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71.发明专利Base material for metal core substrate and method for manufacturing metal core substrate using the same 有权用于金属芯基材的基材和使用其制造金属核基材的方法
公开(公告)号：JP2011014639A
公开(公告)日：2011-01-20
申请号：JP2009155839
申请日：2009-06-30
申请人： Yazaki Corp , 矢崎総業株式会社
发明人： SAWAI MAMORU
摘要： PROBLEM TO BE SOLVED: To provide a base material for a metal core substrate which is inexpensive and excellent in heat dissipation, and a method for manufacturing the metal core substrate using the base material for the metal core substrate.SOLUTION: The base material 1 for the metal core sandwiched between a pair of prepregs 6 constituting the metal core substrate 5 includes a planar metal core 2, terminals 3 formed of metal having strength higher than that of the planar metal core 2 and a positioning member 4. The positioning member 4 is connected to the metal core 2, and positions the terminals 3 in a notch 10 of the metal core 2 where one-side ends 3a are sandwiched together with the metal core 2 by the pair of prepregs 6 and other ends 3b are protruded from outer edges of the prepregs 6 to the outside. The base material 1 for the metal core substrate is sandwiched between the pair of prepregs 6 in a state that the other ends 3b of the terminals 3 protrude from the outer edges of the pair of prepregs 6 to the outside, the base material 1 for the metal core substrate and the pair of prepregs 6 are pressurized and heated for integration, and then the positioning member 4 is cut to manufacture the metal core substrate 5.
摘要翻译： 要解决的问题：提供廉价且散热性优异的金属芯基板的基材以及使用该金属芯基板的基材的金属芯基板的制造方法。解决方案：用于 夹在构成金属芯基板5的一对预浸料6之间的金属芯包括平面金属芯2，金属形成的端子3，其强度高于平面金属芯2的强度，以及定位构件4.定位构件4为 连接到金属芯2，并且将端子3定位在金属芯2的凹口10中，其中一侧端部3a通过一对预浸料6与金属芯2夹在一起，而另一端3b从外边缘突出 的预浸料坯6到外面。 用于金属芯基板的基材1在端子3的另一端3b从一对预浸料坯6的外边缘突出到外侧的状态下夹在一对预浸料6之间，用于 将金属芯基板和一对预浸料坯6加压加热一体化，然后切断定位部件4，制造金属芯基板5。
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公开(公告)号：JP2010205361A
公开(公告)日：2010-09-16
申请号：JP2009052200
申请日：2009-03-05
申请人： Nitto Denko Corp , 日東電工株式会社
CPC分类号： G03F7/2022 , G03F1/144 , G03F1/70 , G11B5/4846 , H05K1/056 , H05K3/0023 , H05K3/28 , H05K2201/0191 , H05K2203/0505 , H05K2203/0588 , Y10T29/49155 , Y10T29/49156
摘要： PROBLEM TO BE SOLVED: To provide a suspension substrate with a circuit, preventing a damage of a cover insulating layer or a conductor patten during insertion into an E block, and also to provide its manufacturing method. SOLUTION: The suspension substrate 1 with a circuit is equipped with: a metal support substrate 6, a base insulating layer 7 formed on the substrate 6; a conductor pattern 8 formed on the layer 7; a cover insulating layer 9 formed on the base insulating layer 7 to cover the conductor pattern 8; and an insertion part 5 inserted into the E block. The thickness T1 of the cover insulating layer 9 in the insertion part 5 is set larger than the thickness T2 of the cover insulating layer 9 in a part other than the insertion part 5. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译： 要解决的问题：为了提供具有电路的悬架基板，防止在插入E块期间覆盖绝缘层或导体受损的损坏，并且还提供其制造方法。 解决方案：具有电路的悬架基板1配备有：金属支撑基板6，形成在基板6上的基底绝缘层7; 形成在层7上的导体图案8; 形成在基底绝缘层7上以覆盖导体图案8的覆盖绝缘层9; 以及插入到E块中的插入部5。 插入部5中的覆盖绝缘层9的厚度T1被设定为比插入部5以外的部分中的覆盖绝缘层9的厚度T2大。（C）2010，JPO＆INPIT
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公开(公告)号：JP4484251B2
公开(公告)日：2010-06-16
申请号：JP55020098
申请日：1998-05-20
申请人： マイクロ・コンポーネンツ・リミテツド
CPC分类号： H05K3/445 , C25D11/022 , C25D11/04 , H01L21/486 , H01L23/49811 , H01L23/49827 , H01L2924/0002 , H05K3/02 , H05K2201/09827 , H05K2203/0315 , H05K2203/0323 , H05K2203/1142 , Y10S428/901 , Y10T29/49155 , H01L2924/00
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公开(公告)号：JP4441671B2
公开(公告)日：2010-03-31
申请号：JP2003329278
申请日：2003-09-22
申请人： Dowaメタルテック株式会社
CPC分类号： H01L21/4871 , H01L23/3735 , H01L2924/0002 , H05K1/0306 , H05K3/061 , H05K3/101 , H05K2203/0108 , H05K2203/128 , H05K2203/1476 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49146 , Y10T29/49155 , Y10T29/49156 , H01L2924/00
