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公开(公告)号:JP6190264B2
公开(公告)日:2017-08-30
申请号:JP2013257774
申请日:2013-12-13
申请人: 東芝メモリ株式会社
CPC分类号: H01L21/67265 , C23C14/54 , C23C14/56 , H01L21/67259 , H01L21/67288 , H01L23/552 , H01L2924/0002 , H01L2924/14
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公开(公告)号:JP6418625B2
公开(公告)日:2018-11-07
申请号:JP2013258660
申请日:2013-12-13
申请人: 東芝メモリ株式会社
CPC分类号: H01L23/552 , H01L21/561 , H01L23/295 , H01L23/3128 , H01L23/544 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/0657 , H01L2223/54406 , H01L2223/54433 , H01L2223/54486 , H01L2224/32145 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06537 , H01L2225/06562 , H01L2924/00014 , H01L2924/12042 , H01L2924/1438 , H01L2924/15311 , H01L2924/15787 , H01L2924/15788 , H01L2924/1579 , H01L2924/181 , H01L2924/1815 , H01L2224/85 , H01L2224/32225 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
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公开(公告)号:JP6219155B2
公开(公告)日:2017-10-25
申请号:JP2013258704
申请日:2013-12-13
申请人: 東芝メモリ株式会社
CPC分类号: H01L23/552 , H01L23/3128 , H01L24/97 , H01L21/561 , H01L2223/54406 , H01L2223/5442 , H01L2223/54433 , H01L2223/54486 , H01L2224/32225 , H01L2224/48095 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L23/295 , H01L24/32 , H01L24/48 , H01L24/73 , H01L2924/00014 , H01L2924/12042 , H01L2924/15159 , H01L2924/15311 , H01L2924/181
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