公开(公告)号：EP3271938B1

公开(公告)日：2024-07-10

申请号：EP16706510.1

申请日：2016-02-15

IPC: H01L21/60 ,  H01L23/488 ,  B23K26/20 ,  H01L21/67 ,  H01L23/49 ,  H01L23/485 ,  H01L23/48

CPC classification number: H01L2224/8421420130101 ,  H01L2224/8442420130101 ,  H01L2224/8444720130101 ,  H01L2224/8444420130101 ,  H01L2224/8443920130101 ,  H01L2224/4022520130101 ,  H01L2224/848420130101 ,  H01L2224/4099220130101 ,  H01L2224/3702620130101 ,  H01L24/05 ,  H01L24/16 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/73 ,  H01L24/77 ,  H01L24/81 ,  H01L24/84 ,  H01L2224/0403420130101 ,  H01L2224/0562420130101 ,  H01L2224/0563920130101 ,  H01L2224/0564420130101 ,  H01L2224/0564720130101 ,  H01L2224/0565520130101 ,  H01L2224/0566420130101 ,  H01L2224/1622520130101 ,  H01L2224/3714720130101 ,  H01L2224/7325520130101 ,  H01L2224/8142420130101 ,  H01L2224/8143920130101 ,  H01L2224/8144420130101 ,  H01L2224/8144720130101 ,  H01L2224/8145520130101 ,  H01L2224/8146420130101 ,  H01L2924/0001420130101 ,  H01L2924/1025320130101 ,  H01L2924/1578720130101 ,  H01L2924/157920130101 ,  H01L2224/8446420130101 ,  H01L2224/8445520130101 ,  H01L2224/4009120130101 ,  H01L2224/4049120130101 ,  H01L2224/4099720130101 ,  H01L2224/411220130101 ,  H01L2224/7726320130101 ,  H01L2224/7728120130101 ,  H01L2224/7760120130101 ,  H01L2224/7761120130101 ,  H01L2224/7770420130101 ,  H01L2224/8498620130101 ,  H01L2224/848520130101 ,  H01L2224/4501420130101 ,  H01L24/48 ,  H01L2224/4514720130101

公开(公告)号：EP4364188A2

公开(公告)日：2024-05-08

申请号：EP22747484.8

申请日：2022-06-28

Applicant: MACOM Technology Solutions Holdings, Inc.

Inventor： LONG, Rathnait ,  STRUBLE, Wayne ,  CARLSON, Douglas

IPC: H01L21/60 ,  H01L23/485 ,  H03H3/04 ,  H03H9/05 ,  H03H3/02 ,  B33Y10/00 ,  H01L21/67 ,  H01L23/31

CPC classification number: H01L2224/1614520130101 ,  H01L2224/1622720130101 ,  H01L2224/1301420130101 ,  H01L2224/1301220130101 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/1301320130101 ,  H01L23/3171 ,  H01L2224/1301720130101 ,  H01L2224/1301920130101 ,  H01L2224/1301520130101 ,  H01L2224/039120130101 ,  H01L24/742 ,  H01L2224/1131220130101 ,  H01L2224/1190120130101 ,  H01L24/14 ,  H01L2224/1405120130101 ,  H01L2224/1413520130101 ,  H03H3/04 ,  H03H2003/044220130101 ,  H03H9/0523 ,  H03H3/02 ,  H01L24/05 ,  H01L2224/040120130101 ,  H01L24/16 ,  H01L2224/113120130101 ,  B33Y10/00 ,  B33Y80/00 ,  B22F10/10 ,  H03H2003/02320130101 ,  H01L2224/0564720130101 ,  H01L2224/1315720130101 ,  H01L2224/1317620130101 ,  H01L2224/1312420130101 ,  H01L2224/13120130101 ,  H01L2224/0564420130101 ,  H01L2224/0568120130101 ,  H01L2224/0566420130101 ,  H01L2224/1311120130101 ,  H01L2224/1314420130101 ,  H01L2224/0563920130101 ,  H01L2224/1316620130101 ,  H01L2224/1318120130101 ,  H01L2224/1318420130101 ,  H01L2224/1313920130101 ,  H01L2224/0568420130101 ,  H01L2224/0562420130101 ,  H01L2224/1314720130101

