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    Multifunction lead frame and integrated circuit package incorporating the same
    5.
    发明公开
    Multifunction lead frame and integrated circuit package incorporating the same 审中-公开
    多功能梯架和壳体具有相同的集成电路

    公开(公告)号：EP1091404A1

    公开(公告)日：2001-04-11

    申请号：EP00308675.8

    申请日：2000-10-03

    申请人： LUCENT TECHNOLOGIES INC.

    发明人： Lotfi, Ashraf W. ,  Weld, John D.

    IPC分类号： H01L23/495

    CPC分类号： H01L23/49541 ,  H01F2021/125 ,  H01L23/642 ,  H01L23/645 ,  H01L2924/0002 ,  Y10S257/924 ,  H01L2924/00

    摘要： The present invention provides a lead frame for use in packaging a circuit having a discrete component, and a method of manufacture thereof. In one embodiment, the lead frame includes a lead support structure and a plurality of severable leads that are coupled to the lead support structure. The plurality of severable leads extend inward from the lead support structure to predetermined locations corresponding to terminals of the discrete component.

    摘要翻译： 本发明提供了用于包装具有分立部件的电路，及其制造方法中使用的引线框架。 在一个中，实施例引线框架包括一个引线支撑结构和割断引线的多元性也被耦合到引线的支撑结构。 可割断的引线的多个从所述引线支撑结构向内延伸到对应于分立元件的终端的预定位置。

    INTEGRATED RESISTOR NETWORKS HAVING REDUCED CROSS TALK
    6.
    发明公开
    INTEGRATED RESISTOR NETWORKS HAVING REDUCED CROSS TALK 失效
    INTEGRIERTE WIDERSTANDSNETZWERKE MIT REDUZIERTENÜFASPRACHEN

    公开(公告)号：EP0870331A4

    公开(公告)日：1999-01-07

    申请号：EP96936209

    申请日：1996-10-04

    申请人： MICRO DEVICES CORP CALIFORNIA

    发明人： KALB JEFFREY C ,  HARIHARAN PERUVAMBA ,  HURD JOHN D ,  DUNCAN GREGG

    IPC分类号： H01C13/00 ,  H01L21/822 ,  H01L27/04 ,  H01L27/08 ,  H01L29/00 ,  H01L23/48 ,  H01L29/40

    CPC分类号： H01L27/0802 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  Y10S257/924 ,  H01L2924/00014 ,  H01L2924/00

    摘要： An integrated circuit for implementing a resistor network on a die of the integrated circuit. The integrated circuit includes a common conductor (302), which is disposed on a first side of the die and coupled to resistors (R1...R22) of the resistor network. The integrated circuit further includes a substantially conductive substrate through the die. There is further included a conductive back side contact coupled to the substantially conductive substrate, whereby the common conductor, the substantially substrate, and the conductive back side contact form a common conducting bus from the common conductor to the conductive back side contact through the die.

    摘要翻译： 一种用于在集成电路的管芯上实现电阻器网络的集成电路。 集成电路包括公共导体，其布置在管芯的第一侧并且耦合到电阻器网络的电阻器。 集成电路还包括通过管芯的基本导电的衬底。 还包括耦合到基本导电的衬底的导电背面接触。 导电背侧接触件设置在与第一侧相对的模具的第二侧上，由此公共导体，基本上导电的基板和导电背面接触形成从公共导体到导电背侧接触件的公共导电总线 通过死亡。

    Kontaktloses elektronisches Modul
    7.
    发明公开
    Kontaktloses elektronisches Modul 失效
    非接触式电子模块

    公开(公告)号：EP0710919A2

    公开(公告)日：1996-05-08

    申请号：EP95116421.9

    申请日：1995-10-18

    申请人： Giesecke & Devrient GmbH

    发明人： Hoppe, Joachim ,  Hohmann, Arno

    IPC分类号： G06K13/077

    CPC分类号： H01Q1/2225 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/07779 ,  G06K19/07781 ,  H01L2224/48091 ,  H01L2924/01068 ,  H01Q1/22 ,  Y10S257/924 ,  H01L2924/00014

    摘要： Es wird ein elektronisches Modul zum Einbau in einen Datenträger beschrieben, wobei das elektronische Modul einen auf einem Träger des Moduls angeordneten integrierten Schaltkreis aufweist, der leitend mit einer Spule für den berührungslosen Datenaustausch verbunden ist. Um derartige elektronische Module einfach herstellbar und kostengünstiger zu gestalten, wird beim erfindungsgemäßen Modul auf ein zusätzliches separates Substrat zur Aufnahme des integrierten Schaltkreises und der Spule gänzlich verzichtet.

