公开(公告)号：US20160099205A1

公开(公告)日：2016-04-07

申请号：US14845573

申请日：2015-09-04

Applicant: HEUNG KYU KWON ,  HAE GU LEE ,  BYEONG YEON CHO

Inventor： HEUNG KYU KWON ,  HAE GU LEE ,  BYEONG YEON CHO

IPC: H01L23/498 ,  H01L23/544 ,  G06F1/16 ,  H01L25/18 ,  H01L23/48 ,  H05K1/18 ,  H01L23/31 ,  H01L25/065

CPC classification number: G06F1/1601 ,  G06F1/16 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/16 ,  H01L24/97 ,  H01L25/105 ,  H01L25/50 ,  H01L2223/54406 ,  H01L2223/54426 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/1815 ,  H01L2924/18161 ,  H05K1/0269 ,  H05K3/3436 ,  H05K2201/10159 ,  H05K2201/10515 ,  H05K2201/10734 ,  H05K2201/10977 ,  H01L2224/81

Abstract: A semiconductor package includes a printed circuit board (PCB), a chip bonded to the PCB, a mold protecting the chip and exposing a backside surface of the chip, via openings extending in the mold to expose first contacts bonded to the PCB, and at least one first marking inscribed in a marking region of the mold between the backside surface of the chip and the vias. The mold has an exposed molded underfill (eMUF) structure covering the sides of the chip while exposing the backside surface of the chip. A PoP package includes a top package stacked on and electrically connected to the semiconductor package.

Abstract translation: 半导体封装包括印刷电路板（PCB），与PCB结合的芯片，通过在模具中延伸的开口来露出芯片背面的模具，以暴露出与PCB结合的第一触点，以及 在芯片的背面和通孔之间刻有刻在模具的标记区域中的至少一个第一标记。 模具具有暴露的模制底部填充（eMUF）结构，覆盖芯片的两侧同时暴露芯片的背面。 PoP封装包括堆叠在电连接到半导体封装上的顶部封装。

公开(公告)号：US20120141488A1

公开(公告)日：2012-06-07

申请号：US13322304

申请日：2009-09-07

Applicant: Kyung Sook Chung ,  Mi Sun Won ,  Ji Won Ahn ,  Jeong Hae Choi ,  Hyang Sook Yoo ,  Young Il Yeom ,  Eun Young Song ,  Hae Gu Lee ,  Jae Hun Cheong ,  Chang Mo Kang

Inventor： Kyung Sook Chung ,  Mi Sun Won ,  Ji Won Ahn ,  Jeong Hae Choi ,  Hyang Sook Yoo ,  Young Il Yeom ,  Eun Young Song ,  Hae Gu Lee ,  Jae Hun Cheong ,  Chang Mo Kang

IPC: A61K39/395 ,  G01N33/53 ,  G01N33/566 ,  G01N27/447 ,  A61K31/7088 ,  A61P35/00 ,  A61P35/04 ,  C12Q1/68 ,  C12Q1/02

CPC classification number: C07K14/705 ,  G01N33/5041

Abstract: Disclosed are novel GPCR (G Protein Coupled Receptor) proteins and genes encoding the same. Also provided is the use of the proteins and the genes. Particularly, contemplated are a novel GPCR (G Protein Coupled Receptor) polypeptide, a polynucleotide coding for the same, a recombinant vector carrying the polynucleotide or a fragment thereof, host cells transformed with the vector, a transgenic animal infected with the vector. Also, a composition for detecting a cancer marker, comprising an agent capable of measuring the expression level of mRNA or protein of the GPCR polynucleotide, a kit for the diagnosis of cancer, comprising the composition, and a method for detecting the GPCR polypeptide and a gene encoding the polypeptide are provided. Further, a composition for the treatment and prevention of cancer, comprising an oligonucleotide inhibiting the expression of a gene encoding the GPCR polypeptide or an antibody against the GPCR protein, and a method for screening a modulator of the GPCR protein or a cancer therapeutic agent are provided.

Abstract translation: 公开了新型GPCR（G蛋白偶联受体）蛋白和编码其的基因。 还提供了蛋白质和基因的使用。 特别地，考虑了新型GPCR（G蛋白偶联受体）多肽，编码它的多核苷酸，携带多核苷酸或其片段的重组载体，用该载体转化的宿主细胞，用载体感染的转基因动物。 另外，含有能够测定GPCR多核苷酸的mRNA或蛋白质的表达量的试剂，癌症诊断用试剂盒，含有该组合物的检测癌标记物的组合物，以及检测GPCR多肽的方法和 提供编码多肽的基因。 此外，用于治疗和预防癌症的组合物包含抑制GPCR多肽或编码GPCR蛋白的抗体表达的寡核苷酸以及筛选GPCR蛋白或癌症治疗剂的调节剂的方法， 提供。

公开(公告)号：US09665122B2

公开(公告)日：2017-05-30

申请号：US14845573

申请日：2015-09-04

Applicant: Heung Kyu Kwon ,  Hae Gu Lee ,  Byeong Yeon Cho

Inventor： Heung Kyu Kwon ,  Hae Gu Lee ,  Byeong Yeon Cho

IPC: H01L23/48 ,  G06F1/16 ,  H01L23/498 ,  H01L23/544 ,  H01L23/00 ,  H01L25/10 ,  H01L25/00 ,  H01L23/538 ,  H01L23/31 ,  H01L21/56 ,  H05K1/02 ,  H05K3/34

CPC classification number: G06F1/1601 ,  G06F1/16 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/16 ,  H01L24/97 ,  H01L25/105 ,  H01L25/50 ,  H01L2223/54406 ,  H01L2223/54426 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/1815 ,  H01L2924/18161 ,  H05K1/0269 ,  H05K3/3436 ,  H05K2201/10159 ,  H05K2201/10515 ,  H05K2201/10734 ,  H05K2201/10977 ,  H01L2224/81

Abstract: A semiconductor package includes a printed circuit board (PCB), a chip bonded to the PCB, a mold protecting the chip and exposing a backside surface of the chip, via openings extending in the mold to expose first contacts bonded to the PCB, and at least one first marking inscribed in a marking region of the mold between the backside surface of the chip and the vias. The mold has an exposed molded underfill (eMUF) structure covering the sides of the chip while exposing the backside surface of the chip. A PoP package includes a top package stacked on and electrically connected to the semiconductor package.