-
公开(公告)号:EP3401053B1
公开(公告)日:2024-11-13
申请号:EP18169079.3
申请日:2018-04-24
-
公开(公告)号:EP3706161B1
公开(公告)日:2024-10-09
申请号:EP18873077.4
申请日:2018-10-30
IPC分类号: H01L23/488 , H01L23/482 , H01L21/60 , B23K35/26 , C22C13/02 , B23K1/20
CPC分类号: B23K1/008 , C22C13/02 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/8381520130101 , H01L2224/838120130101 , H01L2224/3250320130101 , H01L2924/35120130101 , H01L2924/351220130101 , H01L24/05 , H01L2224/0402620130101 , H01L23/4827 , H01L2224/0508320130101 , H01L2224/034520130101 , H01L2224/034620130101 , H01L2224/3222720130101 , H01L2224/3224520130101 , H01L2224/8320420130101 , H01L2224/8321120130101 , H01L2224/8307520130101 , H01L2224/8306520130101 , H01L2224/8302220130101 , H01L2224/8302420130101 , H01L2224/8304820130101 , H01L2224/29320130101 , H01L2224/29120130101 , H01L2224/2929420130101 , H01L2224/8310120130101 , H01L2224/2911120130101 , H01L2224/8345520130101 , H01L2224/0507320130101 , H01L2224/0508220130101 , H01L2224/0508420130101 , H01L2224/0564420130101 , H01L2224/0563920130101 , H01L2224/0565520130101 , H01L2224/0516620130101 , H01L2224/0512420130101 , H01L2224/0515520130101 , H01L2224/0513920130101 , H01L2224/0514720130101 , H01L2224/0511120130101 , H01L2224/3250720130101 , H01L24/03 , B23K1/0016 , B23K2101/3620180801 , B23K1/203 , B23K1/206 , B23K35/262 , C22C19/03 , B23K35/025 , H01L2224/0564720130101 , H01L2224/0517220130101 , H01L2224/0517120130101 , H01L2224/0561120130101 , H01L2224/0514420130101
-
公开(公告)号:EP3471517B1
公开(公告)日:2024-08-21
申请号:EP17810380.0
申请日:2017-06-08
IPC分类号: H05K1/03 , B23K35/30 , C04B37/02 , C22C5/06 , H01L23/12 , H05K1/02 , H05K3/38 , B23K35/00 , B23K35/02 , B23K35/26 , B23K35/28 , B23K35/32 , B32B15/01 , C22C5/08 , C22C9/00 , H01L23/15 , H01L23/36 , H01L23/498 , H05K3/00
CPC分类号: B23K35/30 , H05K1/0271 , H05K1/0306 , H05K3/0061 , H05K3/388 , H01L23/15 , H01L23/36 , H01L23/498 , B23K35/007 , B23K35/0238 , B32B15/018 , C22C5/08 , C04B37/026 , C04B2237/12620130101 , C04B2237/12720130101 , C04B2237/34320130101 , C04B2237/34820130101 , C04B2237/3620130101 , C04B2237/36120130101 , C04B2237/36320130101 , C04B2237/36520130101 , C04B2237/36620130101 , C04B2237/5020130101 , B23K35/26 , B23K35/286 , B23K35/32 , B23K35/325 , C22C9/00 , B23K35/3006 , C04B2237/12520130101 , C04B2237/36820130101 , C04B2237/40720130101 , C04B2237/5220130101 , C04B2237/6020130101 , C04B2237/70820130101 , C04B2237/7420130101
-
公开(公告)号:EP4408606A1
公开(公告)日:2024-08-07
申请号:EP22793144.1
申请日:2022-09-23
申请人: ZKW Group GmbH
CPC分类号: B23K35/262 , B23K35/025 , C22C13/02 , C22C1/02 , C22C1/03
-
公开(公告)号:EP3954794B1
公开(公告)日:2024-07-31
申请号:EP20787890.1
申请日:2020-04-09