    摘要翻译： 有将在数据载体（1），其中，所述电子模块包括布置集成（4）电路的模块，其导电地连接到一个线圈（22）的载体上用于非接触式的数据交换进行说明的电子模块（31），用于安装 ， 为了简化这种电子模块的制造和成本有效的，完全是与用于接收所述集成电路和所述线圈的额外的单独的衬底本发明的模块分配。

    Semiconductor device and manufacturing method of the same
    9.
    发明公开
    Semiconductor device and manufacturing method of the same 审中-公开
    半导体器件及其制造方法

    公开(公告)号：EP1484796A3

    公开(公告)日：2008-03-12

    申请号：EP04013033.8

    申请日：2004-06-02

    申请人： SANYO ELECTRIC CO., LTD.

    发明人： Ikeda, Osamu ,  Ohkoda, Toshiyuki

    IPC分类号： H01L23/31

    CPC分类号： B81B7/007 ,  B81C2203/0118 ,  H01L27/14618 ,  H01L27/1462 ,  H01L27/14806 ,  H01L2924/16235 ,  Y10S257/924

    摘要： This invention miniaturizes a package of a semiconductor device and simplifies a manufacturing procedure to reduce a manufacturing cost. A semiconductor wafer (30A) formed of a plurality of semiconductor chips (10A) formed with MEMS devices (11A) and wiring (13) thereof on front surface thereof and a cap arrayed wafer (40A) disposed with a plurality of sealing caps (20A) are attached to seal the MEMS devices (11A) in cavities (CV) between them. Then, a plurality of via-holes (13) is provided penetrating through the semiconductor wafer (30A) to form embedded electrodes (14) therein, and bump electrodes (15) are formed thereon. After this procedure, this structure is cut along scribe lines (L) to be divided into each of packages.

    MICRO-ELECTROMECHANICAL VARACTOR WITH ENHANCED TUNING RANGE
    10.
    发明公开
    MICRO-ELECTROMECHANICAL VARACTOR WITH ENHANCED TUNING RANGE 审中-公开
    微机电变容二极管与放大TUNING

    公开(公告)号：EP1556949A2

    公开(公告)日：2005-07-27

    申请号：EP03769489.0

    申请日：2003-09-18

    申请人： International Business Machines Corporation ,  Compagnie IBM France

    发明人： CHINTHAKINDI, Anil, K. ,  GROVES, Robert, A. ,  STEIN, Kenneth, J. ,  SUBBANNA, Seshadri ,  VOLANT, Richard, P.

    IPC分类号： H03J3/18 ,  B81B3/00 ,  H01G5/16

    CPC分类号： H01G5/18 ,  B81B2201/01 ,  H01G5/011 ,  Y10S257/924

    摘要： A three-dimensional micro-electromechanical (MEM) varactor is described wherein a movable beam (50) and fixed electrodes (51) are respectively fabricated on separate substrates coupled to each other. The movable beam with comb-drive electrodes are fabricated on the 'chip side' while the fixed bottom electrode is fabricated on a separated substrate 'carrier side'. Upon fabrication of the device on both surfaces of the substrate, the chip side device is diced and 'flipped over', aligned and joined to the 'carrier' substrate to form the final device. Comb-drive (fins) electrodes are used for actuation while the motion of the electrode provides changes in capacitance. Due to the constant driving forces involved, a large capacitance tuning range can be obtained. The three dimensional aspect of the device avails large surface area. When large aspect ratio features are provided, a lower actuation voltage can be used. Upon fabrication, the MEMS device is completely encapsulated, requiring no additional packaging of the device. Further, since alignment and bonding can be done on a wafer scale (wafer scale MEMS packaging), an improved device yield can be obtained at a lower cost.