公开(公告)号：US20160205782A1

公开(公告)日：2016-07-14

申请号：US14701264

申请日：2015-04-30

Applicant: NAN YA PCB Corporation

Inventor： Chang-Li HO ,  Ching-Ho SU ,  Willis GAO ,  Chi-Ming LU ,  Cheng-Hung HUANG

IPC: H05K1/18 ,  G01R31/28 ,  H05K3/34 ,  H05K3/36 ,  H05K1/02 ,  H05K1/11

CPC classification number: G01R31/2818 ,  G01R31/2812 ,  H05K1/0268 ,  H05K3/0097 ,  H05K2201/0909 ,  H05K2201/09481

Abstract: A printed circuit board is provided, including a products area, an outline area, a plurality of cutting channels, and at least one measurement unit. The products area includes a plurality of circuit board units arranged in a matrix, and each of the circuit board units has a plurality of first internal wiring layers. The outline area surrounds the products area. The cutting channels are located between the outline area and the circuit board units, and between the circuit board units. The measurement unit is disposed in one of the cutting channels and has a plurality of second internal wiring layers and a plurality of contact pads. The second internal wiring layers and the first internal wiring layers are formed by the same fabrication processes. The contact pads are electrically connected to the second internal wiring layers and exposed to a surface of the printed circuit board.

Abstract translation: 提供一种印刷电路板，包括产品区域，轮廓区域，多个切割通道和至少一个测量单元。 产品区域包括以矩阵形式布置的多个电路板单元，并且每个电路板单元具有多个第一内部布线层。 轮廓区域围绕产品区域。 切割通道位于轮廓区域和电路板单元之间，以及电路板单元之间。 测量单元设置在一个切割通道中，并且具有多个第二内部布线层和多​​个接触垫。 第二内部布线层和第一内部布线层通过相同的制造工艺形成。 接触焊盘电连接到第二内部布线层并暴露于印刷电路板的表面。

公开(公告)号：US09894779B2

公开(公告)日：2018-02-13

申请号：US14790669

申请日：2015-07-02

Applicant: NAN YA PCB Corporation

Inventor： Wei-Ta Fu ,  Kuo-Chang Wu ,  Yu-Chih Lin

IPC: H05K1/18 ,  H05K3/42 ,  H05K3/46 ,  H01L23/00

CPC classification number: H05K3/4602 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/12105 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/83192 ,  H01L2224/92244 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15311 ,  H05K1/115 ,  H05K1/185 ,  H05K1/188 ,  H05K3/30 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K2201/09563 ,  H05K2201/10181 ,  H05K2201/10636 ,  H05K2203/072 ,  H05K2203/1469 ,  Y02P70/611

Abstract: An embedded component substrate and methods for fabricating the same are provided. The embedded component substrate includes a substrate having at least one cavity, a first surface, and a second surface. The embedded component substrate also includes at least one electronic component formed in the at least one cavity. The embedded component substrate also includes a first wiring layer formed in the space between a sidewall of the at least one electronic component and a sidewall of the at least one cavity. The first wiring layer extends from the first surface of the substrate to the sidewall of the at least one cavity, and directly contacts the at least one electronic component.

公开(公告)号：US09497865B2

公开(公告)日：2016-11-15

申请号：US14043609

申请日：2013-10-01

Applicant: NAN YA PCB Corporation

Inventor： Hung-Wei Chang ,  Tai-Yi Chou

IPC: H05K3/46 ,  H05K3/34 ,  H05K3/00

CPC classification number: H05K3/4661 ,  H05K3/0052 ,  H05K3/3452 ,  H05K2201/0909 ,  Y10T29/49155

Abstract: A method for forming a printed circuit board includes providing a substrate including a first device region, a second device region and a dicing channel region between the first device region and the second device region. A first circuit is formed on the substrate. An insulating layer is formed on the first circuit and the substrate. At least one build-up circuit is formed on the insulating layer. A photoresist layer is formed on the at least one build-up circuit. An image transferring process is performed to pattern the photoresist layer to form a dam structure in the dicing channel region. A solder mask layer is formed on the at least one build-up circuit. The dam structure is removed to form a trench in the solder mask layer.

