Abstract:
PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive composition which can form a pressure-sensitive sheet excellent in adhesive properties (adherability, easy peeling property at the time of high speed peeling, and re-peeling property) and the antistatic property and which has long pot life.SOLUTION: A pressure-sensitive composition is a pressure-sensitive adhesive composition comprising a (meth)acryl-based polymer composed of, as raw material monomers, a (meth) acryl-based monomer having an alkyl group of 1 to 14 carbon atoms and a hydroxyl group-containing (meth) acryl-based monomer, an alkali metal salt, and a catalyst having iron as an active center, wherein the hydroxyl group-containing (meth)acryl-based monomer is contained in an amount of 6 pts.wt or more to 100 pts.wt of the (meth) acryl-based monomer having an alkyl group of 1 to 14 carbon atoms.
Abstract:
Release film furnished on at least one side with a release layer (c) based on at least one cured polysiloxane, the film comprising at least one inner layer (a) based on at least one thermoplastic polymer, equipped with at least one at least oligomeric compound having a long-term antistatic effect, as antistat, and at least one layer (b) based on at least one thermoplastic polymer; method for producing the release film, and the use thereof as a detachable protective or masking film.
Abstract:
PROBLEM TO BE SOLVED: To provide a solar cell module which obtains larger electric energy while enabling rear surface electrodes of multiple solar cells to be securely adhered and be electrically connected and sufficiently improves the generation efficiency, and to provide a conductive adhesive sheet used in the solar cell module.SOLUTION: A conductive adhesive sheet 1 includes a conductive adhesive layer 2 and a light reflection layer 3 formed on a surface of the conductive adhesive layer 2. In a solar cell module 6, the conductive adhesive sheet 1 connects rear surface electrodes 4 of multiple rear surface electrode type solar cells 5 with each other so that the light reflection layer 3 is exposed on the surface side from a gap between the multiple rear surface electrode type solar cells 5.
Abstract:
PROBLEM TO BE SOLVED: To provide a conductive particle arrangement sheet having excellent connection reliability of micro-electrode, and high insulation between adjoining electrodes of narrow space, in which lack of conductive particles is less likely to occur after manufacturing before use.SOLUTION: The conductive particle arrangement sheet includes conductive particles, and an insulating resin sheet having a reference plane P1 and a reference plane P2 facing it. Thickness of the insulating resin sheet is smaller than the average grain size of the conductive particles. The conductive particles are projecting from a predetermined reference plane at least on one side of the insulating resin sheet, and the portion of the conductive particles projecting from the reference plane of the insulating resin sheet is covered with a coating layer composed of the same resin as the insulating resin composing the insulating resin sheet. Coating thickness of the conductive particles projecting from the reference plane is 0.1-2 μm on the top of the coating layer, and the 180°C melt viscosity of the insulating resin sheet is 10-50,000 Pa s.
Abstract:
The conductor-connecting member of the invention is a conductor-connecting member comprising an adhesive layer 3 formed on at least one surface of a metal foil 1, wherein the metal foil 1 comprises a plurality of projections 2 of substantially equal height integrated with the metal foil 1, on the surface on which the adhesive layer 3 is formed, and the adhesive layer 3 fills in the projections 2 so that the surface formed on the side opposite the metal foil 1 is essentially smooth.
Abstract:
PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive sheet and a surface protective film that simultaneously achieve higher-level appearance quality and antistatic properties.SOLUTION: A pressure-sensitive adhesive sheet 1 is provided with a substrate film 12 comprising a transparent resin material, an antistatic layer 14 provided on one side 12A thereof, and a pressure-sensitive adhesive layer 20 provided on the other side 12B thereof. The antistatic layer 14 includes an antistatic component (for example, an electroconductive polymer) and a binder resin, and has an average thickness Dave of not less than 1 nm and less than 100 nm. The pressure-sensitive adhesive layer 20 contains an acrylic polymer as a base polymer and an ionic compound (such as an ionic liquid and an alkali metal salt) as an antistatic component.
Abstract:
PROBLEM TO BE SOLVED: To provide a conductive adhesive tape excellent in conductivity and durability.SOLUTION: The conductive adhesive tape 1 comprises a conductive layer 2 and an adhesive layer 3 formed on the surface of the conductive layer 2. In the adhesive layer 3, an adhesive layer through-hole 4 penetrating the adhesive layer in the thickness direction thereof is formed. The conductive layer 2 comprises a conductive layer passage portion 5 formed in the adhesive layer through-hole 4. A low melting point metal layer 6 is provided at an upper-side end face 16 of the conductive layer passage portion 5, the end face 16 reaching the surface of the adhesive layer 3.
Abstract:
PROBLEM TO BE SOLVED: To simplify a connecting step when electrically connecting conductive bodies which are separated from each other.SOLUTION: The method of electrically connecting a first conductive body and a second conductive body which are separated from each other, includes a step of heating and pressurizing a metallic foil 1, a first adhesive layer 2 provided on one surface of the metallic foil 1, and the first conductive body while arranging those in this order to electrically connect and bond the metallic foil 1 and the first conductive body; and heating and pressurizing the metallic foil 1, the first adhesive layer 2 or a second adhesive layer 3 provided on the other surface of the metallic foil 1, and the second conductive body while arranging those in this order to electrically connect and bond the metallic foil 1 and the second conductive body.
Abstract:
PROBLEM TO BE SOLVED: To provide: an anisotropic conductive film which can perform pressure bonding at low temperature for a short period regarding connection of a circuit material in which an insulating film is arranged and has low conductive resistance and is excellent on an adhesion property; a connected body using the anisotropic conductive film; and a method for manufacturing a connected body. SOLUTION: In the anisotropic conductive film for electrically connecting a first circuit member and a second circuit member where the insulating films are formed thereon at least partially, the anisotropic conductive film has a conductive particle-containing layer containing conductive particles, and an insulating adhesive layer formed from an insulating adhesive. Average thickness of the insulating adhesive layer is 0.5-3 μm, a storage modulus at 30°C of a cured object after curing the insulating adhesive layer is 500-1,500 MPa. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To achieve a higher level of bonding strength and satisfactory conductance reliability when an anisotropic connection is carried out under a condition where a pressure bonding temperature is 130°C and pressure bonding time is 3 s, by using an anisotropic conductive film that utilizes a polymerizable acrylic compound, which can be cured at a relatively lower temperature and shorter time than a thermosetting epoxy resin, together with a film forming resin. SOLUTION: The anisotropic conductive film has a structure in which an insulating adhesive layer and anisotropic conductive adhesive layer are laminated. The insulating adhesive layer and anisotropic conductive adhesive layer each contains a polymerizable acrylic compound, film forming resin, and polymerization initiator. The polymerization initiator contains two kinds of organic peroxides with different one-minute half-life temperatures. Of the two kinds of organic peroxides, the organic peroxide with the higher one-minute half-life temperature generates benzoic acid or a derivative thereof by decomposition. COPYRIGHT: (C)2010,JPO&INPIT