公开(公告)号：EP2785634A1

公开(公告)日：2014-10-08

申请号：EP12816161.9

申请日：2012-11-29

申请人： Qualcomm Mems Technologies, Inc.

发明人： SHENOY, Ravindra V.

IPC分类号： B81C1/00

CPC分类号： B81C1/00047 ,  B81B2203/0315 ,  B81B2207/092 ,  B81B2207/095 ,  B81C1/00301 ,  B81C2203/0127

摘要： This disclosure provides systems, methods and apparatus for providing packaged microelectromechanical systems (MEMS) devices. In one aspect, package can include a cover glass joined to a device substrate, the cover glass including integrated electrical connectivity and configured to encapsulate one or more MEMS devices on the device substrate. The cover glass can include one or more spin-on glass layers and electrically conductive routing and interconnects. The package can include a narrow seal surrounding the one or more encapsulated MEMS devices.

公开(公告)号：EP1837305B1

公开(公告)日：2013-02-13

申请号：EP07104525.6

申请日：2007-03-20

申请人： Teledyne Dalsa Semiconductor Inc.

发明人： Ouellet, Luc ,  Giard, Veronique ,  Archambault, Sylvie ,  Ignatiuk, Paul

IPC分类号： B81C1/00

CPC分类号： B81C1/00269 ,  B81C2203/0127 ,  B81C2203/019 ,  B81C2203/036

公开(公告)号：EP1280617A4

公开(公告)日：2005-08-03

申请号：EP01934877

申请日：2001-04-17

申请人： PENN STATE RES FOUND

发明人： FONASH STEPHEN J ,  KALKAN ALI KAAN ,  BAE SANGHOON ,  HAYES DAN ,  NAM WOOK JUN ,  CHANG KYUHWAN ,  LEE YOUNGCHUL

IPC分类号： B81B3/00 ,  B81C1/00 ,  C23C16/24 ,  C23C16/511 ,  H01L21/306 ,  H01M8/02 ,  B05D5/12

CPC分类号： B81C1/0038 ,  B81C99/008 ,  B81C2201/0109 ,  B81C2201/0115 ,  B81C2203/0127 ,  C23C16/24 ,  C23C16/511

摘要： This invention uses large surface to volume ratio materials for separation, release layer, and sacrificial material applications. The invention outlines the material concept, application designs, and fabrication methodologies. The invention is demonstrated using deposited column/void network materials as examples of large surface to volume ratio materials. In a number of the specific applications discussed, it is shown that it is advantageous to create structures on a laminate on a mother substrate and then, using the separation layer material approach, to separate this laminate from the mother substrate using the present separation scheme. It is also shown that the present materials have excellent release layer utility. In a number of applications it is also shown how the approach can be used to uniquely form cavities, channels, air-gaps, and related structures in or on various substrates. Further, it is demonstrated that it also can be possible and advantageous to combine the schemes for cavity formation with the scheme for laminate separation.

公开(公告)号：EP3207568A4

公开(公告)日：2017-09-20

申请号：EP15886930

申请日：2015-04-01

申请人： GOERTEK INC

发明人： ZOU QUANBO ,  WANG ZHE

IPC分类号： H01L25/16 ,  H01L25/00

CPC分类号： B81C1/00896 ,  B81C2201/0194 ,  B81C2203/01 ,  B81C2203/0127 ,  H01L25/50 ,  H01L2224/81005 ,  H01L2924/1461

摘要： A transfer method, manufacturing method, device and electronic apparatus of MEMS. The method for MEMS transfer, comprising: depositing a laser-absorbing layer on a first surface of a laser-transparent carrier; forming a MEMS structure on the laser-absorbing layer; attaching the MEMS structure to a receiver; and performing a laser lift-off from the side of the carrier, to remove the carrier. A transfer of high-quality MEMS structure can be achieved in a simple, low cost manner.

