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    Deposit morphology of electroplated copper
    5.
    发明授权
    Deposit morphology of electroplated copper 有权
    电镀铜的沉积形态

    公开(公告)号：US07879218B1

    公开(公告)日：2011-02-01

    申请号：US10741048

    申请日：2003-12-18

    Applicant: Eric Webb ,  Jon Reid ,  Yuichi Takada ,  Timothy Archer

    Inventor： Eric Webb ,  Jon Reid ,  Yuichi Takada ,  Timothy Archer

    IPC: C25D5/34

    CPC classification number: C25D7/123 ,  C25D5/34 ,  H01L21/2885 ,  H01L21/76877

    Abstract: The present invention provides improved methods and devices for electroplating copper on a wafer. Some implementations of the present invention involve the pre-treatment of the wafer with a solution containing accelerator molecules. Preferably, the bath into which the wafer is subsequently placed for electroplating has a reduced concentration of accelerator molecules. The pre-treatment causes a reduction in roughness of the electroplated copper surface, particularly during the initial phases of copper growth.

    Abstract translation: 本发明提供了用于在晶片上电镀铜的改进方法和装置。 本发明的一些实施方案涉及用含有促进剂分子的溶液预处理晶片。 优选地，晶片随后放置用于电镀的浴具有降低的促进剂分子浓度。 预处理导致电镀铜表面的粗糙度降低，特别是在铜生长的初始阶段。

    Electroplating bath containing wetting agent for defect reduction
    6.
    发明授权
    Electroplating bath containing wetting agent for defect reduction 失效
    含有润湿剂的电镀浴，用于减少缺陷

    公开(公告)号：US07232513B1

    公开(公告)日：2007-06-19

    申请号：US10879613

    申请日：2004-06-29

    Applicant: Eric G. Webb ,  Jonathan D. Reid ,  John H. Sukamto ,  Yuichi Takada

    Inventor： Eric G. Webb ,  Jonathan D. Reid ,  John H. Sukamto ,  Yuichi Takada

    IPC: C25D3/38 ,  C25D5/02

    CPC classification number: C25D3/38 ,  C25D5/04 ,  C25D5/18

    Abstract: An electroplating solution contains a wetting agent in addition to a suppressor and an accelerator. In some embodiments, the solution has a cloud point temperature greater than 35° C. to avoid precipitation of wetting agent or other solute out of the plating solution. In some embodiments, the wetting agent decreases the air-liquid surface tension of the electroplating solution to 60 dyne/cm2 or less to increase the wetting ability of the solution with a substrate surface. In some embodiments of a method for plating metal onto substrate surface, the electroplating solution has a measured contact angle with the substrate surface less than 60 degrees.

    Abstract translation: 除了抑制剂和促进剂之外，电镀溶液还含有润湿剂。 在一些实施方案中，溶液的浊点温度大于35℃，以避免润湿剂或其它溶质从电镀溶液中沉淀出来。 在一些实施方案中，润湿剂将电镀溶液的空气 - 液体表面张力降低至60达因/厘米2或更小，以增加溶液与基底表面的润湿能力。 在用于将金属电镀到衬底表面上的方法的一些实施例中，电镀溶液具有与衬底表面的测量的接触角小于60度。

    Disk playback apparatus
    7.
    发明授权
    Disk playback apparatus 失效
    磁盘播放装置

    公开(公告)号：US5373495A

    公开(公告)日：1994-12-13

    申请号：US168413

    申请日：1993-12-17

    Applicant: Yuichi Takada

    Inventor： Yuichi Takada

    IPC: G11B19/27 ,  G11B19/20 ,  G11B19/247 ,  G11B5/09 ,  G11B15/52

    CPC classification number: G11B19/2009 ,  G11B19/247

    Abstract: A disk playback apparatus designed such that the linear velocity of the disk is stabilized during a short period corresponding to one to several revolutions of the disk and occurrence therein of vibration and noise is suppressed is disclosed. The apparatus is characterized in that the revolving axis of the turntable on which the disk is mounted is driven by a low-torque spindle motor and the wheel effect of the revolving axis or the spindle motor is made larger.

    Abstract translation: 公开了一种盘播放装置，其被设计成使得盘的线速度在对应于盘的一至几圈的短时间段内稳定，并且抑制其中的振动和噪声的发生。 该装置的特征在于，通过低扭矩主轴电动机驱动安装有盘的转台的旋转轴，并且使旋转轴或主轴电动机的车轮效果变大。

    Liquid detersive bleaching composition
    8.
    发明授权
    Liquid detersive bleaching composition 失效
    液体洗涤漂白组合物

