Radiation-sensitive resin composition and a method of forming a resist pattern

    公开(公告)号:JP5360065B2

    公开(公告)日:2013-12-04

    申请号:JP2010528755

    申请日:2009-09-10

    CPC classification number: G03F7/0397 G03F7/0046 G03F7/2041

    Abstract: A radiation-sensitive resin composition includes (A) a resin that includes a repeating unit that becomes alkali-soluble due to an acid, but does not include a fluorine-containing repeating unit, (B) a photoacid generator, (C) a fluorine-containing resin that includes a repeating unit that becomes alkali-soluble due to an acid, and a fluorine-containing repeating unit, and (D) a lactone compound, the content of the lactone compound (D) in the composition being 31 to 200 parts by mass based on 100 parts by mass of the resin (A). A resist pattern-forming method utilizes the radiation-sensitive resin composition. The radiation-sensitive resin composition produces an excellent pattern shape, exhibits excellent basic resist performance (e.g., sensitivity, resolution, LWR, development defect resistance, and pattern collapse resistance), and produces a resist film having a sufficiently water-repellent surface that suppresses watermark defects and bubble defects during liquid immersion lithography.

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