公开(公告)号：EP3300464A1

公开(公告)日：2018-03-28

申请号：EP17197530.3

申请日：2009-11-09

Applicant: Nitto Denko Corporation

Inventor： ISHII, Jun ,  NAITOU, Toshiki ,  HONJO, Mitsuru

IPC: H05K1/02 ,  H05K3/46 ,  G11B5/48

CPC classification number: H05K3/4685 ,  G11B5/484 ,  G11B5/486 ,  H05K1/0228 ,  H05K1/0245 ,  H05K1/025 ,  H05K1/0265 ,  H05K1/056 ,  H05K3/06 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09627 ,  H05K2201/0979 ,  H05K2203/0323 ,  Y10T29/49155

Abstract: An end of a first line and an end of a second line of a first write wiring pattern are arranged on both sides of a third line of a second write wiring pattern. Circular connection portions are provided at the ends of the first line and the second line. In addition, through holes are formed in respective portions of a base insulating layer below the connection portions. Each connection portion comes in contact with a connecting region of a suspension body within the through hole.

Abstract translation: 第一写入布线图案的第一行的末端和第二行的末端布置在第二写入布线图案的第三行的两侧。 在第一行和第二行的末端提供圆形连接部分。 另外，在连接部分下方的基底绝缘层的各个部分中形成通孔。 每个连接部分与通孔内的悬挂体的连接区域接触。

公开(公告)号：EP3245853A2

公开(公告)日：2017-11-22

申请号：EP16704956.8

申请日：2016-01-11

Applicant: Qualcomm Incorporated

Inventor： SUBRAMANIAN, Yokesh

IPC: H05K1/02 ,  G11C5/02

CPC classification number: H05K1/0213 ,  G11C5/025 ,  H05K1/0243 ,  H05K1/0246 ,  H05K1/0248 ,  H05K1/025 ,  H05K1/18 ,  H05K2201/09227 ,  H05K2201/09254

Abstract: A method for propagating a signal from an output driver on a PCB to a number of chips on the PCB. The signal is propagated from a first transmission line connected to the output driver, to a second transmission line connected to the first transmission line and a first chip, and to a third transmission line connected to the first transmission line and a second chip. The second transmission line has a length greater than or equal to 10 times the length of the first transmission line, and the third transmission line has a length greater than or equal to 10 times the length of the first transmission line. The lengths of the first transmission line, the second transmission line, and the third transmission line cause a reduction in reflections of the signal due to a change in impedance at a junction of the first, second, and third transmission lines.

公开(公告)号：EP2566307A3

公开(公告)日：2017-11-15

申请号：EP12005825.0

申请日：2012-08-10

Applicant: Eppendorf AG

Inventor： Reichmuth, Burkardt

IPC: H05K1/02 ,  B01L3/02 ,  G01F11/02 ,  H05K1/03 ,  G01N35/10

CPC classification number: H05K1/0296 ,  B01L3/0227 ,  B01L2200/087 ,  B01L2200/12 ,  G01F11/021 ,  G01N35/1002 ,  H05K1/0393 ,  H05K2201/053 ,  H05K2201/09027 ,  H05K2201/09063 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/0939 ,  H05K2201/09672 ,  H05K2201/097 ,  H05K2201/09972 ,  H05K2201/10151

Abstract: The invention relates to a laboratory sample instrument (200) with a cable holding space (185) in which a printed circuit board cable device (100) is arranged, more particularly to a dispenser or a pipette. The printed circuit board cable device has at least one printed circuit board (102), which has a first and a second side of the board, and, arranged in succession, at least one first printed circuit board section (A), at least one second printed circuit board section (B) and at least one third printed circuit board section (C), with the printed circuit board having a number of conductor tracks (121,122) which, at least in sections, are arranged parallel with respect to one another on the printed circuit board and extend from a first track section, which is arranged in the first printed circuit board section, via the second printed circuit board section to the third printed circuit board section, in which a second track section is arranged, wherein, in the second printed circuit board section, at least one conductor track (121a, 122a) is arranged on the first side of the board and at least one conductor track (121b, 122b) is arranged on the second side of the board.

Abstract translation: 本发明涉及一种具有电缆保持空间（185）的实验室样本器械（200），其中布置有印刷电路板电缆装置（100），更具体地涉及分配器或移液管。 所述印刷电路板电缆装置具有至少一个印刷电路板（102），所述印刷电路板具有所述电路板的第一侧和第二侧，并且依次布置至少一个第一印刷电路板部分（A），至少一个 第二印刷电路板部分（B）和至少一个第三印刷电路板部分（C），其中所述印刷电路板具有多个印刷电路板（121,122），所述印刷电路板至少部分地相对于彼此平行地布置 在印刷电路板上并且从布置在第一印刷电路板部分中的第一轨道部分经由第二印刷电路板部分延伸到布置有第二轨道部分的第三印刷电路板部分，其中， 在第二印刷电路板部分中，至少一个印制导线（121a，122a）布置在板的第一侧上，并且至少一个印制导线（121b，122b）布置在板的第二侧上。

公开(公告)号：EP1455557B1

公开(公告)日：2013-02-27

申请号：EP03023937.0

申请日：2003-10-22

Applicant: ROBERT BOSCH GMBH

Inventor： Roozenbeck, Herman ,  Bayer, Uwe

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0216 ,  H05K1/0231 ,  H05K1/115 ,  H05K1/117 ,  H05K1/18 ,  H05K2201/0715 ,  H05K2201/09254 ,  H05K2201/09318 ,  H05K2201/09345 ,  H05K2201/09627 ,  H05K2201/10689

公开(公告)号：EP2056342B1

公开(公告)日：2013-01-09

申请号：EP08019270.1

申请日：2008-11-04

Applicant: Hitachi Ltd.

