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13 条记录 (耗时 0.018 秒)

    Isostress grid array and method of fabrication thereof
    2.
    发明申请
    Isostress grid array and method of fabrication thereof 有权
    异构网格阵列及其制造方法

    公开(公告)号：US20110074009A1

    公开(公告)日：2011-03-31

    申请号：US12923581

    申请日：2010-09-29

    申请人： John A. Hughes ,  Christy A. Hagerty ,  Santos Nazario-Camacho ,  Keith K. Sturcken

    发明人： John A. Hughes ,  Christy A. Hagerty ,  Santos Nazario-Camacho ,  Keith K. Sturcken

    IPC分类号： H01L23/49 ,  H01L21/60

    CPC分类号： H01L21/50 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/562 ,  H01L2224/13 ,  H01L2924/14

    摘要： An electronic device package includes a substrate and wire columns arranged in groups about a neutral stress point of the substrate. The height of the wire columns is substantially uniform for the plural groups of wire columns, and a length of at least one of the wire columns is greater than the uniform height. A method of fabricating an electronic device package having a column grid array includes applying two templates on wire columns of the column grid array and bending at least one wire column to increase its length while maintaining a uniform height for the column grid array. In another aspect, an electronic device package substrate includes wire columns having at least one non-uniformity in lengths of the columns, and the length of a wire column corresponds to a distance of that wire column from the neutral stress point of the substrate. The non-uniformity of length in the wire columns reduces stress in the package leads after attachment of the package to a carrier substrate, such as a printed circuit board.

    摘要翻译： 一种电子器件封装，包括基板和布置成围绕基板的中性应力点组成的线柱。 线列的高度对于多组线柱而言基本上是均匀的，并且线柱中的至少一个的长度大于均匀的高度。 一种制造具有列栅格阵列的电子器件封装的方法，包括在列格栅阵列的线柱上施加两个模板，并弯曲至少一个线柱以增加其长度，同时保持柱格阵列的均匀高度。 在另一方面，一种电子器件封装衬底包括具有柱长度至少一个不均匀性的线柱，并且线柱的长度对应于该线柱与衬底的中性应力点的距离。 电线柱中的长度不均匀性降低了将封装件附接到诸如印刷电路板的载体衬底之后的封装引线中的应力。

    Method and system for introduction of an active material to a chemical process
    7.
    发明授权
    Method and system for introduction of an active material to a chemical process 有权
    向化学工艺引入活性物质的方法和系统

    公开(公告)号：US08580075B2

    公开(公告)日：2013-11-12

    申请号：US13451685

    申请日：2012-04-20

    申请人： John A. Hughes ,  Sandra Hyland ,  Ralph Kim

    发明人： John A. Hughes ,  Sandra Hyland ,  Ralph Kim

    IPC分类号： C23F1/00 ,  H01L21/306 ,  C23C16/00

    CPC分类号： H01L21/31138 ,  H01J37/3244 ,  Y10T428/1352 ,  Y10T428/1372 ,  Y10T428/1376

    摘要： A method and system of for introducing an active material to a chemical process in which a processing element including a passive component and an active element is installed within the system and exposed to a chemical process performed within the system. As the chemical process proceeds, the passive component erodes and thereby exposes the active component embedded therein. The introduction of the active component to the chemical process alters the chemical process.

    摘要翻译： 一种用于将活性材料引入到化学过程中的方法和系统，其中包括无源部件和有源元件的处理元件安装在系统内并暴露于在系统内执行的化学过程。 随着化学过程的进行，被动元件侵蚀并从而暴露嵌入其中的有源元件。 化学工艺中的活性成分的引入改变了化学过程。

    Isostress grid array and method of fabrication thereof
    8.
    发明授权
    Isostress grid array and method of fabrication thereof 有权
    异构网格阵列及其制造方法

    公开(公告)号：US08519527B2

    公开(公告)日：2013-08-27

    申请号：US12923581

    申请日：2010-09-29

    申请人： John A. Hughes ,  Christy A. Hagerty ,  Santos Nazario-Camacho ,  Keith K. Sturcken