摘要翻译： MEMS的传输方法，制造方法，装置和电子设备。 该MEMS传输方法包括：在激光透明载体的第一表面上沉积激光吸收层; 在激光吸收层上形成MEMS结构; 将MEMS结构附接到接收器; 并且从载体侧执行激光剥离以去除载体。 可以以简单，低成本的方式实现高质量MEMS结构的转移。

公开(公告)号：EP1356510B1

公开(公告)日：2009-07-08

申请号：EP02729352.1

申请日：2002-01-08

申请人： Silverbrook Research Pty. Limited

发明人： SILVERBROOK, Kia,

IPC分类号： H01L21/822 ,  H01L23/04

CPC分类号： B81C1/00333 ,  B29C33/0022 ,  B29C33/3842 ,  B29C43/36 ,  B29C2035/0822 ,  B29C2043/503 ,  B81C2203/0109 ,  B81C2203/0127 ,  H01L21/50 ,  H01L2224/48463 ,  H01L2924/1461 ,  Y10S257/924 ,  H01L2924/00

摘要： The invention is a method of applying an array (134) of caps to a wafer (144) of semiconductor material which includes a plurality of microfabricated devices (146). The method includes applying the array (134) of first caps substantially simultaneously to one side of the wafer (144), bonding the array (134) of caps to the wafer(144) and then separating the wafer into individual packages (148).

摘要翻译： 本发明是一种将盖的阵列（134）施加到包括多个微制造器件（146）的半导体材料的晶片（144）的方法。 该方法包括将第一帽的阵列（134）基本同时地施加到晶片（144）的一侧，将帽的阵列（134）结合到晶片（144），然后将晶片分离成单独的封装（148）。

公开(公告)号：EP1356513A4

公开(公告)日：2006-05-17

申请号：EP02729353

申请日：2002-01-08

申请人： SILVERBROOK RES PTY LTD

发明人： SILVERBROOK KIA

IPC分类号： B29C43/36 ,  B29C51/08 ,  B29C35/08 ,  B29C43/18 ,  B29C43/50 ,  B29L31/56 ,  B81B7/00 ,  B81C1/00 ,  H01L21/48 ,  H01L21/50 ,  H01L23/02 ,  H01L23/04 ,  H01L23/08

CPC分类号： B29C43/18 ,  B29C33/0022 ,  B29C35/0272 ,  B29C35/0888 ,  B29C43/36 ,  B29C2035/0822 ,  B29C2043/503 ,  B29K2105/256 ,  B81C1/00269 ,  B81C2203/0109 ,  B81C2203/0127 ,  H01L21/4803 ,  H01L2924/16235

摘要： The invention is a method of forming an array of caps for attachment to a wafer which includes a plurality of microfabricated devices. The method includes sandwiching a sheet (134) of thermoplastic material between upper and lower molds (102, 104), heating the sheet to a plastic state and molding the sheet into caps. The molds (102, 104) are preferably formed of silicon and infrared radiation is preferably used to heat the sheet (134).

摘要翻译： 本发明是形成用于连接到晶片的盖阵列的方法，该晶片包括多个微加工器件。 该方法包括将热塑性材料的片材（134）夹在上模具（102）和下模具（104）之间，将片材加热至塑性状态并将薄片模制成盖子。 模具（102,104）优选地由硅形成，并且红外辐射优选用于加热片材（134）。

公开(公告)号：EP1356511A1

公开(公告)日：2003-10-29

申请号：EP02729355.4

申请日：2002-01-08

申请人： Silverbrook Research Pty. Limited

发明人： SILVERBROOK, Kia

IPC分类号： H01L21/822 ,  H01L23/04

CPC分类号： B81C1/00333 ,  B29C33/0022 ,  B29C43/36 ,  B29C2035/0822 ,  B29C2043/503 ,  B81C1/00904 ,  B81C2201/034 ,  B81C2203/0109 ,  B81C2203/0127 ,  H01L21/4803 ,  H01L23/04 ,  H01L2924/0002 ,  H01L2924/16235 ,  H01L2924/00

摘要： Caps (156, 160) are bonded to one or both sides of a wafer (150) to overlay in plan view all or part of a microfabricated device or group of devices (152). One or more etches (164) are applied from the cap side to remove material and to separate the wafer (150) into discrete units.

