摘要:
[Problem] To provide a Ga 2 O 3 -based high withstand voltage Schottky barrier diode having excellent withstand voltage characteristics. [Solution] According to one embodiment of the present invention, provided is a high withstand voltage Schottky barrier diode 1 having: a first layer 10, which is formed of a first Ga 2 O 3 -based single crystal containing a first Group IV element, and Cl at a concentration equal to or lower than 5×10 16 cm -3 , and which has an effective donor concentration not lower than 1×10 13 but not higher than 6.0×10 17 cm -3 ; a second layer 12, which is formed of a second Ga 2 O 3 -based single crystal containing a second Group IV element, and which has an effective donor concentration that is higher than that of the first layer 10, said second layer being laminated on the first layer 10; an anode electrode 14 formed on the first layer 10; and a cathode electrode 15 formed on the second layer 12.
摘要:
Provided are: a method for efficiently growing a high-quality, large diameter β-Ga 2 O 3 -based single crystal film; and a crystalline layered structure having a β-Ga 2 O 3 -based single crystal film grown using this growing method. As one embodiment, the present invention provides a method for growing a β-Ga 2 O 3 -based single crystal film by using the HVPE method, and including a step for exposing a Ga 2 O 3 -based substrate (10) to a gallium chloride gas and an oxygen-containing gas, and growing a β-Ga 2 O 3 -based single crystal film (12) on the principal surface (11) of the Ga 2 O 3 -based substrate (10) at a growing temperature of 900° C or higher.
摘要翻译:本发明提供:用于有效地生长高质量的方法,大直径²-的Ga 2 O 3系单晶膜; 和具有使用该生长方法生长的²-的Ga 2 O 3系单晶膜的结晶层状结构。 作为一个实施例,本发明提供了一种方法,用于通过利用HVPE法生长²-的Ga 2 O 3系单晶的电影,并且包括用于曝光的Ga 2 O 3系基材(10),以镓的工序 氯化物气体和基底物在生长温度气体,和Ga的2 O 3(10)的主表面(11)上生长²-的Ga 2 O 3系单晶膜(12)的含氧 900℃或更高。
摘要:
Provided are: a semiconductor substrate comprising a β-Ga 2 O 3 single crystal, on which an epitaxial layer comprising a β-Ga 2 O 3 single crystal can be made to grow at a high growth rate using the hydride vapor phase epitaxy (HVPE) method; an epitaxial wafer comprising such semiconductor substrate and epitaxial layer; and a method for manufacturing such epitaxial wafer. As one embodiment of the present invention, provided is a semiconductor substrate (11), used as a base substrate for epitaxial crystal growth by the HVPE method, wherein the semiconductor substrate comprises a β-Ga 2 O 3 -based single crystal and a plane parallel to the [010] axis of the β-Ga 2 O 3 single crystal is used as the principal surface.
摘要翻译:本发明提供:包括²-Ga 2 O 3单晶的半导体衬底,其上可以使用氢化物气相外延(HVPE)在其上以高生长速率生长包含²-Ga 2 O 3单晶的外延层 ) 方法; 包括这种半导体衬底和外延层的外延晶片; 以及这种外延晶片的制造方法。 作为本发明的一个实施方案,提供了一种半导体衬底(11),其用作通过HVPE方法进行外延晶体生长的基底衬底,其中半导体衬底包括基于Θ-Ga 2 O 3的单晶和平面 平行于Θ-Ga 2 O 3单晶的[010]轴作为主面。
摘要:
[Problem] To provide a Ga 2 O 3 -based high withstand voltage Schottky barrier diode having excellent withstand voltage characteristics. [Solution] According to one embodiment of the present invention, provided is a high withstand voltage Schottky barrier diode 1 having: a first layer 10, which is formed of a first Ga 2 O 3 -based single crystal containing a first Group IV element, and Cl at a concentration equal to or lower than 5×10 16 cm -3 , and which has an effective donor concentration not lower than 1×10 13 but not higher than 6.0×10 17 cm -3 ; a second layer 12, which is formed of a second Ga 2 O 3 -based single crystal containing a second Group IV element, and which has an effective donor concentration that is higher than that of the first layer 10, said second layer being laminated on the first layer 10; an anode electrode 14 formed on the first layer 10; and a cathode electrode 15 formed on the second layer 12.
摘要翻译:[问题]提供具有优异的耐电压特性的Ga 2 O 3基高耐压肖特基势垒二极管。 根据本发明的一个实施例,提供了一种高耐压肖特基势垒二极管1,其具有:第一层10,其由包含第一IV族元素的第一Ga 2 O 3基单晶形成, 等于或低于5×1016cm-3的浓度,并且具有不小于1×1013但不大于6.0×1017cm-3的有效施主浓度; 第二层12,其由包含第二IV族元素的第二基于Ga 2 O 3的单晶形成,并且具有比第一层10更高的有效施主浓度,所述第二层被层压在第一层上 10; 形成在第一层10上的阳极电极14; 和形成在第二层12上的阴极电极15。
摘要:
[Problem] To provide a crystal laminate structure having a β-Ga 2 O 3 based single crystal film in which a dopant is included throughout the crystal and the concentration of the dopant can be set across a broad range. [Solution] In one embodiment of the present invention, provided is a crystal laminate structure 1 which includes: a Ga 2 O 3 based substrate 10; and a β-Ga 2 O 3 based single crystal film 12 formed by epitaxial crystal growth on a primary face 11 of the Ga 2 O 3 based substrate 10 and including Cl and a dopant doped in parallel with the crystal growth at a concentration of 1 × 10 13 to 5.0 × 10 20 atoms/cm 3 .
