公开(公告)号：US20250091095A1

公开(公告)日：2025-03-20

申请号：US18891253

申请日：2024-09-20

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Koichi HIGUCHI ,  Konosuke HAYASHI

IPC: B08B1/12 ,  B08B3/02

Abstract: According to one embodiment, a substrate cleaning apparatus includes: a cleaning liquid supply unit for supplying a cleaning liquid to a rotating substrate, a first cleaning head for cleaning at least one surface of the rotating substrate by bringing a brush into contact with the one surface of the substrate, a second cleaning head for cleaning the one surface of the substrate by bringing a brush into contact with the one surface of the substrate, a turning arm for turning the first cleaning head and the second cleaning head, and a controller. The controller controls the turning arm such that, during cleaning in which a brush of one of the first cleaning head and the second cleaning head is brought into contact with a surface of the substrate to perform cleaning, the brush of the other is positioned at a position outside the substrate.

公开(公告)号：US20240347364A1

公开(公告)日：2024-10-17

申请号：US18754615

申请日：2024-06-26

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Rie ARAI ,  Yukinobu NISHIBE ,  Shun KATO ,  Shinji FUTATSUKAWA

IPC: H01L21/677 ,  H01L21/67

CPC classification number: H01L21/67742 ,  H01L21/67023 ,  H01L21/67253 ,  H01L21/67772

Abstract: A substrate delivery apparatus and a substrate delivery method that can maintain a wet surface of a substrate and transport the substrate between processing devices are provided. A substrate delivery apparatus 2 of the present embodiment includes: a cart housing 210 having a housing room 211 that receives from outside and houses the substrate transportation cart 1 in which a tank 110 containing a plurality of substrates W and water is loaded; and a take-out device 250 that takes the substrate W out from the tank 110 loaded in the substrate transportation cart 1 housed in the housing room 211 and delivers the substrate W to the washing apparatus 3 that is the adjacent processing device.

公开(公告)号：US20240302099A1

公开(公告)日：2024-09-12

申请号：US18583578

申请日：2024-02-21

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Junji ISHIHARA ,  Hisaaki MIYASAKO ,  Yukinobu NISHIBE

IPC: F26B25/00 ,  B08B9/20 ,  F26B3/02

CPC classification number: F26B25/003 ,  B08B9/20 ,  F26B3/02 ,  B08B2209/08

Abstract: According to one embodiment of the present disclosure, a wafer storage container drying apparatus includes a drying tank for drying a wafer storage container that has a storage space connected to an opening and configured to store a wafer, and includes a body including a flange gripped by a robot, and a door installed to be openable and closable with respect to the opening, wherein the drying tank includes a carrying-in/out port configured to be openable and closable by an opening and closing cover, a body receiver configured to receive the body of the wafer storage container in a state where the flange faces the carrying-in/out port; and a door holder configured to hold the door such that each side of the door is neither orthogonal nor parallel to one side that forms the carrying-in/out port, when the drying tank is viewed in a plan view.

公开(公告)号：US11996310B2

公开(公告)日：2024-05-28

申请号：US17476368

申请日：2021-09-15

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Masaaki Furuya

IPC: H01L21/67 ,  B65G47/90 ,  H01L21/677

CPC classification number: H01L21/67706 ,  B65G47/90 ,  H01L21/67167 ,  H01L21/67173 ,  H01L21/67712

Abstract: A substrate carrying apparatus that can reduce attachment of dust to substrates can be provided. The substrate carrying apparatus 1 of the present embodiment includes a carrying arm 2 for carrying a substrate, a column 32 standing up from a base body 31 with fixed angle, an upper link 33 which supports the carrying arm 2 at one end, which is rotatably connected to the column 32, and which moves the carrying arm 2 up and down in accordance with a rotation, a lower link 34 which is connected to be rotatable around an axis in parallel with a rotation axis of the upper link 33 as a center below a portion of the column 32 connected to the upper link 33, a connection link 35 which is rotatably connected to the upper link 33 and the lower link 34 so that the upper link 33 rotates in accordance with a rotation of the lower link 34, and a driving unit 4 which rotates the lower link 34.

公开(公告)号：US20240091828A1

公开(公告)日：2024-03-21

申请号：US18369002

申请日：2023-09-15

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Junji ISHIHARA ,  Katsuhiro YAMAZAKI ,  Hisaaki MIYASAKO ,  Yukinobu NISHIBE

IPC: B08B9/08 ,  B08B9/20 ,  B08B9/46

CPC classification number: B08B9/0813 ,  B08B9/20 ,  B08B9/46 ,  B08B2209/08

Abstract: According to an embodiment of the present disclosure, the cleaning apparatus includes a cleaning tank body having a body opening and a cleaning space; a lid provided to be openable and closable with respect to the body opening; a mounting stage provided in the cleaning space placing a shell of a wafer storage container; a first ejector that ejects a cleaning liquid into a storage space of the shell; a second ejector that ejects the cleaning liquid into an outer portion of the shell; a first discharge port that discharges the cleaning liquid ejected into the storage space of the shell; a second discharge port that discharges the cleaning liquid that has passed through the outer portion of the shell; and a particle counter that measures particles in the cleaning liquid discharged by the first discharge port.