    公开(公告)号：US4029591A

    公开(公告)日：1977-06-14

    申请号：US615393

    申请日：1975-09-22

    Applicant: Kazuo Ohbu ,  Yuichi Takada ,  Shigemi Nakamura

    Inventor： Kazuo Ohbu ,  Yuichi Takada ,  Shigemi Nakamura

    IPC: C11D1/29 ,  C11D3/395 ,  C11D7/54

    CPC classification number: C11D1/29 ,  C11D3/3956

    Abstract: A liquid detersive bleaching composition which comprises 3 to 10 wt.% of sodium hypochlorite (in terms of the amount of available chlorine), 0.5 to 3 wt.% of caustic alkali, 0.3 to 7 wt.% of polyoxyethylene alkylphenyl ether sulfate (a) having the formula (I) and 0.1 to 5 wt.% of polyoxyethylene alkylphenyl ether sulfate sulfonate (b) having the formula (II), wherein the molar ratio of (a) to (b) is in the range of from 20/80 to 85/15 and the total amount of (a) and (b) is in the range of from more than 0.5 wt.% to less than 10 wt.%.Formula (I): ##STR1## (wherein R represents straight-chain or branched-chain alkyl group having 5 to 15 carbon atoms, m is an integer ranging from 3 to 15, and M represents Na or K.)formula (II): ##STR2## (wherein R' represents straight-chain or branched-chain alkyl group having 5 to 15 carbon atoms, n is an integer ranging from 3 to 15, and M represents Na or K.)

    Abstract translation: 一种液体洗涤漂白组合物，其包含3至10重量％的次氯酸钠（以可用氯的量计），0.5-3重量％的苛性碱，0.3至7重量％的聚氧乙烯烷基苯基醚硫酸盐（a ）和0.1〜5重量％的具有式（II）的聚氧乙烯烷基苯基醚硫酸酯磺酸酯（b），其中（a）与（b）的摩尔比在20 / 80〜85/15，（a）和（b）的总量在大于0.5重量％至小于10重量％的范围内。

    Deposit morphology of electroplated copper
    9.
    发明授权
    Deposit morphology of electroplated copper 有权
    电镀铜的沉积形态

    公开(公告)号：US08197662B1

    公开(公告)日：2012-06-12

    申请号：US12971367

    申请日：2010-12-17

    Applicant: Eric Webb ,  Jonathan D. Reid ,  Yuichi Takada ,  Timothy Archer

    Inventor： Eric Webb ,  Jonathan D. Reid ,  Yuichi Takada ,  Timothy Archer

    IPC: C25D5/34

    CPC classification number: C25D7/123 ,  C25D5/34 ,  H01L21/2885 ,  H01L21/76877

    Abstract: The present invention provides improved methods and devices for electroplating copper on a wafer. Some implementations of the present invention involve the pre-treatment of the wafer with a solution containing accelerator molecules. Preferably, the bath into which the wafer is subsequently placed for electroplating has a reduced concentration of accelerator molecules. The pre-treatment causes a reduction in roughness of the electroplated copper surface, particularly during the initial phases of copper growth.

    Abstract translation: 本发明提供了用于在晶片上电镀铜的改进方法和装置。 本发明的一些实施方案涉及用含有促进剂分子的溶液预处理晶片。 优选地，晶片随后放置用于电镀的浴具有降低的促进剂分子浓度。 预处理导致电镀铜表面的粗糙度降低，特别是在铜生长的初始阶段。

    Test support program and test support method
    10.
    发明授权
    Test support program and test support method 失效
    测试支持程序和测试支持方法

    公开(公告)号：US06963815B2

    公开(公告)日：2005-11-08

    申请号：US10828057

    申请日：2004-04-20

    Applicant: Yuzuru Watanabe ,  Yuichi Takada ,  Yasuyuki Fujikawa ,  Kenichi Yamashita

    Inventor： Yuzuru Watanabe ,  Yuichi Takada ,  Yasuyuki Fujikawa ,  Kenichi Yamashita

    IPC: G06F11/28 ,  G06F11/22 ,  G06F13/00 ,  G06F19/00

    CPC classification number: G06F11/3688 ,  G06F11/3476

    Abstract: A test support program to effectively and reliably check performance of functions which operate with other unspecified servers. A pair of a request message and a response message is stored as a message log. When a processing function based on a program under development being checked outputs a test request message, a computer selects a message log appropriate to the test request message as a template message under preset selection rules. The computer creates a test response message by editing the response message of the selected template message under preset editing rules. Then the computer sends the created test response message as a response to the test request message.

    Abstract translation: 一个测试支持程序，用于有效和可靠地检查与其他未指定服务器一起运行的功能的性能。 作为消息日志存储一对请求消息和响应消息。 当正在检查的正在开发的程序的处理功能输出测试请求消息时，计算机在预设选择规则下选择适合于测试请求消息的消息日志作为模板消息。 计算机通过在预设编辑规则下编辑所选模板消息的响应消息来创建测试响应消息。 然后，计算机发送创建的测试响应消息作为对测试请求消息的响应。

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