公开(公告)号：EP4141924B1

公开(公告)日：2024-07-24

申请号：EP22193090.2

申请日：2022-08-31

IPC: H01L23/488 ,  H01L21/60 ,  H01L23/00 ,  B23K35/26 ,  B23K35/28

CPC classification number: H01L24/32 ,  H01L24/83 ,  H01L24/29 ,  H01L2224/8382520130101 ,  H01L2224/838120130101 ,  H01L2224/3250720130101 ,  H01L2224/8390720130101 ,  H01L2224/8306520130101 ,  H01L2224/8321120130101 ,  H01L2224/2901720130101 ,  H01L2224/8301120130101 ,  H01L2224/8302220130101 ,  H01L2224/8310120130101 ,  H01L2224/2901920130101 ,  H01L2224/9520130101 ,  H01L2224/3222720130101 ,  H01L2224/3224520130101 ,  H01L2224/0402620130101 ,  H01L2224/271120130101 ,  H01L2224/29120130101 ,  H01L24/27 ,  H01L24/95 ,  H01L2224/3205720130101 ,  B23K35/26 ,  B23K35/262 ,  B23K35/264 ,  B23K35/266 ,  B23K35/282 ,  H01L24/05 ,  H01L2224/0517220130101 ,  H01L2224/2910120130101 ,  H01L2224/2913920130101 ,  H01L2224/2911820130101 ,  H01L2224/0564420130101 ,  H01L2224/8345520130101 ,  H01L2224/0513820130101 ,  H01L2224/0566920130101 ,  H01L2224/2910520130101 ,  H01L2224/8344420130101 ,  H01L2224/8347220130101 ,  H01L2224/0565520130101 ,  H01L2224/0563920130101 ,  H01L2224/0567220130101 ,  H01L2224/2910920130101 ,  H01L2224/8346420130101 ,  H01L2224/0515520130101 ,  H01L2224/0564720130101 ,  H01L2224/8343920130101 ,  H01L2224/8346920130101 ,  H01L2224/0566420130101 ,  H01L2224/2914720130101 ,  H01L2224/0516420130101 ,  H01L2224/8344720130101 ,  H01L2224/2911320130101 ,  H01L2224/291220130101 ,  H01L2224/2911120130101 ,  H01L2224/2914420130101

