公开(公告)号：EP2626894A4

公开(公告)日：2016-03-02

申请号：EP11830472

申请日：2011-09-12

申请人： DEXERIALS CORP

发明人： ISHIGAMI AKIRA ,  KANISAWA SHIYUKI ,  NAMIKI HIDETSUGU ,  UMAKOSHI HIDEAKI ,  AOKI MASAHARU

IPC分类号： H01L21/60 ,  B32B27/00 ,  H01L23/00 ,  H01L25/075 ,  H01L33/60 ,  H01L33/62

CPC分类号： H01L24/29 ,  B32B7/12 ,  B32B27/08 ,  B32B27/281 ,  B32B27/283 ,  B32B27/304 ,  B32B27/32 ,  B32B27/36 ,  B32B2307/306 ,  B32B2307/416 ,  B32B2307/536 ,  B32B2457/00 ,  C08L27/06 ,  C08L67/00 ,  C08L79/08 ,  C08L83/04 ,  H01L24/16 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/95 ,  H01L25/0753 ,  H01L33/005 ,  H01L33/48 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/294 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/75315 ,  H01L2224/75317 ,  H01L2224/7532 ,  H01L2224/7598 ,  H01L2224/75985 ,  H01L2224/81001 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81444 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/83907 ,  H01L2224/9205 ,  H01L2224/9211 ,  H01L2224/92143 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2933/0033 ,  H01L2933/0066 ,  Y10T156/10 ,  Y10T428/24967 ,  Y10T428/31544 ,  Y10T428/31663 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512

公开(公告)号：EP2581955A4

公开(公告)日：2015-12-30

申请号：EP11792305

申请日：2011-05-27

申请人： DEXERIALS CORP

发明人： UMAKOSHI HIDEAKI ,  NAMIKI HIDETSUGU ,  ISHIGAMI AKIRA ,  AOKI MASAHARU ,  KANISAWA SHIYUKI ,  SHINYA YOSHIHISA

IPC分类号： H01L33/62 ,  C09J9/02 ,  C09J11/04 ,  C09J163/00 ,  H01L21/60

CPC分类号： H01L24/29 ,  C08G59/687 ,  H01L24/16 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29386 ,  H01L2224/29444 ,  H01L2224/2949 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/81444 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/8359 ,  H01L2224/836 ,  H01L2224/83624 ,  H01L2224/83639 ,  H01L2224/83644 ,  H01L2224/83647 ,  H01L2224/83655 ,  H01L2224/83664 ,  H01L2224/83687 ,  H01L2224/83744 ,  H01L2224/83755 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/29298 ,  H01L2924/00 ,  H01L2924/053 ,  H01L2924/00012 ,  H01L2924/05432 ,  H01L2224/29318 ,  H01L2224/29366 ,  H01L2924/05341 ,  H01L2924/049

摘要： A light-reflective anisotropic conductive paste is used as an anisotropic conductive paste when a light-emitting device is produced by flip-chip mounting a light-emitting element such as a light-emitting diode element (LED) on a wiring board. The light-reflective anisotropic conductive paste includes light-reflective insulating particles, in order to improve light emission efficiency without providing, in the LED, a light-reflecting layer that causes an increase in manufacturing cost. With the light-reflective anisotropic conductive paste, a reduction in bonding strength of the light-emitting element to the wiring board in a high-temperature environment can be suppressed, and a reduction in conduction reliability after a TCT can also be suppressed. In the light-reflective anisotropic conductive paste, conductive particles and the light-reflective insulating particles are dispersed in a thermosetting resin composition. The thermosetting resin composition contains an epoxy compound and a thermal catalyst-type curing agent.

公开(公告)号：EP2765173A4

公开(公告)日：2015-04-29

申请号：EP12838614

申请日：2012-10-05

申请人： DEXERIALS CORP

发明人： ISHIGAMI AKIRA ,  KANISAWA SHIYUKI ,  NAMIKI HIDETSUGU ,  UMAKOSHI HIDEAKI ,  AOKI MASAHARU

IPC分类号： C09J201/00 ,  C08K9/02 ,  C09J9/00 ,  C09J9/02 ,  C09J11/00 ,  C09J11/04 ,  H01B1/22 ,  H01L33/46 ,  H01L33/60 ,  H01L33/62 ,  H01R11/01

CPC分类号： H01L33/46 ,  C09J9/00 ,  C09J11/00 ,  H01B1/22 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49107 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/07811 ,  H01L2924/00014 ,  H01L2924/00

摘要： The present invention is made to provide an anisotropic conductive adhesive which uses conductive particles where a silver-based metal is used as a conductive layer, having high light reflectance and excellent migration resistance. The anisotropic conductive adhesive (1)includes light reflective conductive particles (3) in an insulating adhesive resin (2). The light reflective conductive particle (3) includes a light reflective metal layer (31) made of a metal having at least 60% of reflectance at a peak wavelength of 460 nm formed on the surface of a resin particle (30) as a core, and a coating layer made of a silver alloy formed on the surface of the light reflective metal layer (31). The light reflective metal layer is preferably formed by a plating method.