Inventor： Nakazato, Norio c/o Hitachi, Ltd., Intellectual Property Group, ,  Fujieda, Nobuo c/o Hitachi, Ltd., Intellectual Property Group, ,  Ishibashi, Masayoshi c/o Hitachi, Ltd., Intellectual Property Group, ,  Kato, Midori c/o Hitachi, Ltd., Intellectual Property Group, ,  Arai, Tadashi c/o Hitachi, Ltd., Intellectual Property Group, ,  Shiba, Takeo c/o Hitachi, Ltd., Intellectual Property Group,

IPC: H01L23/498 ,  H05K3/12

CPC classification number: H01L21/4867 ,  H01L23/49838 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H05K3/107 ,  H05K3/1258 ,  H05K2201/09036 ,  H05K2201/09254 ,  H01L2924/00

公开(公告)号：EP1729556B1

公开(公告)日：2010-08-18

申请号：EP06010732.3

申请日：2006-05-24

Applicant: EUROCOPTER

Inventor： Imbert, Nicolas ,  Chuc, Charles

IPC: H05K7/14 ,  H01R12/06 ,  H01R12/16

CPC classification number: H05K7/1459 ,  H01R12/52 ,  H01R31/005 ,  H05K1/0289 ,  H05K1/14 ,  H05K1/148 ,  H05K7/1441 ,  H05K2201/044 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/09972

公开(公告)号：EP1455557A2

公开(公告)日：2004-09-08

申请号：EP03023937.0

申请日：2003-10-22

Applicant: ROBERT BOSCH GMBH

Inventor： Roozenbeck, Herman ,  Bayer, Uwe

IPC: H05K1/02

CPC classification number: H05K1/0216 ,  H05K1/0231 ,  H05K1/115 ,  H05K1/117 ,  H05K1/18 ,  H05K2201/0715 ,  H05K2201/09254 ,  H05K2201/09318 ,  H05K2201/09345 ,  H05K2201/09627 ,  H05K2201/10689

Abstract: Die vorliegende Erfindung stellt eine Trägervorrichtung (10) für elektrische Bauelemente bereit mit: einer ersten leitfähigen Ebene (23') zum Bereitstellen eines Bezugspotentials (23); und mindestens einer elektrisch von der ersten Ebene (23') isolierten zweiten Ebene (11') mit strukturierten Leitungen (11) zum Anbinden elektrischer Anschlusseinrichtungen (12) externer Bauelemente und zum Anbinden interner Bauelemente auf der Trägervorrichtung (10), wobei die Leitungen (11) zum Anbinden elektrischer Anschlusseinrichtungen (12) externer analoger Bauelemente und/oder Sensoren Bezugspotentialleitungen (16, 17) aufweisen, welche sich an einem ersten Stempunkt (18) sammeln, und die Leitungen (11) zum Anbinden interner Bauelemente Bezugspotentialleitungen (19, 20, 21) aufweisen, welche sich an einem zweiten Sternpunkt (22) sammeln und über mindestens eine Durchkontaktierungseinrichtung (23") mit der ersten Ebene (23') galvanisch gekoppelt sind und/oder die Durchkontaktierungseinrichtung (23") den ersten und/oder zweiten Stempunkt (18, 22) bildet.

Abstract translation: 矩形电路板（10）在形成在表面（11'）上的多个导体（11）的点（18,22）处具有在平坦顶部和底部表面之间的连接（23）。 电子电路的构造块包括电容器（26）和功能计算器（13）。 板上的端子（12）接收外部模拟信号n（14）和n + 1（15）和参考电位n（16）和n + 1（17）。

公开(公告)号：EP0657797B1

公开(公告)日：2003-07-02

申请号：EP94117661.2

申请日：1994-11-09

Applicant: International Business Machines Corporation

Inventor： Dell, Timothy Jay ,  Feng, George Cheng-Cwo ,  Kellogg, Mark William

IPC: G06F1/10 ,  G11C5/00

CPC classification number: H05K1/0246 ,  G06F1/10 ,  G11C7/22 ,  H05K1/117 ,  H05K2201/09254 ,  H05K2201/10022 ,  H05K2201/10689

公开(公告)号：EP1060645A1

公开(公告)日：2000-12-20

申请号：EP99910902.8

申请日：1999-03-05

Applicant: Obducat AB

Inventor： WIKSTRÖM, Bo ,  OLSSON, Lennart

IPC: H05K1/02

CPC classification number: H05K1/0242 ,  H01L23/367 ,  H01L23/5283 ,  H01L23/538 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0209 ,  H05K1/0265 ,  H05K1/111 ,  H05K2201/0373 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/09681 ,  H05K2201/09781 ,  H05K2201/0979 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

Abstract: An electronics device comprising a carrier, such as a printed circuit board, a substrate or a chip, and an electric conductor on a surface of the carrier. The surface of the conductor (2) facing away from the carrier has a surface structure (3, 4; 6, 7) in the form of flanges which are defined by etched grooves.

公开(公告)号：EP0657797A3

公开(公告)日：1997-08-27

申请号：EP94117661.2

申请日：1994-11-09

Applicant: International Business Machines Corporation

Inventor： Dell, Timothy Jay ,  Feng, George Cheng-Cwo ,  Kellogg, Mark William

IPC: G06F1/10

CPC classification number: H05K1/0246 ,  G06F1/10 ,  G11C7/22 ,  H05K1/117 ,  H05K2201/09254 ,  H05K2201/10022 ,  H05K2201/10689

Abstract: A packaging assembly for semiconductor memory modules using synchronous clocking signals distributed to each module within a package. The clock distribution network on the assembly is characterized by including a transmission line termination means, preferably a resistor, coupled immediately adjacent to one of the assembly input pins.