公开(公告)号：US20100227479A1

公开(公告)日：2010-09-09

申请号：US12660793

申请日：2010-03-04

申请人： Sunjung Kim ,  JongCheol Lee ,  Bonyoung Koo ,  Wansik Hwang ,  Joon Gon Lee ,  JungHyeon Kim

发明人： Sunjung Kim ,  JongCheol Lee ,  Bonyoung Koo ,  Wansik Hwang ,  Joon Gon Lee ,  JungHyeon Kim

IPC分类号： H01L21/3105

CPC分类号： H01L21/3143 ,  H01L21/02175 ,  H01L21/022 ,  H01L29/40114 ,  H01L29/40117 ,  H01L29/42332 ,  H01L29/513 ,  H01L29/788 ,  H01L29/792

摘要： Provided are a semiconductor device and a method of fabricating the same. The method includes forming a metal nitride layer and a metal oxide layer on a semiconductor substrate to be in contact with each other, and annealing the substrate including the metal nitride layer and the metal oxide layer to form a metal oxynitride layer.

摘要翻译： 提供半导体器件及其制造方法。 该方法包括在半导体衬底上形成金属氮化物层和金属氧化物层以彼此接触，并且使包括金属氮化物层和金属氧化物层的衬底退火以形成金属氧氮化物层。

公开(公告)号：US20110233648A1

公开(公告)日：2011-09-29

申请号：US13072078

申请日：2011-03-25

申请人： Kwang Soo Seol ,  Chanjin Park ,  Kihyun Hwang ,  Hanmei Choi ,  Dongchul Yoo ,  Sunghoi Hur ,  Wansik Hwang ,  Toshiro Nakanishi ,  Kwangmin Park ,  Juyul Lee

发明人： Kwang Soo Seol ,  Chanjin Park ,  Kihyun Hwang ,  Hanmei Choi ,  Dongchul Yoo ,  Sunghoi Hur ,  Wansik Hwang ,  Toshiro Nakanishi ,  Kwangmin Park ,  Juyul Lee

IPC分类号： H01L29/792 ,  H01L21/28

CPC分类号： H01L29/42348 ,  H01L21/32137 ,  H01L27/0688 ,  H01L27/11551 ,  H01L27/11556 ,  H01L27/11578 ,  H01L27/11582 ,  H01L29/511 ,  H01L29/517 ,  H01L29/792 ,  H01L2924/0002 ,  H01L2924/00

摘要： Three-dimensional semiconductor memory devices and methods of fabricating the same. The three-dimensional semiconductor devices include an electrode structure with sequentially-stacked electrodes disposed on a substrate, semiconductor patterns penetrating the electrode structure, and memory elements including a first pattern and a second pattern interposed between the semiconductor patterns and the electrode structure, the first pattern vertically extending to cross the electrodes and the second pattern horizontally extending to cross the semiconductor patterns.

摘要翻译： 三维半导体存储器件及其制造方法。 三维半导体器件包括具有布置在衬底上的顺序层叠电极的电极结构，穿透电极结构的半导体图案，以及插入在半导体图案和电极结构之间的包括第一图案和第二图案的存储元件，第一 垂直延伸以横过电极的图案和第二图案水平延伸以跨越半导体图案。

公开(公告)号：US20130334593A1

公开(公告)日：2013-12-19

申请号：US13972533

申请日：2013-08-21

申请人： Kwang-Soo SEOL ,  Chanjin PARK ,  Ki-Hyun HWANG ,  Hanmei CHOI ,  Sunghoi HUR ,  Wansik HWANG ,  Toshiro NAKANISHI ,  Kwangmin PARK ,  Ju-Yul LEE

发明人： Kwang-Soo SEOL ,  Chanjin PARK ,  Ki-Hyun HWANG ,  Hanmei CHOI ,  Sunghoi HUR ,  Wansik HWANG ,  Toshiro NAKANISHI ,  Kwangmin PARK ,  Ju-Yul LEE

IPC分类号： H01L29/792

CPC分类号： H01L29/42348 ,  H01L21/32137 ,  H01L27/0688 ,  H01L27/11551 ,  H01L27/11556 ,  H01L27/11578 ,  H01L27/11582 ,  H01L29/511 ,  H01L29/517 ,  H01L29/792 ,  H01L2924/0002 ,  H01L2924/00

摘要： Three-dimensional semiconductor memory devices and methods of fabricating the same. The three-dimensional semiconductor devices include an electrode structure with sequentially-stacked electrodes disposed on a substrate, semiconductor patterns penetrating the electrode structure, and memory elements including a first pattern and a second pattern interposed between the semiconductor patterns and the electrode structure, the first pattern vertically extending to cross the electrodes and the second pattern horizontally extending to cross the semiconductor patterns.