公开(公告)号：EP2584015A4

公开(公告)日：2014-01-08

申请号：EP12757068

申请日：2012-03-14

申请人： DEXERIALS CORP

发明人： UMAKOSHI HIDEAKI ,  NAMIKI HIDETSUGU ,  AOKI MASAHARU ,  ISHIGAMI AKIRA ,  KANISAWA SHIYUKI

IPC分类号： C09J183/04 ,  C09J9/02 ,  C09J11/04 ,  C09J11/06 ,  C09J183/06 ,  H01B1/00 ,  H01B1/20 ,  H01B5/16 ,  H01L33/60

CPC分类号： H01L33/46 ,  C08G77/12 ,  C08G77/38 ,  C08K5/0025 ,  C08K5/09 ,  C08K2003/2241 ,  C08K2003/2296 ,  C09J9/02 ,  C09J183/06 ,  H01B1/22 ,  H01B3/00 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/07811 ,  H01L2924/00 ,  H01L2924/00014

公开(公告)号：EP3147340A4

公开(公告)日：2018-01-03

申请号：EP15796698

申请日：2015-05-22

申请人： DEXERIALS CORP

发明人： AOKI MASAHARU ,  KANISAWA SHIYUKI ,  NAMIKI HIDETSUGU ,  ISHIGAMI AKIRA

IPC分类号： C09J163/00 ,  C09J11/04 ,  C09J11/06 ,  C09J133/00 ,  C09J133/04 ,  H01R11/01 ,  H05K3/32 ,  H05K3/34

CPC分类号： C09J163/00 ,  C09J11/04 ,  C09J11/06 ,  C09J133/00 ,  C09J133/04 ,  H01R11/01 ,  H05K1/0203 ,  H05K1/11 ,  H05K1/181 ,  H05K3/32 ,  H05K3/34 ,  H05K3/386 ,  H05K2201/10106

摘要： Provided are an adhesive agent having excellent bonding properties with oxide films and excellent heat-dissipation properties and a connection structure using the same. The adhesive agent contains an epoxy compound, a cationic catalyst, and an acrylic resin containing acrylic acid and acrylic acid ester having a hydroxyl group. Acrylic acid in the acrylic resin reacts with the epoxy compound to generate connections between an island of acrylic resin (13) and a sea of epoxy compound (12) and roughen the surface of an oxide film (11a) to improve an anchor effect with the sea of epoxy compound (12); solder particles (1) contained in the adhesive agent are melted to form metal bonding with an electrode (10), thereby enabling improvement in adhesive strength between the adhesive agent and the electrode (10) and further improving heat dissipation from a surface of the metal bonding.

公开(公告)号：EP2899245A4

公开(公告)日：2016-06-01

申请号：EP13840056

申请日：2013-09-17

申请人： DEXERIALS CORP

发明人： ISHIGAMI AKIRA ,  KANISAWA SHIYUKI ,  NAMIKI HIDETSUGU ,  AOKI MASAHARU

IPC分类号： C09J201/00 ,  C09J9/02 ,  C09J11/02 ,  H01B1/00 ,  H01B1/22 ,  H01B5/16 ,  H01L21/60

CPC分类号： B23K35/36 ,  B23K1/0016 ,  B23K35/025 ,  B23K35/24 ,  C08K9/02 ,  C08K2201/001 ,  C09J9/02 ,  C09J11/00 ,  H01B1/22 ,  H01L23/3737 ,  H01L23/5328 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/06102 ,  H01L2224/16238 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/2919 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81193 ,  H01L2224/81805 ,  H01L2224/81903 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/15787 ,  H05K3/3484 ,  H05K13/0465 ,  H01L2924/00014 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00015

