公开(公告)号：US20100246148A1

公开(公告)日：2010-09-30

申请号：US12744540

申请日：2007-12-20

申请人： Hiroki Ikeda ,  Katsu Yanagimoto

发明人： Hiroki Ikeda ,  Katsu Yanagimoto

IPC分类号： H05K7/00 ,  B23K31/02 ,  B32B15/04 ,  B32B15/01

CPC分类号： H05K3/3463 ,  B23K35/02 ,  B23K35/262 ,  C21D9/50 ,  C22C12/00 ,  C22C13/00 ,  C22C28/00 ,  C22C30/00 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01063 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/14 ,  H05K3/3436 ,  H05K2203/1121 ,  H05K2203/1476 ,  Y02P10/212 ,  Y10T428/31678 ,  H01L2924/014 ,  H01L2224/81805 ,  H01L2224/0401

摘要： Disclosed herein is an electronic apparatus produced using a high-temperature lead-free solder alloy which makes it possible to form soldered joints having no variations in strength and which has an excellent balance between strength and solderability. The lead-free solder alloy is an alloy which is made of an element A and an element B and which has a composition composed of AmBn being a stable phase and the element B in an equilibrium state at room temperature. When the lead-free solder alloy is solidified by quenching, the element A is dissolved in a room-temperature stable phase of the element B so that a supersaturated solid solution is formed, and when melted for soldering and then solidified, the alloy returns to its equilibrium state and has a composition composed of the stable phase AmBn and the element B and therefore maintains strength due to the presence of the stable phase AmBn even when reheated to a soldering temperature.

摘要翻译： 本文公开了使用高温无铅焊料合金制造的电子设备，其使得可以形成没有强度变化的焊接接头，并且在强度和可焊性之间具有优异的平衡。 无铅焊料合金是由元素A和元素B制成的合金，其组成由AmBn构成稳定相，元素B在室温下处于平衡状态。 当无铅焊料合金通过淬火固化时，元件A溶解在元件B的室温稳定相中，从而形成过饱和固溶体，当熔化熔化然后固化时，合金回到 其平衡状态并且具有由稳定相AmBn和元素B组成的组成，因此即使在再加热到焊接温度时也由于存在稳定相AmBn而保持强度。

公开(公告)号：US08281978B2

公开(公告)日：2012-10-09

申请号：US12744540

申请日：2007-12-20

申请人： Hiroki Ikeda ,  Katsu Yanagimoto

发明人： Hiroki Ikeda ,  Katsu Yanagimoto

IPC分类号： B23K31/02

CPC分类号： H05K3/3463 ,  B23K35/02 ,  B23K35/262 ,  C21D9/50 ,  C22C12/00 ,  C22C13/00 ,  C22C28/00 ,  C22C30/00 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01063 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/14 ,  H05K3/3436 ,  H05K2203/1121 ,  H05K2203/1476 ,  Y02P10/212 ,  Y10T428/31678 ,  H01L2924/014 ,  H01L2224/81805 ,  H01L2224/0401

摘要： Disclosed herein is an electronic apparatus produced using a high-temperature lead-free solder alloy which makes it possible to form soldered joints having no variations in strength and which has an excellent balance between strength and solderability. The lead-free solder alloy is an alloy which is made of an element A and an element B and which has a composition composed of AmBn being a stable phase and the element B in an equilibrium state at room temperature. When the lead-free solder alloy is solidified by quenching, the element A is dissolved in a room-temperature stable phase of the element B so that a supersaturated solid solution is formed, and when melted for soldering and then solidified, the alloy returns to its equilibrium state and has a composition composed of the stable phase AmBn and the element B and therefore maintains strength due to the presence of the stable phase AmBn even when reheated to a soldering temperature.