摘要翻译:[问题]提供一种具有β-Ga 2 O 3系单晶膜的结晶层叠结构,其中在整个晶体中包含掺杂剂并且掺杂剂的浓度可以在宽范围内设定。 解决方案在本发明的一个实施例中,提供了一种晶体层压结构1,其包括:基于Ga 2 O 3的基板10; 以及在Ga 2 O 3系基板10的主面11上通过外延生长而形成的β-Ga 2 O 3系单晶膜12,其包含Cl和以1×10 13〜5.0×10 20的浓度与晶体生长平行地掺杂的掺杂剂 原子/ cm 3。
摘要:
A nitride semiconductor crystal has a diameter of four inches or more and is warped to have a curvature radius of 100 m or more, and has an impurity concentration of 1 × 10 17 /cm 3 or lower. A manufacturing method for a nitride semiconductor crystal includes providing a substrate, feeding a gallium trihalide gas having a partial pressure of 9.0 × 10 -3 atm or higher onto the substrate, and growing a GaN crystal in the -C-axis direction on the substrate, where a growth temperature for the GaN crystal is 1200°C or higher, or a manufacturing method for a nitride semiconductor crystal includes providing a substrate, feeding an aluminum trihalide gas having a partial pressure of 9.0 × 10 -3 atm or higher onto the substrate, and growing an AlN crystal in the -C-axis direction on the substrate, where a growth temperature for the AlN crystal is 1400°C or higher.
摘要:
This invention provides a selfsupporting substrate which consists of a n-type conductive aluminum nitride semiconductor crystal and is useful for manufacturing the vertical conductive type AlN semiconductor device. The n-type conductive aluminum nitride semiconductor crystal, by which the selfsupporting substrate is made up, contains Si atom at a concentration of 1×10 18 to 5×10 20 cm -3 , is substantially free from halogen atoms, and substantially does not absorb the light having the energy of not more than 5.9 eV. The selfsupporting substrate can be obtained by a method comprising the steps of forming an AlN crystal layer on a single crystal substrate such as a sapphire by the HVPE method, preheating the obtained substrate having the AlN crystal layer to a temperature of 1,200°C or more, forming a second layer consisting of the n-type conductive aluminum nitride semiconductor crystal is formed on the AlN crystal layer in high rate by the HVPE method and separating the second layer from the obtained laminate.
摘要翻译:本发明提供一种由n型导电氮化铝半导体晶体组成的自支撑衬底,并且可用于制造垂直导电型AlN半导体器件。 构成自支撑衬底的n型导电氮化铝半导体晶体含有浓度为1×10 18至5×10 20 cm -3的Si原子,基本上不含卤素原子,并且基本上不 吸收能量不超过5.9 eV的光。 可以通过包括以下步骤的方法获得自支撑衬底:通过HVPE法在诸如蓝宝石的单晶衬底上形成AlN晶体层的步骤,将获得的具有AlN晶体层的衬底预热至1200℃或更高的温度 通过HVPE法在AlN晶体层上高速率地形成由n型导电氮化铝半导体晶体构成的第二层,并将第二层从得到的层压体分离。
摘要:
The present invention relates to an aluminum nitride single crystal characterized in that the concentration of carbon is 1x10 14 atoms/cm 3 , the concentration of chlorine is 1x10 14 to 1x10 17 atoms/cm 3 , and the absorption coefficient at a wavelength of 265 nm is 40 cm -1 or less.
摘要翻译:本发明涉及一种氮化铝单晶,其特征在于碳的浓度为1×10 14原子/ cm 3,氯的浓度为1×10 14至1×10 17原子/ cm 3,波长为265nm的吸收系数 为40cm -1以下。
摘要:
The present invention provides a self-supporting substrate obtained by the steps of: forming an Al-based group-III nitride thin-layer having a thickness in the range of 3-200 nm on a base substrate made of a single crystal of an inorganic substance which substantially does not decompose at 800 °C in an inert gas atmosphere and which does produce volatiles by decomposition when contacting with a reducing gas in a temperature range of 800-1600 °C, for example sapphire; forming voids along the interface between the base substrate and the Al-based group-III nitride thin-layer of the obtained laminated substrate by thermally treating the laminated substrate in a temperature range of 800-1600 °C in a reducing gas atmosphere containing ammonia gas; forming a group-III nitride single crystal thick-layer on the Al-based group-III nitride thin-layer; and separating these formed layers. The self-supporting substrate is a self-supporting substrate of the group-III nitride single crystal such as AlN, which is suitably used for forming a semiconductor device such as ultraviolet light emitting device and of which crystal plane shows a large radius of curvature.
摘要:
There is provided a method capable of obtaining an aluminum-based group III nitride crystal layer having a smooth surface and high crystallinity by employing only HVPE in which inexpensive raw materials can be used to reduce production costs and high-speed film formation is possible without employing MOVPE. To produce a group III nitride crystal by HVPE comprising the step of growing a group III nitride crystal layer by vapor-phase growth on a single crystal substrate by contacting the heated single crystal substrate with a raw material gas containing a group III halide and a compound having a nitrogen atom, the group III nitride crystal is grown by vapor-phase growth on the single crystal substrate heated at a temperature of 1,000°C or more and less than 1,200°C to form an intermediate layer and then, a group III nitride crystal is further grown by vapor-phase growth on the intermediate layer on the substrate heated at a temperature of 1,200°C or higher.