-
公开(公告)号：JP2015029106A
公开(公告)日：2015-02-12
申请号：JP2014165234
申请日：2014-08-14
申请人： メジット・アクイジション・コーポレーションMegit Acquisition Corp. , Megit Acquisition Corp , メジット・アクイジション・コーポレーションMegit Acquisition Corp.
发明人： MUU-SHUN RIN
IPC分类号： H01L25/065 , H01L21/822 , H01L25/07 , H01L25/18 , H01L27/04 , H03K19/003
CPC分类号： H01L2224/16145 , H01L2224/48091 , H01L2924/15311 , H01L2924/00014
摘要： 【課題】ESD保護回路および入出力回路を持たない構造の集積回路チップ間のチップ間通信を行う多重集積回路チップ構造を提供する。【解決手段】多重集積回路チップ構造は、テストおよびバーン・イン手順中に外部テスト・システムと通信するためのESD保護回路387および入出力回路389を有するインターフェース回路385をテストするため集積回路の内部回路を選択的に接続するチップ間インターフェース回路360を有する。多重配線集積回路チップ構造は、集積回路チップを相互に物理的かつ電気的に接続するため1つ以上の第2の集積回路チップ310へ取付けられた第1の集積回路チップ305を有する。【選択図】図4
摘要翻译： 要解决的问题：提供用于在具有既不包括ESD保护电路也不包括输入/输出电路的结构的集成电路芯片之间执行芯片间通信的多个集成电路芯片结构。解决方案：多集成电路芯片结构包括芯片间接口 电路360被配置为选择性地连接集成电路的内部电路，以便测试具有ESD保护电路387和输入/输出电路389的接口电路385，用于在测试期间与外部测试系统进行通信， 在程序中。 多路布线集成电路芯片结构包括附接到一个或多个第二集成电路芯片310的第一集成电路芯片305，用于相互物理和电连接集成电路芯片。
-
公开(公告)号：JP2014168079A
公开(公告)日：2014-09-11
申请号：JP2014081371
申请日：2014-04-10
发明人： LIN MOU SHIUNG , LEE JIN YUAN
IPC分类号： H01L27/14 , B81B7/02 , H01L27/146 , H01L31/02 , H04N5/374 , H04N101/00
CPC分类号： H01L31/0203 , H01L24/45 , H01L27/14618 , H01L27/14621 , H01L27/14627 , H01L27/14632 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/8592 , H01L2924/01015 , H01L2924/01047 , H01L2924/12042 , H01L2924/13091 , H01L2924/1461 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/20751 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide an image or light sensor chip package for enhancing electric properties while reducing manufacture cost.SOLUTION: The image or light sensor chip package includes an image or light sensor chip 99 having a non-photosensitive area and a photosensitive area surrounded by the non-photosensitive area. In the photosensitive area, there are light sensors, a layer of color filter array 7 over the light sensors and microlenses 8 over the layer of color filter array. In the non-photosensitive area, there are an adhesive polymer layer and multiple metal structures having a portion in the adhesive polymer layer. A transparent substrate 11 is formed on a top surface of the adhesive polymer layer and over the microlenses. The image or light sensor chip package also includes a flexible substrate or wire-bonded wires bonded with the metal structures of the image or light sensor chip.
摘要翻译： 要解决的问题：提供用于增强电特性同时降低制造成本的图像或光传感器芯片封装。解决方案：图像或光传感器芯片封装包括具有非感光区域和感光区域的图像或光传感器芯片99 被非感光区包围。 在感光区域中有光传感器，彩色滤光片阵列7上的一层彩色滤光片阵列上的光传感器和微透镜8。 在非感光区域中，粘合聚合物层和粘合聚合物层中具有一部分的多个金属结构体。 透明基板11形成在粘合聚合物层的顶表面上并且在微透镜上。 图像或光传感器芯片封装还包括与图像或光传感器芯片的金属结构接合的柔性基板或线接合引线。
-
公开(公告)号：JP2014042050A
公开(公告)日：2014-03-06
申请号：JP2013214264
申请日：2013-10-11
发明人： MUU-SHUN RIN
IPC分类号： H01L21/822 , H01L21/3205 , H01L21/768 , H01L23/12 , H01L23/522 , H01L23/532 , H01L27/04
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a high performance system on-chip using a post passivation method.SOLUTION: Electric elements of high quality (e.g. an inductor, a capacitor or a resistor) are formed on a passivation layer 18 or a surface of a thick polymer layer 20. This method further provides a method for mounting a discrete electronic element in a state that the element is considerably isolated from a surface of a lower silicon substrate 10.
