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133 条记录 (耗时 0.017 秒)

    Mounting substrate
    61.
    发明专利
    Mounting substrate 审中-公开
    安装基板

    公开(公告)号：JP2012099670A

    公开(公告)日：2012-05-24

    申请号：JP2010246664

    申请日：2010-11-02

    申请人： Sumitomo Wiring Syst Ltd ,  住友電装株式会社

    发明人： KITA YUKINORI

    IPC分类号： H05K1/02 ,  H05K3/00

    CPC分类号： H05K1/0269 ,  H01H2001/5888 ,  H05K3/306 ,  H05K2201/10053 ,  H05K2203/168

    摘要： PROBLEM TO BE SOLVED: To provide a mounting substrate having a new structure, capable of checking normal mounting position where a plurality of identical type electrical parts having different specifications are mounted on a print circuit board, at a glance when the plurality of identical type electrical parts are mounted and surely preventing the occurence of mis-assembly by excellent workability.SOLUTION: A component side identification mark 22 that can identify identical type electrical parts 14a and 14b is provided to at least the electrical parts 14a and 14b having different specifications, and a substrate side identification mark 32 corresponding to the component side identification mark 22 is provided to a mounting area of the identical type electrical parts 14a and 14b of a print circuit board 12.

    摘要翻译： 要解决的问题：为了提供具有新结构的安装基板，能够检查在印刷电路板上安装有不同规格的多个相同类型的电气部件的正常安装位置，当多个 安装了相同类型的电气部件，并且通过优异的可加工性确保了组装错误的发生。 解决方案：至少可以将具有不同规格的电气部件14a和14b设置为能够识别相同类型的电气部件14a和14b的部件侧识别标记22以及对应于部件侧识别标记的基板侧识别标记32 22被提供给印刷电路板12的相同类型的电气部件14a和14b的安装区域。版权所有：（C）2012，JPO＆INPIT

    Metal core wiring board and electric junction box having the same
    62.
    发明专利
    Metal core wiring board and electric junction box having the same 有权
    金属芯线接线板和具有相同功能的电接线盒

    公开(公告)号：JP2010273433A

    公开(公告)日：2010-12-02

    申请号：JP2009122097

    申请日：2009-05-20

    申请人： Yazaki Corp ,  矢崎総業株式会社

    发明人： SAWAI MAMORU

    IPC分类号： H02G3/16 ,  H05K1/05 ,  H05K7/20

    CPC分类号： H05K3/4092 ,  H05K1/0207 ,  H05K1/0265 ,  H05K1/09 ,  H05K3/202 ,  H05K3/3447 ,  H05K2201/0352 ,  H05K2201/0397 ,  H05K2201/09754 ,  H05K2201/10053

    摘要： PROBLEM TO BE SOLVED: To provide a metal core wiring board which easily radiates heat, and to provide an electrical junction box equipped with the metal core wiring board. SOLUTION: The electric junction box is provided with a case and the metal core wiring board 4 stored in the case. The metal core wiring board 4 includes a substrate 5 and a plurality of relays 6. The substrate 5 is formed in a plate shape where body parts 12a of two conductor plates 12 and body parts 13a of a plurality of conductor plates 13 are sandwiched between a pair of insulating sheets 10. The conductor plates 12 and 13 have terminal parts 12b and 13b, which project from outer edges of the insulating sheets 10 and are integrated with the body parts 12a and 13a. The conductor plates 12 and 13 are constituted of copper alloy including at least one from among iron, nickel, copper and zirconium. COPYRIGHT: (C)2011,JPO&INPIT

    摘要翻译： 要解决的问题：提供一种易于散热的金属芯线路板，并提供配备有金属芯线路板的电接线盒。

    解决方案：电接线盒设置有壳体和存储在壳体中的金属芯线路板4。 金属芯线路板4包括基板5和多个继电器6.基板5形成为板状，其中两个导体板12的主体部分12a和多个导体板13的主体部分13a夹在一个 一对绝缘片10.导体板12和13具有从绝缘片10的外边缘突出并与主体部分12a和13a成一体的端子部分12b和13b。 导体板12和13由包括铁，镍，铜和锆中的至少一种的铜合金构成。 版权所有（C）2011，JPO＆INPIT