IPC分类号: C22C1/02 , B23K35/14 , B23K35/26 , B23K35/40 , C22B9/02 , C22B25/08 , C22C13/00 , B23K101/36 , B23K35/36 , B23K101/42 , H05K1/18 , H05K3/34
CPC分类号: C22B25/08 , C22C1/02 , C22C13/00 , H05K3/3463 , H05K1/181 , B23K2101/4220180801 , B23K2101/3620180801 , B23K35/3618 , B23K35/262 , C22B9/023 , Y02P70/50 , Y02P10/20
-
公开(公告)号:EP4400252A1
公开(公告)日:2024-07-17
申请号:EP24151700.2
申请日:2024-01-12
发明人: YOKOYAMA, Takahiro , YOSHIKAWA, Shunsaku , IIJIMA, Yuki , DEI, Kanta , MATSUFUJI, Takahiro , SUGISAWA, Kota , SUZUKI, Shigeto
CPC分类号: B23K35/262 , C22C13/02 , C22C13/00 , B23K35/0244 , B23K35/025 , H05K3/3463
摘要: Provided are a solder alloy, a solder paste, a solder ball, a solder preform, a solder joint, a vehicle-mounted electronic circuit, an ECU electronic circuit, a vehicle-mounted electronic circuit device, and an ECU electronic circuit device which have a liquidus-line temperature and a solidus-line temperature falling within predetermined temperature ranges, and have excellent heat conductivity, and excellent heat cycle resistance. The solder alloy has an alloy composition consisting of, by mass%, Ag: 3.0 to 3.8%, Cu: 0.1 to 1.0%, Bi: 1.1% or more and less than 1.5%, Sb: 1.0 to 7.9%, Fe: 0.020 to 0.040%, Co: 0.001 to 0.020%, with the balance being Sn. Preferably, the solder alloy further contains, by mass%, at least one of Ge, Ga, As, Pd, Mn, In, Zn, Zr, and Mg: 0.1% or less in total.
-
公开(公告)号:EP4063061B1
公开(公告)日:2024-04-24
申请号:EP22167348.6
申请日:2019-01-16
IPC分类号: B23K35/363 , B23K35/26 , C22C13/00 , B23K35/02 , B23K35/36 , C08K5/3492 , C08L93/04 , B23K35/365
CPC分类号: C22C13/00 , B23K35/26 , B23K35/3612 , B23K35/3613 , B23K35/025 , B23K35/262 , B23K35/365 , C08L93/04 , C08K5/34924
-
8.
公开(公告)号:EP4299238A3
公开(公告)日:2024-03-27
申请号:EP23202671.6
申请日:2018-10-31
发明人: HASNINE, Md , KHO, Lik Wai
摘要: A lead-free, solder alloy consisting of 2.0 to 2.8 wt. % silver; 0.2 to 1.2 wt. % copper; 0.0 to 5.0 wt. % bismuth; 0.001 to 0.2 wt. % cobalt; 0.0 to 0.09 wt. % antimony; and balance in tin, together with any unavoidable impurities.
-
公开(公告)号:EP4317496A1
公开(公告)日:2024-02-07
申请号:EP22780485.3
申请日:2022-03-24
申请人: Tamura Corporation
摘要: Providing a solder alloy comprising: 0.1 mass% or more and 3 mass% or less of Ag; 8 mass% or more and 15 mass% or less of Cu; 30 mass% or more and 40 mass% or less of Sb; and the balance being Sn, capable of suppressing remelting of a solder joint to be formed even in a high temperature environment.
-
公开(公告)号:EP3817881B1
公开(公告)日:2024-01-17
申请号:EP19731661.5
申请日:2019-06-13
发明人: SCHMIDT, Elke , BIRGEL, Dietmar
IPC分类号: B23K1/00 , B23K35/02 , B23K35/26 , B23K35/30 , B23K101/38 , B23K101/36
-
-
-
-
-
-
-
-
-