TRENCH MOS SCHOTTKY DIODE
    6.
    发明公开

    公开(公告)号:EP3588580A1

    公开(公告)日:2020-01-01

    申请号:EP18757087.4

    申请日:2018-02-27

    摘要: One embodiment of the present invention provides a trench MOS Schottky diode 1 which is provided with: a first semiconductor layer 10 which is formed from a Ga 2 O 3 single crystal; a second semiconductor layer 11 which is laminated on the first semiconductor layer 10 and has a trench 12 that opens to a surface 17, while being formed from a Ga 2 O 3 single crystal; an anode electrode 13 which is formed on the surface 17; a cathode electrode 14 which is formed on a surface of the first semiconductor layer 10, said surface being on the reverse side of the second semiconductor layer 11-side surface; an insulating film 15 which covers the inner surface of the trench 12 of the second semiconductor layer 11; and a trench MOS gate 16 which is buried within the trench 12 of the second semiconductor layer 11 so as to be covered by the insulating film 15, while being in contact with the anode electrode 13. The second semiconductor layer 11 is configured from: a lower layer 11b which is on the first semiconductor layer side; and an upper layer 11a which is on the anode electrode 13 side, while having a higher donor concentration than the lower layer 11b.

    Ga2O3-BASED SINGLE CRYSTAL SUBSTRATE
    8.
    发明公开
    Ga2O3-BASED SINGLE CRYSTAL SUBSTRATE 审中-公开
    基于Ga2O3的单晶衬底

    公开(公告)号:EP3178972A1

    公开(公告)日:2017-06-14

    申请号:EP15829189.8

    申请日:2015-08-06

    发明人: SASAKI, Kohei

    IPC分类号: C30B29/16

    CPC分类号: C30B29/16

    摘要: Provided is a Ga 2 O 3 -based single crystal substrate capable of achieving a high processing yield. A Ga 2 O 3 -based single crystal substrate having a crack density of less than 0.05 cracks/cm can be obtained that has as a principal surface thereof a surface rotated 10-150° from the (100) plane, when a rotation direction from the (100) plane to the (001) plane via the (101) plane is defined as positive, having the [010] axis as the rotation axis.

    摘要翻译: 本发明提供能够实现高处理成品率的Ga 2 O 3系单晶基板。 (100)面的旋转方向为(100)面的情况下,可以得到裂纹密度小于0.05个裂纹/ cm的Ga2O3系单晶基板,该单晶基板的主面为从(100)面旋转10〜150°的面 )平面经由(101)平面到(001)平面的距离被定义为正值,具有[010]轴作为旋转轴。

    SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR WAFER, AND METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER

    公开(公告)号:EP4383315A1

    公开(公告)日:2024-06-12

    申请号:EP22853114.1

    申请日:2022-08-03

    摘要: Provided is a gallium oxide-based semiconductor substrate configured to allow the formation, by HVPE, of a gallium oxide-based epitaxial film having a small film thickness distribution, a small donor concentration distribution, and a low crystal defect density. Also provided are a semiconductor wafer including the semiconductor substrate and the epitaxial film, and a method for manufacturing the semiconductor wafer. As one embodiment, provided is a semiconductor substrate 10 in which at least one main surface thereof is a crystal growth base surface 11. The semiconductor substrate 10 comprises a single crystal of a gallium oxide-based semiconductor. The growth base surface 11 is the (001) plane. In a continuous region of 70 area% or more of the growth base surface 11, the off angle in the [010] direction is in the range from greater than -0.3° to -0.01°, or in the range from 0.01° to smaller than 0.3°. In said region of the growth base surface 11, the off angle in the [001] direction is in the range from -1° to 1°. The diameter of the semiconductor substrate 10 is 2 inches or more.