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公开(公告)号：JP2010044998A
公开(公告)日：2010-02-25
申请号：JP2008209914
申请日：2008-08-18
申请人： Sekisui Chem Co Ltd , 積水化学工業株式会社
IPC分类号： H01B3/00 , B32B15/092 , C08G59/40 , C08K3/00 , C08K5/1525 , C08L63/00 , C08L71/10 , C08L101/00 , H05K1/05 , H05K3/44
CPC分类号： C08G59/245 , B32B15/08 , B32B27/38 , C08F220/14 , C08F220/32 , C08G65/18 , C08L63/00 , C08L71/00 , C08L2666/14 , C08L2666/22 , C09J163/00 , C09J171/00 , H01B3/427 , H05K1/056 , Y10T428/31515 , Y10T428/31522
摘要： PROBLEM TO BE SOLVED: To provide an insulating sheet which is used for adhering a heat conductor having a thermal conductivity of 10 W/m/K or more to a conductive layer, which is superior in handleability in an uncured state, from which a cured product having superior processability can be obtained, and furthermore, from which the cured product having superior dielectric breakdown characteristics, thermal conductivity and heat resistance can be obtained. SOLUTION: The insulating sheet 3 is used for adhering the heat conductor 4 having a thermal conductivity of 10 W/m/K or more to the conductive layer 2, and contains a polymer (A) having an aromatic skeleton and a weight average molecular weight of 30,000 or more, at least one monomer (B) out of an epoxy monomer (B1) and an oxetane monomer (B2) which have the aromatic skeleton and the weight average molecular weight of 600 or less, a curing agent (C), an inorganic filler (D), and an organic filler (E). COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译： 要解决的问题：提供一种绝缘片，其用于将具有10W / m / K以上的导热性的导热体粘附到在未固化状态下的可操作性优异的导电层上 可以获得具有优异加工性的固化产物，此外，可以获得具有优异的介电击穿特性，导热性和耐热性的固化产物。 解决方案：绝缘片3用于将导热层2的热导率为10W / m / K以上的导热体4粘接到导电层2上，并且含有具有芳香骨架和重量的聚合物（A） 平均分子量为30,000以上，环氧单体（B1）中的至少一种单体（B）和芳族骨架，重均分子量为600以下的氧杂环丁烷单体（B2），固化剂（ C），无机填料（D）和有机填料（E）。 版权所有（C）2010，JPO＆INPIT
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公开(公告)号：JP2009289850A
公开(公告)日：2009-12-10
申请号：JP2008138914
申请日：2008-05-28
申请人： Sanyu Rec Co Ltd , サンユレック株式会社
发明人： OYAMA NORITAKA
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a metal core-containing multilayer substrate that shortens manufacturing process and reduces costs. SOLUTION: The method of manufacturing the metal core-containing multilayer substrate which has electric insulators 3 and 5 interposed between a pair of conductive foils 1 and 11 and is provided with a metal core 4 in the electric insulators 3 and 5, includes a first insulator forming process of forming the first insulator 3 on one conductive foil 1, a metal plate wiring process of arranging a metal plate 4 having through-holes 4a on the first insulator 3, a second insulator forming process of forming the second insulator 5 on the metal plate 4, a conductive foil arranging process of arranging the other conductive foil 7 on the second insulator 5 to form a stack 10, and a heat pressing process of heat-pressing the stack 10 under a vacuum, wherein at least one of the first insulator forming process and second insulator forming process includes a printing process of printing insulating resins 3 and 5. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译： 要解决的问题：提供一种制造含金属芯的多层基板的方法，其缩短制造工艺并降低成本。 解决方案：制造含有金属芯的多层基板的方法，其具有介于一对导电箔1和11之间并且在电绝缘体3和5中设置有金属芯4的电绝缘体3和5，其包括 在一个导电箔1上形成第一绝缘体3的第一绝缘体形成工艺，在第一绝缘体3上布置具有通孔4a的金属板4的金属板布线工艺，形成第二绝缘体5的第二绝缘体形成工艺 在金属板4上，将另一个导电箔7布置在第二绝缘体5上以形成叠层10的导电箔布置工艺，以及在真空下对叠层10进行热压的热压工艺，其中至少一个 第一绝缘体形成工艺和第二绝缘体形成工艺包括印刷绝缘树脂3和5的印刷工艺。版权所有（C）2010，JPO＆INPIT
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公开(公告)号：JP2009267042A
公开(公告)日：2009-11-12
申请号：JP2008114126
申请日：2008-04-24
发明人： MATSUOKA TORU , SHIMOMURA TETSUYA , UENISHI NAOTA
摘要： PROBLEM TO BE SOLVED: To provide a printed wiring board which allows simplification of a manufacturing process, and to provide a method of manufacturing the printed wiring board.