    Electronic apparatus
    63.
    发明专利
    Electronic apparatus 有权
    电子设备

    公开(公告)号：JP2010199545A

    公开(公告)日：2010-09-09

    申请号：JP2009262065

    申请日：2009-11-17

    申请人： Canon Inc ,  キヤノン株式会社

    发明人： YAMADA KAZUNARI

    IPC分类号： H05K1/18 ,  H05K1/02

    CPC分类号： G03B17/02 ,  H04M1/0262 ,  H04M1/0274 ,  H05K1/18 ,  H05K3/301 ,  H05K2201/10037 ,  H05K2201/10053 ,  H05K2201/10151 ,  H05K2201/10325 ,  H05K2201/10409 ,  H05K2201/105

    摘要： PROBLEM TO BE SOLVED: To solve the following problem: an excessive load (stress) is applied to components or a wiring board corresponding to the degree of mounting deviation of the components when the position of the wiring board is determined by a component mounted on the wiring board other than a positioning portion of the wiring board.
    SOLUTION: The electronic apparatus includes the wiring board, a main member to which the wiring board is fixed, a first component mounted rigidly and unmovably on the wiring board and positioned with respect to the main member, and a second component mounted movably on the wiring board and positioned with respect to the main member, and the wiring board is provided with the positioning portion for determining a position of the wiring board with respect to the main member, wherein a distance from the positioning portion to the first component is shorter than a distance from the positioning portion to the second component.
    COPYRIGHT: (C)2010,JPO&INPIT

    摘要翻译： 要解决的问题：为了解决以下问题：当通过部件或部件确定布线板的位置时，对应于部件的安装偏移程度的部件或布线板施加过大的负载（应力） 安装在除了布线板的定位部分之外的布线板上。 解决方案：电子设备包括布线板，固定有布线板的主要部件，刚性且不可移动地安装在布线板上并相对于主要部件定位的第一部件，以及可移动地安装的第二部件 在布线基板上并相对于主构件定位，并且布线板设置有用于确定布线板相对于主构件的位置的定位部分，其中从定位部分到第一部件的距离为 短于从定位部分到第二部件的距离。 版权所有（C）2010，JPO＆INPIT

    Electromagnetic relay
    64.
    发明专利
    Electromagnetic relay 审中-公开
    电磁继电器

    公开(公告)号：JP2010113842A

    公开(公告)日：2010-05-20

    申请号：JP2008283336

    申请日：2008-11-04

    申请人： Fujitsu Component Ltd ,  富士通コンポーネント株式会社

    发明人： TAKANO SATORU

    IPC分类号： H01H50/14 ,  H01H45/04

    CPC分类号： H01H50/047 ,  H01H50/14 ,  H01H2050/044 ,  H05K1/18 ,  H05K3/308 ,  H05K2201/10053 ,  H05K2201/10462 ,  H05K2201/10818

    摘要： PROBLEM TO BE SOLVED: To provide a novel electromagnetic relay of low profile which has a simple and rational configuration.
    SOLUTION: The electromagnetic relay 1 includes a body part consisting of a holding block 10 to which various components such as a coil are fitted and a cover 20 attached to it, with the appearance being a rectangular solid. Terminals 5, 6, 7, and 8, having plate-like structure protrude from the body part. They protrude from the first plane A extending parallel to the thinnest direction of the body part, bend to be parallel to the thinnest direction of the body part in the plane vertical to the plate thickness direction of the terminals 5, 6, 7, and 8 and then extend beyond the second plane B across the thinnest direction of the body part. Since the tips of the terminals 5, 6, 7, and 8 extending beyond the second plane B of the body part are mounted on a substrate 30, the electromagnetic relay 1 is secured in such manner as the thinnest direction of the body part is vertical to the surface of the substrate 30.
    COPYRIGHT: (C)2010,JPO&INPIT

    摘要翻译： 要解决的问题：提供一种具有简单合理配置的低频电磁继电器。 解决方案：电磁继电器1包括主体部分，其由诸如线圈的各种部件装配的保持块10和附接到其上的盖20组成，外观为矩形固体。 具有板状结构的端子5,6,7和8从主体部分突出。 它们从平行于主体部分最薄方向延伸的第一平面A突出，弯曲成与垂直于端子5,6,7和8的板厚度方向的平面垂直于主体部分的最薄方向 然后穿过身体部分最薄的方向延伸超过第二平面B. 由于延伸超过主体部分的第二平面B的端子5,6,7和8的端部安装在基板30上，所以电磁继电器1以如下方式固定：主体部分的最薄方向垂直 到底板30的表面。（C）2010，JPO＆INPIT