公开(公告)号：EP3819059B1

公开(公告)日：2024-05-29

申请号：EP20205579.4

申请日：2020-11-04

IPC: B23K1/00 ,  B23K1/19 ,  B23K1/20 ,  B23K20/02 ,  B23K20/16 ,  B23K20/233 ,  B23K101/42

CPC classification number: B23K1/0016 ,  B23K1/19 ,  B23K1/20 ,  B23K20/026 ,  B23K20/16 ,  B23K20/233 ,  B23K2101/4220180801 ,  H01L24/83 ,  H01L24/29 ,  H01L2224/8382520130101 ,  H01L2224/838120130101 ,  H01L24/32 ,  H01L2224/3250320130101 ,  H01L2224/3250720130101 ,  H01L2224/8381520130101 ,  H01L25/50 ,  H01L2224/8319220130101 ,  H01L2224/2733420130101 ,  H01L24/27 ,  H01L2224/8390720130101 ,  H01L2224/3201220130101 ,  H01L2224/3318120130101 ,  H01L2224/7326320130101 ,  H01L2224/8319120130101 ,  H01L2924/143120130101 ,  H01L2924/1220130101 ,  H01L2224/8306520130101 ,  H01L2224/832120130101 ,  H01L2224/2929420130101 ,  H01L2224/9520130101 ,  H01L24/95 ,  H01L2224/9420130101 ,  H01L2224/756520130101 ,  H01L24/05 ,  H01L2224/0402620130101 ,  H01L2224/2900620130101 ,  H01L2224/2900720130101 ,  H01L2224/32120130101 ,  H01L2224/3222720130101 ,  H01L23/49811 ,  H01L2224/3201320130101 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/8319320130101 ,  H01L2224/4022720130101 ,  H01L2224/4009520130101 ,  H01L2224/8482520130101 ,  H01L2224/8481520130101 ,  H01L2224/4049920130101 ,  H01L2224/3224520130101 ,  H01L24/33 ,  H01L2224/330120130101 ,  H01L2224/3350520130101 ,  H01L24/40 ,  H01L24/75 ,  H01L24/84 ,  H01L2224/0516420130101 ,  H01L2224/2743620130101 ,  H01L23/49524 ,  H01L2224/8343820130101 ,  H01L2224/0517220130101 ,  H01L2224/2910120130101 ,  H01L2224/2913920130101 ,  H01L2224/2911820130101 ,  H01L2224/0564420130101 ,  H01L2224/8345520130101 ,  H01L2224/0513820130101 ,  H01L2224/0566920130101 ,  H01L2224/2910520130101 ,  H01L2224/8347220130101 ,  H01L2224/8344420130101 ,  H01L2224/0565520130101 ,  H01L2224/0563920130101 ,  H01L2224/0567220130101 ,  H01L2224/2910920130101 ,  H01L2224/8346420130101 ,  H01L2224/0515520130101 ,  H01L2224/0564720130101 ,  H01L2224/8343920130101 ,  H01L2224/8346920130101 ,  H01L2224/0566420130101 ,  H01L2224/2914720130101 ,  H01L2224/8344720130101 ,  H01L2224/2911320130101 ,  H01L2224/291220130101 ,  H01L2224/0563820130101 ,  H01L2224/2911120130101 ,  H01L2224/2914420130101

公开(公告)号：EP3163613B1

公开(公告)日：2024-08-21

申请号：EP16188869.8

申请日：2016-09-15

IPC: H01L23/485 ,  H01L21/60 ,  H01L25/065 ,  H01L23/31 ,  H01L23/433 ,  H01L23/552 ,  H01L21/98

CPC classification number: H01L2224/0556920130101 ,  H01L2224/1300520130101 ,  H01L2224/8101120130101 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/3192 ,  H01L23/4334 ,  H01L21/561 ,  H01L23/552 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/0500820130101 ,  H01L2224/0554820130101 ,  H01L2224/0556720130101 ,  H01L2224/0561120130101 ,  H01L2224/0562420130101 ,  H01L2224/0563920130101 ,  H01L2224/0564420130101 ,  H01L2224/0564720130101 ,  H01L2224/0565520130101 ,  H01L2224/0566420130101 ,  H01L2224/113220130101 ,  H01L2224/114520130101 ,  H01L2224/1145220130101 ,  H01L2224/114620130101 ,  H01L2224/114720130101 ,  H01L2224/1301320130101 ,  H01L2224/1301420130101 ,  H01L2224/1302220130101 ,  H01L2224/1308220130101 ,  H01L2224/1311120130101 ,  H01L2224/1311320130101 ,  H01L2224/1311620130101 ,  H01L2224/1312420130101 ,  H01L2224/1313920130101 ,  H01L2224/1314420130101 ,  H01L2224/1314720130101 ,  H01L2224/1315520130101 ,  H01L2224/1318420130101 ,  H01L2224/1605720130101 ,  H01L2224/1623820130101 ,  H01L2224/3224520130101 ,  H01L2224/7325320130101 ,  H01L2224/8102420130101 ,  H01L2224/8119120130101 ,  H01L2224/8181520130101 ,  H01L2224/9420130101 ,  H01L2224/9720130101 ,  H01L2924/384120130101 ,  H01L2224/1316620130101 ,  H01L23/49827 ,  H01L2924/18120130101 ,  H01L25/0655

公开(公告)号：EP4352785A1

公开(公告)日：2024-04-17

申请号：EP22738516.8

申请日：2022-05-26

Applicant: MACOM Technology Solutions Holdings, Inc.