SOLUTION: The printed wiring board 1 includes a metallic substrate 2, an insulating layer 3 formed on the surface of the metallic substrate 2, an adhesive layer 6 formed on the surface of the insulating layer 3 and composed of polyimide resin having a glass transition temperature of 20 to 300°C and thermoplasticity, and a metallic foil layer 8 formed on the surface of the adhesive layer 6.
COPYRIGHT: (C)2010,JPO&INPIT摘要翻译： 要解决的问题：提供一种允许简化制造工艺的印刷线路板，并提供制造印刷线路板的方法。 解决方案：印刷电路板1包括金属基板2，形成在金属基板2的表面上的绝缘层3，形成在绝缘层3的表面上并由聚酰亚胺树脂构成的粘合层6， 玻璃化转变温度为20-300℃和热塑性，以及形成在粘合剂层6的表面上的金属箔层8.版权所有（C）2010，JPO＆INPIT
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公开(公告)号：JP2009200234A
公开(公告)日：2009-09-03
申请号：JP2008040040
申请日：2008-02-21
发明人： TAKAHASHI KOICHI
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To solve the problem that it is troublesome to assemble a metal base substrate since a printed wiring board is fitted to a metal plate often by soldering and screwing after components are mounted. SOLUTION: The present invention relates to the metal base substrate having the metal plate and printed wiring board, the metal base substrate having the metal plate has at least one fixing pin for fixing the positions of a solder layer formed between the printed wiring board and metal plate and the printed wiring board, and the printed wiring board which has an insertion hole which is formed corresponding to the position of the fixing pin and in which the fixing pin is pressed. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译： 要解决的问题：为了解决组装金属基底板是麻烦的问题，因为印刷线路板经常通过在安装部件之后通过焊接和旋拧而被装配到金属板上。 解决方案：本发明涉及具有金属板和印刷线路板的金属基底板，具有金属板的金属基底具有至少一个固定销，用于固定形成在印刷线路之间的焊料层的位置 板和金属板和印刷线路板，以及印刷电路板，其具有与固定销的位置对应地形成的插入孔，并且固定销被按压。 版权所有（C）2009，JPO＆INPIT
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公开(公告)号：JP2009188363A
公开(公告)日：2009-08-20
申请号：JP2008029799
申请日：2008-02-08
发明人： ORITO HIROSHI
摘要： PROBLEM TO BE SOLVED: To provide a multilayer printed circuit board which prevents the occurrence of uneven stresses in the inside and on the outside of a through-hole caused by temperature environmental change and which is capable of improving the product reliability and reducing the production cost, and to provide a manufacturing method therefor. SOLUTION: In the through-hole 4 of the multilayer printed circuit board P1, an insulation material 8 whose Young's modulus is lower than that of resin impregnated in a prepreg is embedded, so that the regulation of properties, such as, reliability with respect to the change in the temperature environmental can be maintained low, and the occurrence of an uneven stress inside and outside the through-hole 4 with respect to the temperature environmental change can be prevented. Also, since the need for the prepreg resin to be poured into the through-hole 4 can be dispensed with, there is no need for the number of the prepregs to be increased, even when a metal core 1 is thick or when the number of the through-holes 4 is large. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译： 要解决的问题：提供一种多层印刷电路板，其防止由温度环境变化引起的通孔内部和外部的不均匀应力的发生，并且能够提高产品的可靠性和降低 生产成本，并提供其制造方法。 解决方案：在多层印刷电路板P1的通孔4中嵌入了杨氏模量低于浸渍在预浸料中的树脂的绝缘材料8，使得可靠性的调节 相对于温度变化，可以保持环境保持低，并且可以防止通孔4内部和外部相对于温度环境变化的不均匀应力的发生。 此外，由于可以省略将预浸料树脂注入到通孔4中的需要，所以即使金属芯1较厚，也不需要增加预浸料坯的数量， 通孔4大。 版权所有（C）2009，JPO＆INPIT
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公开(公告)号：JP2009170500A
公开(公告)日：2009-07-30
申请号：JP2008004226
申请日：2008-01-11
申请人： Fujitsu Ltd , 富士通株式会社
发明人： SAITO KAZUMASA , ABE TOMOYUKI
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board by forming fine through-holes having a single via structure in a conductive substrate.
SOLUTION: The method of manufacturing the printed wiring board includes the steps of: forming through-holes in a conductive core base material; immersing the conductive core base material in a liquid resin; taking the conductive core base material out of the liquid resin; and curing the liquid resin adhered to the inside wall of the through-hole to form an insulating film on the inside wall of the through-hole.
COPYRIGHT: (C)2009,JPO&INPIT摘要翻译： 要解决的问题：提供一种通过在导电基板中形成具有单一通孔结构的精细通孔来制造印刷线路板的方法。 解决方案：制造印刷电路板的方法包括以下步骤：在导电芯基材中形成通孔; 将导电芯基材浸渍在液体树脂中; 将导电芯基材从液态树脂中取出; 并且固化粘附到通孔的内壁的液体树脂，以在通孔的内壁上形成绝缘膜。 版权所有（C）2009，JPO＆INPIT
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