公开(公告)号：US5571593A

公开(公告)日：1996-11-05

申请号：US467558

申请日：1995-06-06

申请人： Roy L. Arldt ,  Christina M. Boyko ,  Burtran J. Cayson ,  Richard M. Kozlowski ,  Joseph D. Kulesza ,  John M. Lauffer ,  Philip C. Liu ,  Voya R. Markovich ,  Issa S. Mahmoud ,  James F. Muska ,  Kostas Papathomas ,  Joseph G. Sabia ,  Richard A. Schumacher

发明人： Roy L. Arldt ,  Christina M. Boyko ,  Burtran J. Cayson ,  Richard M. Kozlowski ,  Joseph D. Kulesza ,  John M. Lauffer ,  Philip C. Liu ,  Voya R. Markovich ,  Issa S. Mahmoud ,  James F. Muska ,  Kostas Papathomas ,  Joseph G. Sabia ,  Richard A. Schumacher

IPC分类号： B32B7/04 ,  C08G59/40 ,  C08G73/00 ,  C08L63/00 ,  C09D163/00 ,  H01B1/20 ,  H01B1/22 ,  H01B1/24 ,  H05K1/09 ,  H05K1/11 ,  H05K1/16 ,  H05K3/00 ,  H05K3/40 ,  B32B9/00

CPC分类号： H01B1/24 ,  B32B7/04 ,  H01B1/22 ,  H05K1/095 ,  H05K1/113 ,  H05K1/167 ,  H05K3/4053 ,  H05K3/4069 ,  H01L2224/16235 ,  H05K1/16 ,  H05K2201/0347 ,  H05K2201/09563 ,  H05K2201/10734 ,  H05K2203/0126 ,  H05K2203/0191 ,  H05K2203/0207 ,  H05K2203/0278 ,  H05K2203/0338 ,  H05K2203/0763 ,  H05K3/0023 ,  H05K3/0047 ,  H05K3/0094 ,  Y10S428/901 ,  Y10T29/49099 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24273 ,  Y10T428/24331 ,  Y10T428/24339 ,  Y10T428/24826 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/25

摘要： The present invention permits solder joints to be made directly to via and through holes without the solder being wicked into the vias or through holes, by filling plated through holes with an epoxy or cyanate fill composition. When cured and overplated, the fill composition provides support for the solder joint and provides a flat solderable surface for the inter-connection. In certain embodiments, the cured fill compositions, offer a further advantage of being conductive. The invention also relates to several novel methods for filling through holes with such fill compositions, and to resistors located in through holes and vias.

摘要翻译： 本发明允许焊接接头直接制成通孔和通孔，而不会通过用环氧树脂或氰酸盐填充组合物填充电镀通孔，焊料不会被弄脏到通孔或通孔中。 当固化和过度镀覆时，填充组合物为焊接接头提供支撑，并为相互连接提供平坦的可焊接表面。 在某些实施方案中，固化的填充组合物提供另外的导电性的优点。 本发明还涉及用这种填充组合物填充通孔的几种新方法，以及位于通孔和通孔中的电阻器。

公开(公告)号：US5450290A

公开(公告)日：1995-09-12

申请号：US195532

申请日：1994-02-14

申请人： Christina M. Boyko ,  Francis J. Bucek ,  Richard W. Carpenter ,  Voya R. Markovich ,  Darleen Mayo ,  Cindy M. Reidsema ,  Joseph G. Sabia

发明人： Christina M. Boyko ,  Francis J. Bucek ,  Richard W. Carpenter ,  Voya R. Markovich ,  Darleen Mayo ,  Cindy M. Reidsema ,  Joseph G. Sabia

IPC分类号： H01B1/22 ,  H01B1/24 ,  H01L23/50 ,  H01L23/538 ,  H05K1/09 ,  H05K1/11 ,  H05K1/16 ,  H05K3/00 ,  H05K3/40 ,  H05K3/46 ,  H05K1/14 ,  B05D5/12 ,  H05K3/36

CPC分类号： H05K3/4069 ,  H01B1/22 ,  H01B1/24 ,  H01L23/50 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5385 ,  H05K1/095 ,  H05K1/113 ,  H05K1/167 ,  H05K3/4053 ,  H05K3/4602 ,  H01L2224/16 ,  H01L2924/15173 ,  H05K1/16 ,  H05K2201/0347 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2203/0126 ,  H05K2203/0191 ,  H05K2203/0207 ,  H05K2203/0278 ,  H05K2203/0338 ,  H05K2203/0763 ,  H05K2203/1394 ,  H05K2203/1581 ,  H05K3/0023 ,  H05K3/0044 ,  H05K3/0047 ,  H05K3/0094 ,  H05K3/4644 ,  H05K3/4652 ,  Y10T29/49126

摘要： The present invention provides an improved circuit board for mounting integrated circuit chips and a technique for manufacturing the circuit board. The board permits direct chip attachment to the circuit board by providing the necessary geometry for the footprint pattern of the chip connections without the necessity of multi-level packaging using chip carriers. The circuit board includes a substrate with plated through holes, and a film of photoresist dielectric material disposed on the substrate. The dielectric material is photo patterned to form vias which are then filled with conductive material. Electrical connection pads are formed on the exposed surface of the film of dielectric material in the pattern of the chip footprint to be mounted thereon. The vias and plated through holes are arranged in groups and patterns which provide some direct connection between the pads and plated through holes, some pads wired to vias on the exposed surface of the film of dielectric material and some vias wired to plated through holes on the surface of the substrate.

摘要翻译： 本发明提供了一种用于安装集成电路芯片的改进的电路板和用于制造电路板的技术。 该板允许通过为芯片连接的覆盖图形提供必要的几何形状，而不需要使用芯片载体的多级封装，直接芯片连接到电路板。 电路板包括具有电镀通孔的基板和设置在基板上的光致抗蚀剂介电材料的膜。 电介质材料被照片化以形成通孔，然后填充导电材料。 电连接焊盘以要安装在其上的芯片覆盖区的图案形成在介电材料膜的暴露表面上。 通孔和电镀通孔以组和图案布置，其在焊盘和电镀通孔之间提供一些直接连接，一些焊盘连接到电介质材料膜的暴露表面上的通孔，以及一些通孔连接到电镀通孔上 基板的表面。