    Switch
    65.
    发明专利
    Switch 审中-公开
    开关

    公开(公告)号：JP2010040428A

    公开(公告)日：2010-02-18

    申请号：JP2008204393

    申请日：2008-08-07

    申请人： Smk Corp ,  Smk株式会社

    发明人： MAEHARA MASATAKA

    IPC分类号： H01H13/04 ,  H01H13/52

    CPC分类号： H01H1/5805 ,  H01H13/04 ,  H01H13/48 ,  H01H2013/525 ,  H01H2207/02 ,  H01H2223/058 ,  H05K1/182 ,  H05K3/3426 ,  H05K2201/10053 ,  H05K2201/1084 ,  Y02P70/613

    摘要： PROBLEM TO BE SOLVED: To increase the soldering strength of a switch mounted to a base board, and to prevent flux from infiltrating into the switch. SOLUTION: A through-hole 32 is formed at a terminal 30 protruding from the side face of a housing, a body 11 is assembled in a cut-out portion 52 forming a gap 90 between itself and the side face of the housing, and the solder connection side of the terminal 30 is soldered to the solder mounting side 51 of a base board 50. Thereby, flux passes a space continuously formed in the through-hole 32 and the gap 90 and flows out to the end face of the base board, and contact action is stabilized since the flux is prevented from infiltrating into the switch. In addition, solder filet is formed on the inner surface of the through-hole 32 and soldering connection strength is thereby improved. COPYRIGHT: (C)2010,JPO&INPIT

    摘要翻译： 要解决的问题：提高安装在基板上的开关的焊接强度，防止焊剂渗透到开关中。 解决方案：在从壳体的侧面突出的端子30处形成有通孔32，主体11组装在切割部分52中，在切口部分52中形成在其与壳体的侧面之间的间隙90 并且端子30的焊料连接侧被焊接到基板50的焊接安装侧51。由此，焊剂通过连续形成在通孔32和间隙90中的空间，并流出到 基板和接触动作稳定，因为阻止磁通渗入开关。 此外，在通孔32的内表面上形成焊料，从而提高焊接连接强度。 版权所有（C）2010，JPO＆INPIT

    Detection device
    66.
    发明专利
    Detection device 有权
    检测装置

    公开(公告)号：JP2008096421A

    公开(公告)日：2008-04-24

    申请号：JP2007163767

    申请日：2007-06-21

    申请人： Giga-Byte Technology Co Ltd ,  技嘉科技股▲ふん▼有限公司

    发明人： KAO YUNG SHUN ,  LAI CHIH-MING

    IPC分类号： G01R31/28

    CPC分类号： G01R31/31905 ,  G01R31/31718 ,  H05K1/141 ,  H05K3/225 ,  H05K3/325 ,  H05K2201/049 ,  H05K2201/10053 ,  H05K2201/10303 ,  H05K2201/1053 ,  H05K2201/10689

    摘要： PROBLEM TO BE SOLVED: To provide a detection device that detects chips of a printed circuit board and is operable, without having to remove defective chips.
    SOLUTION: The detection device 20 detecting chips connected electrically to a printed circuit board is equipped with rewritable chip 21, containing a plurality of pins, a plurality of pins 25 installed on both sides to be electrically connected to the rewritable chip, an alternative printed circuit board 23 electrically connected to the pins of the rewritable chip, and a switch 29 connected to the chip and the rewritable chip to control the chip and the rewritable chip. According to the use of the device, since defect chips electrically connected to the detection device is made invalid and rewritable chip serves as substitute for the defect chip, the detection device can operate continuously without having to remove the defect chip.
    COPYRIGHT: (C)2008,JPO&INPIT

    摘要翻译： 要解决的问题：提供一种检测印刷电路板的芯片并且可操作的检测装置，而不必去除有缺陷的芯片。 检测装置20检测与印刷电路板电连接的芯片，配备有包含多个引脚的可重写芯片21，安装在两侧的多个引脚25，以电连接到可重写芯片， 电连接到可重写芯片的引脚的替代印刷电路板23和连接到芯片和可重写芯片的开关29，以控制芯片和可重写芯片。 根据该装置的使用，由于将与检测装置电连接的缺陷芯片变为无效，可重写芯片作为缺陷芯片的替代，所以检测装置可以连续工作而无需去除缺陷芯片。 版权所有（C）2008，JPO＆INPIT