    发明人： John A. Hughes ,  Christy A. Hagerty ,  Santos Nazario-Camacho ,  Keith K. Sturcken

    IPC分类号： H01L21/44

    CPC分类号： H01L21/50 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/562 ,  H01L2224/13 ,  H01L2924/14

    摘要： An electronic device package includes a substrate and wire columns arranged in groups about a neutral stress point of the substrate. The height of the wire columns is substantially uniform for the plural groups of wire columns, and a length of at least one of the wire columns is greater than the uniform height. A method of fabricating an electronic device package having a column grid array includes applying two templates on wire columns of the column grid array and bending at least one wire column to increase its length while maintaining a uniform height for the column grid array. In another aspect, an electronic device package substrate includes wire columns having at least one non-uniformity in lengths of the columns, and the length of a wire column corresponds to a distance of that wire column from the neutral stress point of the substrate. The non-uniformity of length in the wire columns reduces stress in the package leads after attachment of the package to a carrier substrate, such as a printed circuit board.

    摘要翻译： 一种电子器件封装，包括基板和布置成围绕基板的中性应力点组成的线柱。 线列的高度对于多组线柱而言基本上是均匀的，并且线柱中的至少一个的长度大于均匀的高度。 一种制造具有列栅格阵列的电子器件封装的方法，包括在列格栅阵列的线柱上施加两个模板，并弯曲至少一个线柱以增加其长度，同时保持柱格阵列的均匀高度。 在另一方面，一种电子器件封装衬底包括具有柱长度至少一个不均匀性的线柱，并且线柱的长度对应于该线柱与衬底的中性应力点的距离。 电线柱中的长度不均匀性降低了将封装件附接到诸如印刷电路板的载体衬底之后的封装引线中的应力。

    Transparent planar storm shield
    10.
    发明授权
    Transparent planar storm shield 失效
    透明平面防风罩

    公开(公告)号：US06314689B1

    公开(公告)日：2001-11-13

    申请号：US09617768

    申请日：2000-07-17

    申请人： John A. Hughes

    发明人： John A. Hughes

    IPC分类号： E06B330

    CPC分类号： E06B5/10

    摘要： A transparent planar storm shield has framed panels (1, 2, 12) with predetermined transparency and predetermined resistance to storm pressure and to storm-debris impact. Panels (3, 9, 10) of the framed panels are preferably shatter-proof plastic material that includes predetermined polycarbonate. Frames (4, 5, 6, 7, 13) of the framed panels have strengths in proportion to thicknesses for predetermined storm protection by predetermined areas of the storm shield. The storm shield is a cover of a predetermined portion of a building orifice which can include a door or a window. The predetermined resistance to storm pressure and to storm-debris impact of the panels is about an equivalent to a commercial grade of polycarbonate or an equivalent thereof that is twenty-five inches square with a thickness of one-eighth of an inch and being rectangular with less than twenty-five percent deviation from being square. Strengths of the frames are predetermined by capacity to contain the panels in positions of resistance to the predetermined resistance to the storm pressure and the storm-debris impact.

    摘要翻译： 透明的平面防风罩具有预定透明度和预定的抵抗风暴压力和暴风雨碎片冲击的框架板（1,2,12）。 框板的面板（3,9,10）优选是包含预定聚碳酸酯的防碎塑料。 框架板的框架（4,5,6,7,13）具有与防风罩的预定区域预定的风暴保护厚度成比例的强度。 防风罩是建筑物孔口的预定部分的盖，其可以包括门或窗。 预定的耐风暴压力和面板风暴碎片冲击大约等于商业级别的聚碳酸酯或其等同物，其厚度为八分之一英寸的二十五英寸平方英寸，并且是与 少于百分之二十五的偏离平方。 框架的强度通过将面板容纳在抵抗暴风雨压力和风暴碎片冲击的预定阻力的位置中的能力来预先确定。