专利检索 cpc:"H01L2224/1301720130101" 第 1 页

1.

发明公开
INTEGRATED DEVICE COMPRISING PILLAR INTERCONNECTS WITH VARIABLE SHAPES 审中-实审

公开(公告)号：EP4402718A1

公开(公告)日：2024-07-24

申请号：EP22773047.0

申请日：2022-08-15

申请人： Qualcomm Incorporated

发明人： CHEN, Yujen , HSU, Hung-Yuan , HE, Dongming

IPC分类号： H01L23/485 , H01L21/60

CPC分类号： H01L24/13 , H01L2224/1301720130101 , H01L2224/1301820130101 , H01L2224/0556920130101 , H01L2224/040120130101 , H01L2224/02320130101 , H01L2224/1302420130101 , H01L2224/1301320130101 , H01L2224/1301420130101 , H01L2224/0500520130101 , H01L2924/18120130101 , H01L2224/13120130101 , H01L2224/1622720130101 , H01L24/05 , H01L2924/351220130101 , H01L24/14 , H01L2224/1405120130101 , H01L2224/114620130101 , H01L2224/1147420130101 , H01L2224/1190320130101 , H01L2224/1190120130101 , H01L2224/0391220130101 , H01L2224/036120130101 , H01L2224/1184920130101 , H01L2224/113220130101 , H01L2224/1329420130101 , H01L2224/13320130101 , H01L2224/9420130101 , H01L2224/8181520130101 , H01L24/94 , H01L24/03 , H01L24/02 , H01L24/11 , H01L24/16 , H01L24/81

2.

发明授权
STACKED DEVICE AND METHOD OF PRODUCING SAME 有权

公开(公告)号：EP2966680B1

公开(公告)日：2024-08-28

申请号：EP13877188.6

申请日：2013-03-07

IPC分类号： H01L25/065 , H01L23/498 , H01L23/14 , H01L23/544 , H01L21/60 , H01L21/98

CPC分类号： H01L23/147 , H01L23/49816 , H01L23/49827 , H01L23/544 , H01L25/0657 , H01L25/0655 , H01L25/50 , H01L2223/544220130101 , H01L2223/5442620130101 , H01L2223/5447320130101 , H01L2223/5448620130101 , H01L2924/1519220130101 , H01L2225/0651320130101 , H01L2225/0659320130101 , H01L2924/0132220130101 , H01L2224/3222520130101 , H01L2224/7320420130101 , H01L24/13 , H01L24/81 , H01L2224/034620130101 , H01L2224/034720130101 , H01L2224/0564420130101 , H01L2224/1013520130101 , H01L2224/1016520130101 , H01L2224/1144420130101 , H01L2224/114720130101 , H01L2224/1301720130101 , H01L2224/1302320130101 , H01L2224/1314420130101 , H01L2224/140320130101 , H01L2224/1614820130101 , H01L2224/8100720130101 , H01L2224/8114320130101 , H01L2224/8119120130101 , H01L2224/8120320130101 , H01L2224/8198620130101 , H01L2224/810920130101 , H01L2224/0556820130101 , H01L2224/8114120130101 , H01L2224/040120130101 , H01L2224/113420130101 , H01L2224/1751720130101 , H01L24/06 , H01L24/17 , H01L2224/0212620130101 , H01L2224/021520130101 , H01L2224/0515520130101 , H01L2224/0558220130101 , H01L2224/060320130101 , H01L2224/0605120130101 , H01L2224/1301320130101 , H01L2224/1301420130101 , H01L2224/1623820130101 , H01L2224/8100220130101 , H01L2224/811420130101 , H01L2224/9514620130101 , H01L2224/9720130101 , H01L2224/1705120130101 , H01L24/11 , H01L24/14

3.

发明授权
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFOR 有权

公开(公告)号：EP3940772B1

公开(公告)日：2024-07-17

申请号：EP20893357.2

申请日：2020-06-15

IPC分类号： H01L23/485 , H01L21/60 , H01L23/31

CPC分类号： H01L23/3192 , H01L24/13 , H01L24/11 , H01L2224/1308420130101 , H01L2224/040120130101 , H01L2224/0555820130101 , H01L2224/1301820130101 , H01L2224/1301720130101 , H01L2224/1301620130101 , H01L2224/1190320130101 , H01L2224/1314720130101 , H01L2224/8181520130101 , H01L2224/1014520130101 , H01L2224/13120130101 , H01L2224/0564720130101 , H01L2224/0556820130101 , H01L2224/0557220130101 , H01L2224/034520130101 , H01L2224/0516620130101 , H01L2224/0508220130101 , H01L2224/1146220130101 , H01L2224/114720130101 , H01L2224/1183120130101 , H01L2224/1315520130101 , H01L2224/114520130101 , H01L2224/116120130101 , H01L2224/0391220130101 , H01L2224/036120130101 , H01L2224/11920130101 , H01L24/03 , H01L24/05 , H01L24/81 , H01L2224/130820130101 , H01L2224/1365520130101 , H01L2224/1307620130101 , H01L2924/384120130101 , H01L2924/351120130101 , H01L2224/1623720130101 , H01L2224/1622720130101 , H01L2224/1610520130101 , H01L2224/1605720130101 , H01L2224/1605820130101 , H01L2224/0362220130101 , H01L2224/0512420130101 , H01L2224/0514720130101 , H01L2224/0566620130101 , H01L2224/0568420130101 , H01L2224/1311120130101 , H01L2924/38120130101

4.

