

公开(公告)号：EP2946302A1

公开(公告)日：2015-11-25

申请号：EP14703970.5

申请日：2014-01-14

申请人： Qualcomm Incorporated

发明人： DONG, Xiangyu ,  SUH, Jungwon

IPC分类号： G06F13/16

CPC分类号： G11C11/40603 ,  G06F12/08 ,  G06F13/1694 ,  Y02D10/14

摘要： Heterogeneous memory systems, and related methods and computer-readable media for supporting heterogeneous memory access requests in processor-based systems are disclosed. A heterogeneous memory system is comprised of a plurality of homogeneous memories that can be accessed for a given memory access request. Each homogeneous memory has particular power and performance characteristics. In this regard, a memory access request can be advantageously routed to one of the homogeneous memories in the heterogeneous memory system based on the memory access request, and power and/or performance considerations. The heterogeneous memory access request policies may be predefined or determined dynamically based on key operational parameters, such as read/write type, frequency of page hits, and memory traffic, as non-limiting examples. In this manner, memory access request times can be optimized to be reduced without the need to make tradeoffs associated with only having one memory type available for storage.

公开(公告)号：EP2622604A1

公开(公告)日：2013-08-07

申请号：EP11767560.3

申请日：2011-09-28

申请人： Qualcomm Incorporated

发明人： HAO, Wuyang ,  SUH, Jungwon ,  LEE, Kangho ,  KIM, Tae Hyun ,  KIM, Jung Pill ,  KANG, Seung H.

IPC分类号： G11C11/16 ,  G11C13/00

CPC分类号： G11C13/0069 ,  G11C11/16 ,  G11C11/1653 ,  G11C11/1659 ,  G11C11/1673 ,  G11C11/1675 ,  G11C13/0002 ,  G11C13/003 ,  G11C2213/72 ,  G11C2213/74

摘要： A resistance -based memory has a two-diode access device. In a particular embodiment, a method includes biasing a bit line (114) and a sense line (112) to generate a current through a resistance -based memory element (110) via a first diode (116) or a second diode (118). A cathode of the first diode is coupled to the bit line and an anode of the second diode is coupled to the sense line.

公开(公告)号：EP2534687A2

公开(公告)日：2012-12-19

申请号：EP11705745.5

申请日：2011-02-08

申请人： Qualcomm Incorporated

发明人： GU, Shiqun ,  NOWAK, Matthew Michael ,  LISK, Durodami J. ,  TOMS, Thomas R. ,  RAY, Urmi ,  SUH, Jungwon ,  CHANDRASEKARAN, Arvind

IPC分类号： H01L25/065 ,  H01L23/48 ,  H01L23/00 ,  H01L23/367 ,  H01L23/528 ,  H01L21/60 ,  H01L23/50

CPC分类号： H01L23/5286 ,  H01L23/3677 ,  H01L23/481 ,  H01L24/05 ,  H01L24/13 ,  H01L24/14 ,  H01L24/48 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05093 ,  H01L2224/13009 ,  H01L2224/13025 ,  H01L2224/13028 ,  H01L2224/131 ,  H01L2224/14505 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/17517 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/81136 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor chip includes an array of electrical contacts and multiple vias coupling at least one circuit in the semiconductor chip to the array of electrical contacts. A first one of the electrical contacts of the array of electrical contacts is coupled to N vias, and a second one of the electrical contacts of the array of electrical contacts is coupled to M vias. M and N are positive integers of different values.

公开(公告)号：EP4423618A1

公开(公告)日：2024-09-04

申请号：EP22800417.2

申请日：2022-10-03

申请人： QUALCOMM INCORPORATED

发明人： THOZIYOOR, Shyamkumar ,  DESHMUKH, Pankaj ,  SUH, Jungwon ,  PALACHARLA, Subbarao

IPC分类号： G06F13/16

CPC分类号： G06F13/1684

公开(公告)号：EP4285202A1

公开(公告)日：2023-12-06

申请号：EP21844434.7

申请日：2021-12-06

申请人： QUALCOMM INCORPORATED

发明人： SUH, Jungwon ,  PARK, Joon Young ,  NAGARAJAN, Mahalingam

IPC分类号： G06F1/3234 ,  G11C5/14 ,  G11C7/10

公开(公告)号：EP3931830A1

公开(公告)日：2022-01-05

申请号：EP20715575.5

申请日：2020-02-28

申请人： QUALCOMM INCORPORATED

发明人： SUH, Jungwon ,  CHUN, Dexter Tamio ,  LO, Michael Hawjing ,  THOZIYOOR, Shyamkumar ,  KUMAR, Ravindra

IPC分类号： G11C7/10 ,  G06F1/3237 ,  G06F1/3234