公开(公告)号：EP0828346A2

公开(公告)日：1998-03-11

申请号：EP97114496.9

申请日：1997-08-21

申请人： HARRIS CORPORATION

发明人： Salatino, Matthew ,  Begley, Patrick ,  Young, William R.

IPC分类号： H03H9/05

CPC分类号： B81C1/00333 ,  B29C33/0022 ,  B29C43/36 ,  B81C2203/0109 ,  B81C2203/0118 ,  B81C2203/0127 ,  H01L23/10 ,  H01L27/14618 ,  H01L2924/0002 ,  H01L2924/01079 ,  H03H9/0547 ,  H01L2924/00

摘要： A wafer level hermetically packaged integrated circuit has a protective cover wafer bonded to a semiconductor device substrate wafer. The cover wafer seals integrated circuits and other devices including air bridge structures, resonant beams, surface acoustic wave (SAW) devices, trimmable resistors, and micromachines. Some devices, such as SAWs, are formed on the surface of cavities formed in the protective cover wafer. Die are separated to complete the process.

摘要翻译： 晶圆级密封封装集成电路具有结合到半导体器件衬底晶片的保护盖晶片。 覆盖晶片密封集成电路和其他装置，包括空气桥结构，谐振梁，表面声波（SAW）装置，可微调电阻器和微型机械。 诸如SAW的一些装置形成在保护盖晶片中形成的空腔的表面上。 模具分开完成该过程。

公开(公告)号：EP1356513B1

公开(公告)日：2010-10-27

申请号：EP02729353.9

申请日：2002-01-08

申请人： Silverbrook Research Pty. Limited

发明人： SILVERBROOK, Kia, Silverbrook Research Pty Ltd

IPC分类号： B29C43/36 ,  H01L21/48 ,  H01L23/04 ,  B81B7/00

CPC分类号： B29C43/18 ,  B29C33/0022 ,  B29C35/0272 ,  B29C35/0888 ,  B29C43/36 ,  B29C2035/0822 ,  B29C2043/503 ,  B29K2105/256 ,  B81C1/00269 ,  B81C2203/0109 ,  B81C2203/0127 ,  H01L21/4803 ,  H01L2924/16235

摘要： The invention is a method of forming an array of caps for attachment to a wafer which includes a plurality of microfabricated devices. The method includes sandwiching a sheet (134) of thermoplastic material between upper and lower molds (102, 104), heating the sheet to a plastic state and molding the sheet into caps. The molds (102, 104) are preferably formed of silicon and infrared radiation is preferably used to heat the sheet (134).

公开(公告)号：EP1356511B1

公开(公告)日：2009-01-07

申请号：EP02729355.4

申请日：2002-01-08

申请人： Silverbrook Research Pty. Limited

发明人： SILVERBROOK, Kia

IPC分类号： H01L21/822 ,  H01L23/04

CPC分类号： B81C1/00333 ,  B29C33/0022 ,  B29C43/36 ,  B29C2035/0822 ,  B29C2043/503 ,  B81C1/00904 ,  B81C2201/034 ,  B81C2203/0109 ,  B81C2203/0127 ,  H01L21/4803 ,  H01L23/04 ,  H01L2924/0002 ,  H01L2924/16235 ,  H01L2924/00

摘要： Caps (156, 160) are bonded to one or both sides of a wafer (150) to overlay in plan view all or part of a microfabricated device or group of devices (152). One or more etches (164) are applied from the cap side to remove material and to separate the wafer (150) into discrete units.