Abstract translation: 一种用于形成印刷电路板的方法，包括在第一器件区域和第二器件区域之间提供包括第一器件区域，第二器件区域和切割沟道区域的衬底。 在基板上形成第一电路。 在第一电路和基板上形成绝缘层。 在绝缘层上形成至少一个积聚电路。 在至少一个积聚电路上形成光致抗蚀剂层。 执行图像转印处理以对切割通道区域中的光致抗蚀剂层进行图案化以形成坝结构。 在至少一个积聚电路上形成焊接掩模层。 去除坝结构以在焊接掩模层中形成沟槽。

公开(公告)号：US20160007469A1

公开(公告)日：2016-01-07

申请号：US14790669

申请日：2015-07-02

Applicant: NAN YA PCB Corporation

Inventor： Wei-Ta FU ,  Kuo-Chang WU ,  Yu-Chih LIN

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/42 ,  H05K3/30

CPC classification number: H05K3/4602 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/12105 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/83192 ,  H01L2224/92244 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15311 ,  H05K1/115 ,  H05K1/185 ,  H05K1/188 ,  H05K3/30 ,  H05K3/421 ,  H05K3/423 ,  H05K3/427 ,  H05K2201/09563 ,  H05K2201/10181 ,  H05K2201/10636 ,  H05K2203/072 ,  H05K2203/1469 ,  Y02P70/611

Abstract: An embedded component substrate and methods for fabricating the same are provided. The embedded component substrate includes a substrate having at least one cavity, a first surface, and a second surface. The embedded component substrate also includes at least one electronic component formed in the at least one cavity. The embedded component substrate also includes a first wiring layer formed in the space between the at least one electronic component and the at least one cavity. The first wiring layer extends from the first surface of the substrate to a sidewall of the at least one cavity, and directly contacts the at least one electronic component.

Abstract translation: 提供嵌入式部件基板及其制造方法。 嵌入式部件基板包括具有至少一个空腔，第一表面和第二表面的基板。 嵌入式组件基板还包括形成在至少一个空腔中的至少一个电子部件。 嵌入式部件基板还包括形成在至少一个电子部件与至少一个空腔之间的空间中的第一布线层。 第一布线层从基板的第一表面延伸到至少一个空腔的侧壁，并直接接触至少一个电子部件。

公开(公告)号：US20140216787A1

公开(公告)日：2014-08-07

申请号：US14043609

申请日：2013-10-01

Applicant: NAN YA PCB Corporation

Inventor： Hung-Wei Chang ,  Tai-Yi Chou

IPC: H05K3/28 ,  H05K1/02

CPC classification number: H05K3/4661 ,  H05K3/0052 ,  H05K3/3452 ,  H05K2201/0909 ,  Y10T29/49155

Abstract: A method for forming a printed circuit board is disclosed. A substrate including a first device region, a second device region and a dicing channel region between the first device region and the second device region is provided. A first circuit is formed on the substrate. An insulating layer is formed on the first circuit and the substrate. At least one build-up circuit is formed on the insulating layer. A photoresist layer is formed on the at least one build-up circuit. An image transferring process is performed to pattern the photoresist layer to form a dam structure in the dicing channel region. A solder mask layer is formed on the at least one build-up circuit. The dam structure is removed to form a trench in the solder mask layer.

Abstract translation: 公开了一种形成印刷电路板的方法。 提供了包括在第一器件区域和第二器件区域之间的第一器件区域，第二器件区域和切割沟道区域的衬底。 在基板上形成第一电路。 在第一电路和基板上形成绝缘层。 在绝缘层上形成至少一个积聚电路。 在至少一个积聚电路上形成光致抗蚀剂层。 执行图像转印处理以对切割通道区域中的光致抗蚀剂层进行图案化以形成坝结构。 在至少一个积聚电路上形成焊接掩模层。 去除坝结构以在焊接掩模层中形成沟槽。