Inventor： BARTER, Margaret ,  BOLES, Timothy

IPC: H01L23/544

CPC classification number: H01L23/544 ,  H01L2223/5443320130101 ,  H01L2223/544220130101 ,  H01L2223/5440620130101 ,  H01L2223/5448620130101 ,  H01L2224/0618120130101 ,  H01L2224/0404220130101 ,  H01L2224/0566420130101 ,  H01L2224/0565520130101 ,  H01L2224/0514420130101 ,  H01L2924/3512120130101 ,  H01L2224/4501420130101 ,  H01L24/05 ,  H01L2224/0513920130101 ,  H01L2224/0512420130101 ,  H01L2224/0514720130101 ,  H01L2224/034520130101 ,  H01L2224/034620130101 ,  H01L2224/0556720130101 ,  H01L2924/120320130101 ,  H01L2924/130420130101 ,  H01L2924/130520130101 ,  H01L2924/130620130101 ,  H01L2924/130120130101 ,  H01L2924/1305520130101 ,  H01L2924/1025320130101 ,  H01L24/03 ,  H01L2224/0566620130101

公开(公告)号：EP3619748B1

公开(公告)日：2024-04-17

申请号：EP18794585.2

申请日：2018-05-07

IPC: H01L21/683 ,  H01L23/00 ,  H01L33/00 ,  H01S5/02 ,  H01L21/02 ,  H01S5/343 ,  H01L33/46 ,  H01L33/32 ,  H01L33/20

CPC classification number: H01L33/0075 ,  H01L33/20 ,  H01S5/0217 ,  H01S5/34333 ,  H01S2304/1220130101 ,  H01L33/0093 ,  H01L21/02389 ,  H01L21/0254 ,  H01L21/02647 ,  H01L21/02458 ,  H01L2224/3224520130101 ,  H01L2224/8319220130101 ,  H01L2224/8389520130101 ,  H01L2224/3222520130101 ,  H01L2224/8344420130101 ,  H01L2224/8320320130101 ,  H01L2224/0561120130101 ,  H01L2224/0564420130101 ,  H01L2924/1574720130101 ,  H01L2924/103320130101 ,  H01L2224/0402620130101 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/8380520130101 ,  H01L24/83 ,  H01L2224/8301320130101 ,  H01L2224/8302220130101 ,  H01L2224/2911120130101 ,  H01L2224/2914420130101 ,  H01L2224/8344720130101 ,  H01L2224/8044420130101 ,  H01L2224/8001320130101 ,  H01L2224/8020320130101 ,  H01L2224/8089520130101 ,  H01L24/80 ,  H01L2224/0824520130101 ,  H01L2224/0822520130101 ,  H01L24/08 ,  H01L2224/0420130101 ,  H01L2224/034520130101 ,  H01L24/03 ,  H01L2224/8000620130101 ,  H01L2224/8300520130101 ,  H01L2224/0823820130101 ,  H01L2224/0825820130101 ,  H01L2224/0555820130101 ,  H01L21/6835 ,  H01L24/06 ,  H01L2224/0618120130101 ,  H01L2924/1204220130101 ,  H01L2224/920220130101 ,  H01L2224/9420130101 ,  H01L24/94 ,  H01L24/92 ,  H01L2224/9214220130101 ,  H01L2224/921220130101 ,  H01L2221/6838120130101 ,  H01L2221/6831820130101 ,  H01L2221/683520130101 ,  H01L2221/6836320130101 ,  H01L2224/80420130101 ,  H01L2224/804920130101 ,  H01L2224/051820130101 ,  H01L2224/0514420130101 ,  H01L2224/0566920130101 ,  H01L2224/0518420130101 ,  H01L2224/0513920130101 ,  H01L2224/0566420130101 ,  H01L2224/0565520130101 ,  H01L2224/0563920130101 ,  H01L2224/0516420130101 ,  H01L2224/0516620130101 ,  H01L2224/0516920130101 ,  H01L2224/056820130101 ,  H01L2224/0568420130101 ,  H01L2224/0566620130101 ,  H01L2224/0515520130101 ,  H01S5/0203 ,  H01L2224/29120130101