摘要翻译： 本文公开了使用高温无铅焊料合金制造的电子设备，其使得可以形成没有强度变化的焊接接头，并且在强度和可焊性之间具有优异的平衡。 无铅焊料合金是由元素A和元素B制成的合金，其组成由AmBn构成稳定相，元素B在室温下处于平衡状态。 当无铅焊料合金通过淬火固化时，元件A溶解在元件B的室温稳定相中，从而形成过饱和固溶体，当熔化熔化然后固化时，合金回到 其平衡状态并且具有由稳定相AmBn和元素B组成的组成，因此即使在再加热到焊接温度时也由于存在稳定相AmBn而保持强度。

公开(公告)号：US20100089498A1

公开(公告)日：2010-04-15

申请号：US12517433

申请日：2007-12-20

申请人： Hiroki Ikeda ,  Katsu Yanagimoto ,  Noriaki Matsubara

发明人： Hiroki Ikeda ,  Katsu Yanagimoto ,  Noriaki Matsubara

IPC分类号： B23K35/24

CPC分类号： C22C28/00 ,  B23K35/26 ,  B23K35/262 ,  B23K35/264 ,  C22C13/00

摘要： The present invention provides a high-temperature lead-free solder alloy which has no variation in strength of the soldered portion and has an excellent balance between strength and soldering properties, and a method for producing the alloy. The present invention relates to a lead-free jointing material made of an alloy of two elements A and B selected from elements other than Pb, wherein the element A has a melting point higher than a melting point of the element B, wherein the alloy is an alloy which has a room-temperature stable phase composed of the element B and a room-temperature stable phase AmBn composed of the elements A and B (provided that m and n are specific numerals in accordance with an alloy constituting a stable phase at room temperature) and satisfies AxB1-x (provided that 0

摘要翻译： 本发明提供一种高温无铅焊料合金，其焊接部分的强度没有变化，并且在强度和焊接性能之间具有优异的平衡，以及该合金的制造方法。 本发明涉及由选自Pb以外的元素的两种元素A和B的合金制成的无铅接合材料，其中元素A的熔点高于元素B的熔点，其中合金为 具有由元件B构成的室温稳定相的合金和由元素A和B构成的室温稳定相AmBn（假设m和n是根据构成室内稳定相的合金的特定数字 温度），并且满足AxB1-x（条件是0

公开(公告)号：US09157135B2

公开(公告)日：2015-10-13

申请号：US12517433

申请日：2007-12-20

申请人： Hiroki Ikeda ,  Katsu Yanagimoto ,  Noriaki Matsubara

发明人： Hiroki Ikeda ,  Katsu Yanagimoto ,  Noriaki Matsubara

IPC分类号： B23K35/24 ,  C22C28/00 ,  B23K35/26 ,  C22C13/00

CPC分类号： C22C28/00 ,  B23K35/26 ,  B23K35/262 ,  B23K35/264 ,  C22C13/00

摘要： The present invention provides a high-temperature lead-free solder alloy which has no variation in strength of the soldered portion and has an excellent balance between strength and soldering properties, and a method for producing the alloy. The present invention relates to a lead-free jointing material made of an alloy of two elements A and B selected from elements other than Pb, wherein the element A has a melting point higher than a melting point of the element B, wherein the alloy is an alloy which has a room-temperature stable phase composed of the element B and a room-temperature stable phase AmBn composed of the elements A and B (provided that m and n are specific numerals in accordance with an alloy constituting a stable phase at room temperature) and satisfies AxB1-x (provided that 0

摘要翻译： 本发明提供一种高温无铅焊料合金，其焊接部分的强度没有变化，并且在强度和焊接性能之间具有优异的平衡，以及该合金的制造方法。 本发明涉及由选自Pb以外的元素的两种元素A和B的合金制成的无铅接合材料，其中元素A的熔点高于元素B的熔点，其中合金为 具有由元件B构成的室温稳定相的合金和由元素A和B构成的室温稳定相AmBn（假设m和n是根据构成室内稳定相的合金的特定数字 温度），并且满足AxB1-x（条件是0

公开(公告)号：US20100075133A1

公开(公告)日：2010-03-25

申请号：US12594046

申请日：2008-04-04

申请人： Hiroki Ikeda ,  Katsu Yanagimoto

发明人： Hiroki Ikeda ,  Katsu Yanagimoto

IPC分类号： B32B3/26 ,  C23C4/06 ,  B05D1/12 ,  C09D1/00 ,  B22F9/02

CPC分类号： C23C4/04 ,  C22C29/08 ,  C23C2/003 ,  C23C4/06 ,  Y10T428/12049 ,  Y10T428/249994

摘要： There are provided a surface coating material for a molten zinc bath member with improved zinc corrosion resistance, a production method thereof, and a molten zinc bath member. The surface coating material comprises WC powder particles and a binder metal. The binder metal comprises Co and a metal element electrochemically nobler than Co and constitutes an alloy structure having a single phase.