公开(公告)号：US20230271231A1

公开(公告)日：2023-08-31

申请号：US18114377

申请日：2023-02-27

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Kensuke DEMURA ,  Satoshi NAKAMURA ,  Masaya KAMIYA ,  Minami NAKAMURA

IPC: B08B7/00

CPC classification number: B08B7/0092 ,  B08B7/0014

Abstract: According to one embodiment, a substrate processing apparatus includes: a stage rotatable around a central axis; a plurality of holders provided on the stage to hold a substrate; a cooler capable of supplying a cooling gas to a space between the stage and the substrate; and a liquid supply capable of supplying a liquid to a surface of the substrate on an opposite side to the stage. When holding the substrate, each of the plurality of holders moves toward the central axis along a surface of the stage so as to surround a peripheral edge of the substrate and the space between the stage and the substrate.

公开(公告)号：US11710707B2

公开(公告)日：2023-07-25

申请号：US17205098

申请日：2021-03-18

Applicant: Shibaura Mechatronics Corporation

Inventor： Hisashi Nishigaki ,  Atsushi Fujita ,  Shohei Tanabe ,  Yoshinao Kamo ,  Shigeki Matsunaka

IPC: H05K9/00 ,  H01L23/552 ,  H01F10/26 ,  H01F10/30 ,  H01L23/00

CPC classification number: H01L23/552 ,  H01F10/265 ,  H01F10/30 ,  H01L24/32 ,  H05K9/0088 ,  H01L2224/32225 ,  H01L2924/3025

Abstract: According to one embodiment, an electromagnetic wave attenuator includes a first structure body. The first structure body includes a first member, a second member, and a third member. The first member includes a first magnetic layer and a first nonmagnetic layer alternately provided in a first direction. The first nonmagnetic layer is conductive. The first direction is a stacking direction. The second member includes a second magnetic layer and a second nonmagnetic layer alternately provided in the first direction. The second nonmagnetic layer is conductive. The third member includes a third nonmagnetic layer. The third nonmagnetic layer is conductive. A direction from the third member toward the first member is along the first direction. A direction from the third member toward the second member is along the first direction. A first magnetic layer thickness is greater than a second magnetic layer thickness.

公开(公告)号：US11355337B2

公开(公告)日：2022-06-07

申请号：US16916288

申请日：2020-06-30

Applicant: Shibaura Mechatronics Corporation

Inventor： Masaya Kamiya ,  Kensuke Demura ,  Daisuke Matsushima ,  Haruka Nakano ,  Ivan Petrov Ganachev

IPC: H01L21/02 ,  G03F7/40 ,  G03F7/42 ,  B08B3/10 ,  B08B7/00 ,  H01L21/67 ,  H01L21/687 ,  H01L21/66

Abstract: A substrate treatment device according to an embodiment includes a placement portion on which a substrate is placed and rotated, a liquid supply portion which supplies a liquid to a surface on an opposite side to the placement portion of the substrate, a cooling portion which supplies a cooling gas to a surface on a side of the placement portion of the substrate, and a control portion which controls at least one of a rotation speed of the substrate, a supply amount of the liquid, and a flow rate of the cooling gas. The control portion brings the liquid present on a surface of the substrate into a supercooled state and causes at least a part of the liquid brought into the supercooled state to freeze.

公开(公告)号：US20210323036A1

公开(公告)日：2021-10-21

申请号：US17230152

申请日：2021-04-14

Applicant: Shibaura Mechatronics Corporation

Inventor： Daisuke MATSUSHIMA ,  Kensuke DEMURA ,  Satoshi NAKAMURA ,  Masaya KAMIYA ,  Minami NAKAMURA

IPC: B08B7/00 ,  B08B3/10 ,  B08B3/08 ,  B08B3/04 ,  F25C1/12

Abstract: According to one embodiment, a substrate treatment device includes a placement stand configured to rotate the substrate, a cooling part configured to supply a cooling gas into a space between the placement stand and the substrate, a first liquid supplier configured to supply a first liquid on a surface of the substrate, a second liquid supplier configured to supply a second liquid on the surface, and a controller controlling rotation of the substrate, supply of the cooling gas, the first and second liquids. The controller performs a preliminary process of supplying the second liquid on the surface, and supplying the cooling gas into the space, a liquid film forming process by supplying the first liquid toward the surface after the preliminary process, a supercooling process of the liquid film on the surface, and a freezing process of at least a part of the liquid film on the surface.

公开(公告)号：US20210265159A1

公开(公告)日：2021-08-26

申请号：US17181264

申请日：2021-02-22

Applicant: Shibaura Mechatronics Corporation

Inventor： Kensuke DEMURA ,  Daisuke MATSUSHIMA ,  Masaya KAMIYA

IPC: H01L21/02 ,  B08B7/00

Abstract: According to one embodiment, a substrate treatment device includes a placement stand configured to rotate a substrate, a cooling part configured to supply a cooling gas into a space between the placement stand and the substrate, a liquid supplier configured to supply a liquid on a surface of the substrate opposite to the placement stand, and a controller controlling a rotation speed of the substrate, a flow rate of the cooling gas, or a supply amount of the liquid. The controller sets the liquid on the surface of the substrate to be in a supercooled state, forms a frozen film by freezing the liquid in the super cooled state, and causes crack to generate in the frozen film by decreasing a temperature of the frozen film.