公开(公告)号：US20170345907A1

公开(公告)日：2017-11-30

申请号：US15681050

申请日：2017-08-18

申请人： Kwang Soo Seol ,  Chanjin Park ,  Kihyun Hwang ,  Hanmei Choi ,  Sunghoi Hur ,  Wansik Hwang ,  Toshiro Nakanishi ,  Kwangmin Park ,  Juyul Lee

发明人： Kwang Soo Seol ,  Chanjin Park ,  Kihyun Hwang ,  Hanmei Choi ,  Sunghoi Hur ,  Wansik Hwang ,  Toshiro Nakanishi ,  Kwangmin Park ,  Juyul Lee

IPC分类号： H01L29/423 ,  H01L29/792 ,  H01L29/51 ,  H01L27/06 ,  H01L27/11578 ,  H01L27/11556 ,  H01L27/11551 ,  H01L27/11582 ,  H01L21/3213

CPC分类号： H01L29/42348 ,  H01L21/32137 ,  H01L27/0688 ,  H01L27/11551 ,  H01L27/11556 ,  H01L27/11578 ,  H01L27/11582 ,  H01L29/511 ,  H01L29/517 ,  H01L29/792 ,  H01L2924/0002 ,  H01L2924/00

摘要： Three-dimensional semiconductor memory devices and methods of fabricating the same. The three-dimensional semiconductor devices include an electrode structure with sequentially-stacked electrodes disposed on a substrate, semiconductor patterns penetrating the electrode structure, and memory elements including a first pattern and a second pattern interposed between the semiconductor patterns and the electrode structure, the first pattern vertically extending to cross the electrodes and the second pattern horizontally extending to cross the semiconductor patterns.

公开(公告)号：US09536970B2

公开(公告)日：2017-01-03

申请号：US13072078

申请日：2011-03-25

申请人： Kwang Soo Seol ,  Chanjin Park ,  Kihyun Hwang ,  Hanmei Choi ,  Dongchul Yoo ,  Sunghoi Hur ,  Wansik Hwang ,  Toshiro Nakanishi ,  Kwangmin Park ,  Juyul Lee

发明人： Kwang Soo Seol ,  Chanjin Park ,  Kihyun Hwang ,  Hanmei Choi ,  Dongchul Yoo ,  Sunghoi Hur ,  Wansik Hwang ,  Toshiro Nakanishi ,  Kwangmin Park ,  Juyul Lee

IPC分类号： H01L29/792 ,  H01L29/423 ,  H01L21/3213 ,  H01L27/06 ,  H01L27/115 ,  H01L29/51

CPC分类号： H01L29/42348 ,  H01L21/32137 ,  H01L27/0688 ,  H01L27/11551 ,  H01L27/11556 ,  H01L27/11578 ,  H01L27/11582 ,  H01L29/511 ,  H01L29/517 ,  H01L29/792 ,  H01L2924/0002 ,  H01L2924/00

摘要： Three-dimensional semiconductor memory devices and methods of fabricating the same. The three-dimensional semiconductor devices include an electrode structure with sequentially-stacked electrodes disposed on a substrate, semiconductor patterns penetrating the electrode structure, and memory elements including a first pattern and a second pattern interposed between the semiconductor patterns and the electrode structure, the first pattern vertically extending to cross the electrodes and the second pattern horizontally extending to cross the semiconductor patterns.

公开(公告)号：US20150311301A1

公开(公告)日：2015-10-29

申请号：US14796569

申请日：2015-07-10

申请人： Kwang Soo Seol ,  Chanjin Park ,  Kihyun Hwang ,  Hanmei Choi ,  Sunghoi Hur ,  Wansik Hwang ,  Toshiro Nakanishi ,  Kwangmin Park ,  Juyul Lee

发明人： Kwang Soo Seol ,  Chanjin Park ,  Kihyun Hwang ,  Hanmei Choi ,  Sunghoi Hur ,  Wansik Hwang ,  Toshiro Nakanishi ,  Kwangmin Park ,  Juyul Lee

IPC分类号： H01L29/423 ,  H01L27/115 ,  H01L29/51 ,  H01L29/792

CPC分类号： H01L29/42348 ,  H01L21/32137 ,  H01L27/0688 ,  H01L27/11551 ,  H01L27/11556 ,  H01L27/11578 ,  H01L27/11582 ,  H01L29/511 ,  H01L29/517 ,  H01L29/792 ,  H01L2924/0002 ,  H01L2924/00

摘要： Three-dimensional semiconductor memory devices and methods of fabricating the same. The three-dimensional semiconductor devices include an electrode structure with sequentially-stacked electrodes disposed on a substrate, semiconductor patterns penetrating the electrode structure, and memory elements including a first pattern and a second pattern interposed between the semiconductor patterns and the electrode structure, the first pattern vertically extending to cross the electrodes and the second pattern horizontally extending to cross the semiconductor patterns.

摘要翻译： 三维半导体存储器件及其制造方法。 三维半导体器件包括具有布置在衬底上的顺序层叠电极的电极结构，穿透电极结构的半导体图案，以及插入在半导体图案和电极结构之间的包括第一图案和第二图案的存储元件，第一 垂直延伸以横过电极的图案和第二图案水平延伸以跨越半导体图案。