发明授权
APPARATUS AND METHOD FOR THE MINIMIZATION OF UNDERCUT DURING A UBM ETCH PROCESS 有权

公开(公告)号：EP3811398B1

公开(公告)日：2024-09-04

申请号：EP19823023.7

申请日：2019-06-20

IPC分类号： G01B11/06 , H01L21/02 , H01L21/66 , H01L21/67 , H01L21/3213 , H01L23/485

CPC分类号： H01L21/67253 , H01L21/67046 , H01L21/6708 , H01L22/26 , H01L21/32134 , H01L22/12 , H01L2224/040120130101 , H01L2224/0391220130101 , H01L2224/114620130101 , H01L2224/114720130101 , H01L2224/1184920130101 , H01L2224/1147220130101 , H01L2224/1301720130101 , H01L2224/036120130101 , H01L2224/0361420130101 , H01L2224/74120130101 , H01L24/03 , H01L24/11 , H01L2224/0520130101 , H01L2224/1302220130101 , H01L2224/1313920130101 , H01L2224/0518420130101 , H01L2224/1315520130101 , H01L2224/1316420130101 , H01L2224/1311620130101 , H01L2224/0564720130101 , H01L2224/0514720130101 , H01L2224/0516620130101 , H01L2224/1311120130101 , H01L2224/1314720130101 , H01L2224/1314420130101 , G01B11/06

5.

发明公开
INTEGRATED DEVICE COMPRISING PILLAR INTERCONNECT WITH CAVITY 审中-实审

公开(公告)号：EP4393010A1

公开(公告)日：2024-07-03

申请号：EP22755331.0

申请日：2022-06-30

申请人： Qualcomm Incorporated

发明人： CHEN, Yujen , HSU, Hung-Yuan , HE, Dongming

IPC分类号： H01L23/485 , H01L21/60

CPC分类号： H01L2924/384120130101 , H01L2224/0556920130101 , H01L2224/1308220130101 , H01L2224/1308320130101 , H01L2224/1307620130101 , H01L2224/1301420130101 , H01L2224/1301220130101 , H01L2224/1301320130101 , H01L2224/1301720130101 , H01L2224/1301820130101 , H01L2224/1622720130101 , H01L2224/1601320130101 , H01L2224/1650320130101 , H01L24/16 , H01L2224/114620130101 , H01L24/13 , H01L24/11 , H01L2224/114720130101 , H01L2224/1190320130101 , H01L2224/1329420130101 , H01L2224/13320130101 , H01L2224/13120130101 , H01L2224/1314720130101 , H01L2224/130820130101 , H01L2224/036120130101 , H01L2224/0391220130101 , H01L2224/1184920130101 , H01L2224/1190120130101 , H01L2224/11920130101 , H01L2224/9420130101 , H01L24/94 , H01L2924/1531120130101 , H01L2224/8181520130101 , H01L2924/18120130101 , H01L2224/040120130101 , H01L24/03 , H01L24/05 , H01L2224/0554820130101 , H01L24/02 , H01L2224/02320130101 , H01L2224/1302420130101 , H01L2224/818120130101 , H01L24/81 , H01L2224/1017520130101 , H01L2224/1147220130101

6.

发明公开
3D PRINTING TECHNIQUES FOR FORMING INTERCONNECTS FOR FLIP-CHIP ASSEMBLIES OR TUNING RESONATORS OF A SEMICONDUCTOR DEVICE 审中-实审

公开(公告)号：EP4364188A2

公开(公告)日：2024-05-08

申请号：EP22747484.8

申请日：2022-06-28

申请人： MACOM Technology Solutions Holdings, Inc.

发明人： LONG, Rathnait , STRUBLE, Wayne , CARLSON, Douglas

IPC分类号： H01L21/60 , H01L23/485 , H03H3/04 , H03H9/05 , H03H3/02 , B33Y10/00 , H01L21/67 , H01L23/31

CPC分类号： H01L2224/1614520130101 , H01L2224/1622720130101 , H01L2224/1301420130101 , H01L2224/1301220130101 , H01L24/11 , H01L24/13 , H01L2224/1301320130101 , H01L23/3171 , H01L2224/1301720130101 , H01L2224/1301920130101 , H01L2224/1301520130101 , H01L2224/039120130101 , H01L24/742 , H01L2224/1131220130101 , H01L2224/1190120130101 , H01L24/14 , H01L2224/1405120130101 , H01L2224/1413520130101 , H03H3/04 , H03H2003/044220130101 , H03H9/0523 , H03H3/02 , H01L24/05 , H01L2224/040120130101 , H01L24/16 , H01L2224/113120130101 , B33Y10/00 , B33Y80/00 , B22F10/10 , H03H2003/02320130101 , H01L2224/0564720130101 , H01L2224/1315720130101 , H01L2224/1317620130101 , H01L2224/1312420130101 , H01L2224/13120130101 , H01L2224/0564420130101 , H01L2224/0568120130101 , H01L2224/0566420130101 , H01L2224/1311120130101 , H01L2224/1314420130101 , H01L2224/0563920130101 , H01L2224/1316620130101 , H01L2224/1318120130101 , H01L2224/1318420130101 , H01L2224/1313920130101 , H01L2224/0568420130101 , H01L2224/0562420130101 , H01L2224/1314720130101