摘要翻译： 提供了具有改善的耐锌腐蚀性的熔融锌浴部件的表面涂层材料，其制造方法和熔融锌浴部件。 表面涂层材料包括WC粉末颗粒和粘合剂金属。 粘合剂金属包括Co和金属元素比Co电化学上更高，并且构成具有单相的合金结构。

公开(公告)号：US08927111B2

公开(公告)日：2015-01-06

申请号：US12594046

申请日：2008-04-04

申请人： Hiroki Ikeda ,  Katsu Yanagimoto

发明人： Hiroki Ikeda ,  Katsu Yanagimoto

IPC分类号： B22F7/00 ,  B32B9/00 ,  C23C4/06 ,  C22C1/05 ,  C22C19/07 ,  C23C4/04 ,  C22C29/08 ,  C23C2/00

CPC分类号： C23C4/04 ,  C22C29/08 ,  C23C2/003 ,  C23C4/06 ,  Y10T428/12049 ,  Y10T428/249994

摘要： There are provided a surface coating material for a molten zinc bath member with improved zinc corrosion resistance, a production method thereof, and a molten zinc bath member. The surface coating material comprises WC powder particles and a binder metal. The binder metal comprises Co and a metal element electrochemically nobler than Co and constitutes an alloy structure having a single phase.

摘要翻译： 提供了具有改善的耐锌腐蚀性的熔融锌浴部件的表面涂层材料，其制造方法和熔融锌浴部件。 表面涂层材料包括WC粉末颗粒和粘合剂金属。 粘合剂金属包括Co和金属元素比Co电化学上更高，并且构成具有单相的合金结构。

公开(公告)号：US20110100690A1

公开(公告)日：2011-05-05

申请号：US12915786

申请日：2010-10-29

申请人： Hideaki Yoshimura ,  Kenji Fukuzono ,  Takashi Kanda ,  Tomohisa Yagi ,  Hiroki Ikeda ,  Katsu Yanagimoto

发明人： Hideaki Yoshimura ,  Kenji Fukuzono ,  Takashi Kanda ,  Tomohisa Yagi ,  Hiroki Ikeda ,  Katsu Yanagimoto

IPC分类号： H05K1/02 ,  B32B15/08 ,  B23K35/12 ,  H01B1/02 ,  B23K31/02

CPC分类号： H05K3/4614 ,  H01B1/02 ,  H01B1/026 ,  H01L2224/16225 ,  H01L2924/01322 ,  H01L2924/01327 ,  H05K1/186 ,  H05K3/1216 ,  H05K3/3463 ,  H05K3/3484 ,  H05K3/4069 ,  H05K3/4647 ,  H05K2201/0272 ,  H05K2201/09036 ,  H05K2201/10992 ,  Y10T428/31678 ,  H01L2924/00

摘要： An electrically conductive body includes: a first electrically conductive material; a second electrically conductive material; and a bonding material bonding the first electrically conductive material to the second electrically conductive material at least for electric conduction. The bonding material is made of a metallic structure containing copper-tin based intermetallic compound phases and tin-bismuth phases, the copper-tin based intermetallic compound phases being continuous between the first electrically conductive material and the second electrically conductive material, the tin-bismuth phases being surrounded by the copper-tin based intermetallic compound phases.

摘要翻译： 导电体包括：第一导电材料; 第二导电材料; 以及至少用于导电的将第一导电材料接合到第二导电材料的接合材料。 接合材料由含有铜 - 锡基金属间化合物相和锡 - 铋相的金属结构制成，铜 - 锡基金属间化合物相在第一导电材料和第二导电材料之间连续，锡 - 铋 相被铜 - 锡基金属间化合物相包围。