公开(公告)号：EP3925007B1

公开(公告)日：2024-10-02

申请号：EP20701715.3

申请日：2020-01-20

IPC: B82Y10/00 ,  G06N10/00 ,  H01L23/538 ,  H01L23/00 ,  H10N69/00 ,  H01L23/498

CPC classification number: G06N10/00 ,  B82Y10/00 ,  H01L24/81 ,  H01L23/49811 ,  H01L2224/8119220130101 ,  H01L2924/1532120130101 ,  H01L2924/1615220130101 ,  H01L2924/1625120130101 ,  H01L2224/8119320130101 ,  H01L2224/1301920130101 ,  H01L2224/1622720130101 ,  H01L2224/113420130101 ,  H01L2224/8109920130101 ,  H01L2224/8180120130101 ,  H01L2224/160120130101 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/0564720130101 ,  H01L2224/1310920130101 ,  H01L2224/0564420130101 ,  H01L2224/0566920130101 ,  H01L2224/0566420130101 ,  H01L2224/1311120130101 ,  H01L2224/1314420130101 ,  H01L2224/0563920130101 ,  H01L2224/1316920130101 ,  H01L2224/1311620130101 ,  H01L2224/1311320130101 ,  H01L2224/0566620130101 ,  H01L2224/1364420130101 ,  H10N69/00

公开(公告)号：EP4411843A2

公开(公告)日：2024-08-07

申请号：EP24169398.5

申请日：2018-05-07

Applicant: The Regents of the University of California

Inventor： KAMIKAWA, Takeshi ,  GANDROTHULA, Srinivas ,  LI, Hongjian ,  COHEN, Daniel A.

IPC: H01L33/20

CPC classification number: H01L33/0075 ,  H01L33/20 ,  H01S5/0217 ,  H01S5/34333 ,  H01S2304/1220130101 ,  H01L33/0093 ,  H01L21/02389 ,  H01L21/0254 ,  H01L21/02647 ,  H01L21/02458 ,  H01L2224/3224520130101 ,  H01L2224/8319220130101 ,  H01L2224/8389520130101 ,  H01L2224/3222520130101 ,  H01L2224/8344420130101 ,  H01L2224/8320320130101 ,  H01L2224/0561120130101 ,  H01L2224/0564420130101 ,  H01L2924/1574720130101 ,  H01L2924/103320130101 ,  H01L2224/0402620130101 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/8380520130101 ,  H01L24/83 ,  H01L2224/8301320130101 ,  H01L2224/8302220130101 ,  H01L2224/2911120130101 ,  H01L2224/2914420130101 ,  H01L2224/8344720130101 ,  H01L2224/8044420130101 ,  H01L2224/8001320130101 ,  H01L2224/8020320130101 ,  H01L2224/8089520130101 ,  H01L24/80 ,  H01L2224/0824520130101 ,  H01L2224/0822520130101 ,  H01L24/08 ,  H01L2224/0420130101 ,  H01L2224/034520130101 ,  H01L24/03 ,  H01L2224/8000620130101 ,  H01L2224/8300520130101 ,  H01L2224/0823820130101 ,  H01L2224/0825820130101 ,  H01L2224/0555820130101 ,  H01L21/6835 ,  H01L24/06 ,  H01L2224/0618120130101 ,  H01L2924/1204220130101 ,  H01L2224/920220130101 ,  H01L2224/9420130101 ,  H01L24/94 ,  H01L24/92 ,  H01L2224/9214220130101 ,  H01L2224/921220130101 ,  H01L2221/6838120130101 ,  H01L2221/6831820130101 ,  H01L2221/683520130101 ,  H01L2221/6836320130101 ,  H01L2224/80420130101 ,  H01L2224/804920130101 ,  H01L2224/051820130101 ,  H01L2224/0514420130101 ,  H01L2224/0566920130101 ,  H01L2224/0518420130101 ,  H01L2224/0513920130101 ,  H01L2224/0566420130101 ,  H01L2224/0565520130101 ,  H01L2224/0563920130101 ,  H01L2224/0516420130101 ,  H01L2224/0516620130101 ,  H01L2224/0516920130101 ,  H01L2224/056820130101 ,  H01L2224/0568420130101 ,  H01L2224/0566620130101 ,  H01L2224/0515520130101 ,  H01S5/0203 ,  H01L2224/29120130101