公开(公告)号：EP2559717A4

公开(公告)日：2015-11-25

申请号：EP11768893

申请日：2011-04-13

申请人： DEXERIALS CORP

发明人： NAMIKI HIDETSUGU ,  ISHIGAMI AKIRA ,  UMAKOSHI HIDEAKI ,  KANISAWA SHIYUKI

IPC分类号： C08G59/18 ,  C08G59/42 ,  C09J7/00 ,  C09J9/02 ,  C09J11/06 ,  C09J163/00 ,  C09J201/00 ,  H01B1/22 ,  H01B5/16

CPC分类号： C08G59/42 ,  C08F220/18 ,  C08L33/068 ,  C08L63/00 ,  C09J9/02 ,  C09J163/00 ,  H01L2224/14 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/73204 ,  H01L2224/73265 ,  C08F2220/1808 ,  C08F2220/325 ,  H01L2924/00014

摘要： To provide a curable resin composition that can improve resistant properties such as thermal impact resistance even in a high-temperature and high-humidity environment and has a high adhesive property, high conduction reliability and superior crack resistant property. The curable resin composition contains an epoxy resin and an epoxy resin-use curing agent, and is characterized in that a difference between a maximum value of tan ´ in a viscoelastic spectrum and a value of the tan ´ at -40°C thereof is 0.1 or more.

公开(公告)号：EP2560198A4

公开(公告)日：2014-08-06

申请号：EP11768894

申请日：2011-04-13

申请人： DEXERIALS CORP

发明人： NAMIKI HIDETSUGU ,  KANISAWA SHIYUKI ,  UMAKOSHI HIDEAKI ,  ISHIGAMI AKIRA

IPC分类号： H01L21/60 ,  C08K3/22 ,  C08K9/06 ,  C09J9/02 ,  C09J11/00 ,  C09J11/04 ,  C09J201/00 ,  H01L23/00 ,  H01L33/40 ,  H01L33/60 ,  H01L33/62

CPC分类号： C09J9/02 ,  C08K3/08 ,  C08K3/22 ,  C08K3/24 ,  C08K7/08 ,  C08K9/06 ,  C08K2003/0831 ,  C08K2003/2241 ,  C08K2003/2296 ,  C09J11/04 ,  H01L24/06 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L33/405 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/13339 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29198 ,  H01L2224/29339 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49107 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/83855 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01081 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/10157 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A light-reflective anisotropic conductive adhesive and light-emitting device capable of maintaining luminous efficiency of a light-emitting element and preventing the occurrence of a crack to obtain conduction reliability are provided. The light-reflective anisotropic conductive adhesive contains a thermosetting resin composite, conductive particles, and a light-reflective acicular insulating particles. These light-reflective acicular insulating particles are inorganic particles of at least one type selected from the group including titanium oxide, zinc oxide, and titanate.

公开(公告)号：EP3121237A4

公开(公告)日：2017-10-18

申请号：EP15764663

申请日：2015-02-13

申请人： DEXERIALS CORP

发明人： NAMIKI HIDETSUGU ,  KANISAWA SHIYUKI ,  ISHIGAMI AKIRA ,  AOKI MASAHARU

IPC分类号： C09J201/00 ,  C08K3/08 ,  C08K3/22 ,  C08K7/16 ,  C09J9/02 ,  C09J11/04 ,  H01B1/00 ,  H01B1/22 ,  H01L23/00 ,  H01L33/60 ,  H01L33/62 ,  H05K3/32

CPC分类号： C09J9/02 ,  C08K3/22 ,  C08K7/16 ,  C08K9/02 ,  C08K2003/0806 ,  C08K2003/2241 ,  C08K2201/001 ,  C08K2201/003 ,  C08K2201/005 ,  C09J11/04 ,  C09J163/00 ,  C09J201/00 ,  H01B1/22 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L33/644 ,  H01L33/647 ,  H01L2224/16238 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29386 ,  H01L2224/2939 ,  H01L2224/29439 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49107 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/81203 ,  H01L2933/0066 ,  H01L2933/0075 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0272 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/05341 ,  H01L2924/05432

公开(公告)号：EP3051598A4

公开(公告)日：2017-06-28

申请号：EP14849187

申请日：2014-09-25

申请人： DEXERIALS CORP

发明人： NAMIKI HIDETSUGU ,  KANISAWA SHIYUKI ,  ISHIGAMI AKIRA

IPC分类号： H01L33/62 ,  H01L21/60 ,  H01L23/00 ,  H01L33/60

CPC分类号： H01L33/62 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/1184 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13644 ,  H01L2224/16238 ,  H01L2224/16502 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/2939 ,  H01L2224/29444 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81395 ,  H01L2224/81444 ,  H01L2224/81805 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83395 ,  H01L2224/83444 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/83885 ,  H01L2224/9221 ,  H01L2933/0016 ,  H01L2933/0066 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/0665 ,  H01L2924/01047 ,  H01L2224/83801