摘要:
A memory system and memory module includes a plurality of memory devices, each having a plurality, e.g. four, ports for transmitting and receiving command signals, write data signals and read data signals. One of the memory devices is connected to a host or controller, and the remaining memories are connected together, typically by point-to-point links. When the memory system configuration is such that at least one of the ports in at least one of the memory devices is not used, one or more other ports can use the pins that may otherwise have been used by the unused ports. As a result, a set of reconfigurable, shared pins is defined in which two ports share the pins. The port that is not being used in a particular application for the memory device is not connected to the shared pins, and another port that is being used in the application is connected to the shared pins. This allows for the used of fewer package pins and, consequently, reduced package size.
摘要:
Provided is a data parallelizing receiver including an input signal receiver for externally receiving serial data as packets, sampling the serial data, aligning the sampled data in an input order, and converting the aligned data into parallel data to output the parallel data, a cyclic redundancy check (CRC) partial calculator for receiving the parallel data, classifying the parallel data into groups according to the input order, and performing a partial CRC calculation on each of the groups to sequentially output a plurality of partial CRC calculation results, and a CRC partial calculation merger for receiving the plurality of partial CRC calculation results and merging the partial CRC calculation results to output CRC calculation data.
摘要:
A memory system selectively sets signaling modes based on stack position information. The memory system includes a memory module having at least one semiconductor memory device and a memory controller configured to set a signaling mode based on stack position information of each of the semiconductor memory devices. A signaling between the memory controller and each of the semiconductor memory devices is performed in a differential signaling mode, and a signaling among the semiconductor memory devices is performed in a single-ended signaling mode. Accordingly, the memory system has reduced power consumption.
摘要:
A dynamic output buffer circuit performs an impedance matching function and a pre-emphasis function by using input and output signals, and consumes relatively less power, occupies a relatively smaller layout area, and dynamically varies an output impedance. The dynamic output buffer circuit dynamically matches an output impedance to the characteristic impedance of a metal line connected to an external circuit, pre-emphasizes at least one input signal, and includes a control circuit and an output circuit. The control circuit matches the output impedance of the dynamic output circuit to the characteristic impedance of the metal line in response to at least one output signal, and outputs a plurality of resistor control signals which are used to pre-emphasize at least one input signal in response to the input signal. The output circuit controls the output impedance and pre-emphasizes the input signal in response to the resistor control signals, and outputs the output signal.
摘要:
A memory module includes a plurality of data ports configured to receive/transmit associated data and a plurality of memory devices. The plurality of memory devices include a first set of the memory devices in at least one rank, each memory device of the first set being coupled to each of the associated data ports, and a second set of the memory devices in at least one other rank, each memory device of the second set being configured to receive/transmit the associated data for the memory device through at least each associated memory device of the first set.
摘要:
A memory controller controlling a plurality of semiconductor memory devices includes a refresh control circuit controlling refresh operations of the semiconductor memory devices. The refresh control circuit classifies the semiconductor memory devices into first and second groups and sets an auto refresh interval of the semiconductor memory devices belong to the first group and an auto refresh interval of the semiconductor memory devices belong to the second group different from each other.
摘要:
The present invention relates to a pin configuration in a highly integrated memory chip; and, more particularly, to a CSP pin configuration which is compatible with a TSOP pin configuration. A CSP semiconductor device according to the present invention comprises: a die pad area formed in the middle of a semiconductor chip; a first ball pad area allocated at a left side of the die pad area, having a ball array having first and second columns; and a second ball pad area allocated at a right side of the die pad area, having a ball array having first and second columns, wherein the first ball pad area includes ball pads which are positioned at a right side of a corresponding TSOP, wherein the second ball pad area includes ball pads which are positioned at a left side of the corresponding TSOP, wherein the first column of the first ball pad area includes even number pins of the corresponding TSOP, which are disposed in order of lower priority, and the second column of the first ball pad area includes odd number pins of the corresponding TSOP, which are disposed in order of lower priority, and wherein the first column of the second ball pad area includes even number pins of the corresponding TSOP, which are disposed in order of higher priority, and the second column of the second ball pad area includes odd number pins of the TSOP, which are disposed in order of higher priority.
摘要:
A composite mode substrate voltage generation circuit for a DRAM which has a memory cell block and a peripheral circuit block formed on a single substrate. The circuit comprises a back-bias voltage generator for generating a first back-bias voltage in response to a normal refresh mode control signal or a second back-bias voltage in response to a self-refresh mode control signal and supplying the generated first or second back-bias voltage to the memory cell and peripheral circuit blocks, a first voltage level detector for detecting a level of the first back-bias voltage from the back-bias voltage generator, comparing the detected level of the first back-bias voltage with a first reference voltage level and controlling a voltage pumping operation of the back-bias voltage generator in accordance with the compared result, and a second voltage level detector for detecting a level of the second back-bias voltage from the back-bias voltage generator, comparing the detected level of the second back-bias voltage with a second reference voltage level and controlling the voltage pumping operation of the back-bias voltage generator in accordance with the compared result. A self-refresh operation can stably be performed at low power consumption, resulting in an increase in refresh efficiency of the DRAM.
摘要:
A semiconductor device includes a first memory region including a plurality of memory cells; a test unit configured to test the first memory region, and detect a weak bit from among the plurality of memory cells; and a second memory region configured to store a weak bit address (WBA) of the first memory region, and data intended to be stored in the weak bit, wherein the first memory region and the second memory region include different types of memory cells.
摘要:
A semiconductor package is disclosed. The semiconductor package includes a package interface, a stack of semiconductor chips, a plurality of stacks of through substrate vias, and an interface circuit. The package interface includes at least a first pair of terminals. Each stack of through substrate vias includes plural through substrate vias of respective ones of the semiconductor chips, each through substrate via electrically connected to a through substrate via of an immediately adjacent semiconductor chip. The interface circuit includes an input connected to the first pair of terminals to receive a differential signal providing first information, and includes an output to provide an output signal including the first information in a single-ended signal format to at least one of the plurality of stacks of through substrate vias.