Abstract: A method of removing a substrate, comprising: forming a growth restrict mask with a plurality of striped opening areas directly or indirectly upon a GaN-based substrate; and growing a plurality of semiconductor layers upon the GaN-based substrate using the growth restrict mask, such that the growth extends in a direction parallel to the striped opening areas of the growth restrict mask, and growth is stopped before the semiconductor layers coalesce, thereby resulting in island-like semiconductor layers. A device is processed for each of the island-like semiconductor layers. Etching is performed until at least a part of the growth restrict mask is exposed. The devices are then bonded to a support substrate. The GaN-based substrate is removed from the devices by a wet etching technique that at least partially dissolves the growth restrict mask. The GaN substrate that is removed then can be recycled.

公开(公告)号：EP3391409B1

公开(公告)日：2024-05-22

申请号：EP16876775.4

申请日：2016-12-16

IPC: H01L23/485 ,  H01L21/48 ,  H01L21/60 ,  H01L25/065

CPC classification number: H01L25/0657 ,  H01L2225/0655520130101 ,  H01L25/50 ,  H01L2225/0651320130101 ,  H01L2225/0659320130101 ,  H01L2224/0823820130101 ,  H01L2224/0823720130101 ,  H01L24/05 ,  H01L24/08 ,  H01L24/80 ,  H01L2224/0554120130101 ,  H01L2224/0555120130101 ,  H01L2224/0555220130101 ,  H01L2224/0557120130101 ,  H01L2224/0557320130101 ,  H01L2224/0557820130101 ,  H01L2224/05620130101 ,  H01L2224/0563920130101 ,  H01L2224/0564420130101 ,  H01L2224/0564720130101 ,  H01L2224/0565520130101 ,  H01L2224/0568420130101 ,  H01L2224/080720130101 ,  H01L2224/0814620130101 ,  H01L2224/8089520130101 ,  H01L2224/8089620130101 ,  H01L2224/0811120130101 ,  H01L2224/0812120130101 ,  H01L2224/0814820130101 ,  H01L2224/8003520130101 ,  H01L2224/8093520130101 ,  H01L2224/0420130101 ,  H01L2224/0566420130101 ,  H01L2224/8001320130101 ,  H01L2224/0512420130101 ,  H01L2224/0507320130101 ,  H01L2224/8001120130101 ,  H01L2224/0560920130101 ,  H01L2224/0561120130101 ,  H01L2224/8081520130101 ,  H01L2224/0568720130101 ,  H01L2224/0568820130101 ,  H01L2224/0341620130101 ,  H01L2224/03520130101 ,  H01L24/03 ,  H01L2224/0360220130101 ,  H01L2224/0361620130101 ,  H01L2224/0346420130101 ,  H01L2224/0361220130101 ,  H01L2224/0515520130101 ,  H01L2924/38120130101 ,  H01L2924/351220130101 ,  H01L2224/0566920130101 ,  H01L2224/0514420130101 ,  H01L2224/803420130101 ,  H01L2224/8098620130101 ,  H01L2224/0556920130101 ,  H01L2224/0814520130101