摘要翻译： 要解决的问题：使用后钝化方法提供片上高性能系统。解决方案：在钝化层18或表面上形成高质量的电元件（例如电感器，电容器或电阻器） 该方法还提供了一种用于将元件与下硅衬底10的表面相当隔离的状态安装在离散电子元件上的方法。
-
公开(公告)号：JP2014103411A
公开(公告)日：2014-06-05
申请号：JP2014007143
申请日：2014-01-17
发明人： HAYASHI SHIGEO , CHOU CHIEN-KANG , CHEN KE-HUNG
IPC分类号： H01L21/3205 , H01L21/768 , H01L23/12 , H01L23/522
CPC分类号： H01L23/5227 , H01L21/2885 , H01L21/563 , H01L21/76801 , H01L21/76885 , H01L23/3114 , H01L23/5223 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/83 , H01L2224/0347 , H01L2224/0401 , H01L2224/04042 , H01L2224/04073 , H01L2224/05173 , H01L2224/05176 , H01L2224/05183 , H01L2224/05548 , H01L2224/05571 , H01L2224/05572 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05664 , H01L2224/05669 , H01L2224/1147 , H01L2224/13022 , H01L2224/13099 , H01L2224/131 , H01L2224/16 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/45164 , H01L2224/45169 , H01L2224/45173 , H01L2224/45176 , H01L2224/45183 , H01L2224/48091 , H01L2224/48463 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48664 , H01L2224/48669 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48864 , H01L2224/83101 , H01L2224/83192 , H01L2924/00011 , H01L2924/00014 , H01L2924/0002 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/09701 , H01L2924/10329 , H01L2924/12044 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/15787 , H01L2924/15788 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/351 , H01L2924/00 , H01L2224/48869 , H01L2224/83851 , H01L2224/05552 , H01L2224/05599
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing process of a line device structure, which relieves stress and makes interval distance of a contact window structure small, and to provide the structure.SOLUTION: A line device structure comprises a substrate, a first metal pole 68 and a second metal pole. The first metal pole 68 is positioned on the substrate. When maximum side dimension Hw of the first metal pole 68 is divided by height Ht of the first metal pole 68, a quotient is smaller than four. The height of the first metal pole 68 is 20 μm to 300 μm. The second metal pole is positioned on the substrate. When maximum side dimension of the second metal pole is divided by height of the second metal pole, a quotient is smaller than four. Distance Hb from a center point of the first metal pole to a center point of the second metal pole is 10 μm to 250 μm.
摘要翻译： 要解决的问题：提供减轻应力并使接触窗结构的间隔距离小的线路装置结构的制造工艺，并提供结构。解决方案：线路器件结构包括衬底，第一金属极 68和第二金属杆。 第一金属杆68位于基底上。 当第一金属杆68的最大侧面尺寸Hw除以第一金属杆68的高度Ht时，商大于4。 第一金属杆68的高度为20μm〜300μm。 第二金属杆位于基板上。 当第二金属极的最大侧面尺寸除以第二金属极的高度时，商大于4。 从第一金属极的中心点到第二金属极的中心点的距离Hb为10μm〜250μm。
-
公开(公告)号：JP5429764B2
公开(公告)日：2014-02-26
申请号：JP2001056759
申请日：2001-03-01
发明人： エム・エス・リン
IPC分类号： H01L21/768 , H01L23/522 , H01L21/3205 , H01L21/82 , H01L21/822 , H01L23/52 , H01L27/04
-
公开(公告)号：JP5435524B2
公开(公告)日：2014-03-05
申请号：JP2006173778
申请日：2006-06-23
IPC分类号： H01L21/3205 , H01L21/768 , H01L21/822 , H01L23/12 , H01L23/522 , H01L27/04
CPC分类号： H01L23/5227 , H01L21/2885 , H01L21/563 , H01L21/76801 , H01L21/76885 , H01L23/3114 , H01L23/5223 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/83 , H01L2224/0347 , H01L2224/0401 , H01L2224/04042 , H01L2224/04073 , H01L2224/05173 , H01L2224/05176 , H01L2224/05183 , H01L2224/05548 , H01L2224/05571 , H01L2224/05572 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05664 , H01L2224/05669 , H01L2224/1147 , H01L2224/13022 , H01L2224/13099 , H01L2224/131 , H01L2224/16 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/45164 , H01L2224/45169 , H01L2224/45173 , H01L2224/45176 , H01L2224/45183 , H01L2224/48091 , H01L2224/48463 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48664 , H01L2224/48669 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48864 , H01L2224/83101 , H01L2224/83192 , H01L2924/00011 , H01L2924/00014 , H01L2924/0002 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/09701 , H01L2924/10329 , H01L2924/12044 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/15787 , H01L2924/15788 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/351 , H01L2924/00 , H01L2224/48869 , H01L2224/83851 , H01L2224/05552 , H01L2224/05599
-
-
-
-
-
搜索结果
6 条记录 (耗时 0.015 秒)
