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公开(公告)号：US20210289680A1
公开(公告)日：2021-09-16
申请号：US17153706
申请日：2021-01-20
Applicant: ALPHA ASSEMBLY SOLUTIONS INC.
Inventor： Monnir Boureghda , Nitin Desai , Anna Lifton , Oscar Khaselev , Michael T. Marczi , Bawa Singh
Abstract: Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate. Devices produced using the methods are also described.
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公开(公告)号：US10905041B2
公开(公告)日：2021-01-26
申请号：US14027530
申请日：2013-09-16
Applicant: ALPHA ASSEMBLY SOLUTIONS INC.
Inventor： Monnir Boureghda , Nitin Desai , Anna Lifton , Oscar Khaselev , Michael T. Marczi , Bawa Singh
Abstract: Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate. Devices produced using the methods are also described.
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公开(公告)号：US11699632B2
公开(公告)日：2023-07-11
申请号：US17153706
申请日：2021-01-20
Applicant: ALPHA ASSEMBLY SOLUTIONS INC.
Inventor： Monnir Boureghda , Nitin Desai , Anna Lifton , Oscar Khaselev , Michael T. Marczi , Bawa Singh
IPC: H05K13/04 , H01L23/373 , H01L23/00
CPC classification number: H01L23/373 , H01L24/29 , H01L24/32 , H01L24/83 , H05K13/0465 , H01L2224/2936 , H01L2224/29101 , H01L2224/29111 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29364 , H01L2224/29369 , H01L2224/32225 , H01L2224/8384 , H01L2224/83192 , H01L2224/83801 , H01L2924/0102 , H01L2924/0103 , H01L2924/014 , H01L2924/0104 , H01L2924/0105 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/0132 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/203 , Y10T29/4913 , Y10T29/49133 , Y10T29/49155 , Y10T428/24893 , H01L2224/29101 , H01L2924/014 , H01L2924/00 , H01L2924/0132 , H01L2924/0105 , H01L2924/01079 , H01L2924/3512 , H01L2924/00 , H01L2924/00014 , H01L2224/29111 , H01L2924/01079 , H01L2924/00014 , H01L2924/10253 , H01L2924/00 , H01L2224/83192 , H01L2224/32225 , H01L2924/00 , H01L2924/1461 , H01L2924/00 , H01L2924/203 , H01L2924/0002
Abstract: Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate. Devices produced using the methods are also described.
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公开(公告)号：US10462908B2
公开(公告)日：2019-10-29
申请号：US15439555
申请日：2017-02-22
Applicant: Alpha Assembly Solutions Inc.
Inventor： Oscar Khaselev , Nitin Desai , Michael T. Marczi , Bawa Singh
IPC: H05K1/02 , H05K1/09 , H05K3/00 , H05K3/10 , H05K3/12 , H05K3/18 , H05K3/20 , H05K3/22 , H05K3/28 , H05K3/46 , H01L21/02 , H01L21/44 , H01L21/48 , H01L23/48 , B05D3/02 , H05K3/24
Abstract: Conductive patterns and methods of using and printing such conductive patterns are disclosed. In certain examples, the conductive patterns may be produced by disposing a conductive material between supports on a substrate. The supports may be removed to provide conductive patterns having a desired length and/or geometry.
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Patent Agency Ranking
公开(公告)号：US20170164484A1
公开(公告)日：2017-06-08
申请号：US15439555
申请日：2017-02-22
Applicant: Alpha Assembly Solutions Inc.
Inventor： Oscar Khaselev , Nitin Desai , Michael T. Marczi , Bawa Singh
CPC classification number: H05K3/125 , H05K1/09 , H05K3/0011 , H05K3/1258 , H05K3/22 , H05K3/245 , H05K2201/0203 , H05K2201/0224 , H05K2201/09909 , H05K2203/013 , H05K2203/0568 , H05K2203/0769 , H05K2203/1131 , H05K2203/1476 , Y10T29/49155
Abstract: Conductive patterns and methods of using and printing such conductive patterns are disclosed. In certain examples, the conductive patterns may be produced by disposing a conductive material between supports on a substrate. The supports may be removed to provide conductive patterns having a desired length and/or geometry.
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公开(公告)号：US11162007B2
公开(公告)日：2021-11-02
申请号：US16289789
申请日：2019-03-01
Applicant: Alpha Assembly Solutions Inc.
Inventor： Shamik Ghosal , Ranjit Pandher , Oscar Khaselev , Ravi Bhatkal , Rahul Raut , Bawa Singh , Morgana de Avila Ribas , Siuli Sarkar , Sutapa Mukherjee , Sathish Kumar , Remya Chandran , Pavan Vishwanath , Ashok Pachamuthu , Monnir Boureghda , Nitin Desai , Anna Lifton , Nirmalya Kumar Chaki
Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.
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公开(公告)号：US10259980B2
公开(公告)日：2019-04-16
申请号：US14438888
申请日：2013-10-29
Applicant: Alpha Assembly Solutions Inc.
Inventor： Shamik Ghosal , Ranjit Pandher , Oscar Khaselev , Ravi Bhatkal , Rahul Raut , Bawa Singh , Morgana Ribas , Siuli Sarkar , Sutapa Mukherjee , Sathish Kumar , Remya Chandran , Pavan Vishwanath , Ashok Pachamuthu , Monnir Boureghda , Nitin Desai , Anna Lifton , Nirmalya Kumar Chaki
Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.
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公开(公告)号：US20220169905A1
公开(公告)日：2022-06-02
申请号：US17493247
申请日：2021-10-04
Applicant: Alpha Assembly Solutions Inc.
Inventor： Shamik Ghosal , Ranjit Pandher , Oscar Khaselev , Ravi Bhatkal , Rahul Raut , Bawa Singh , Morgana de Avila Ribas , Siuli Sarkar , Sutapa Mukherjee , Sathish Kumar , Remya Chandran , Pavan Vishwanath , Ashok Pachamuthu , Monnir Boureghda , Nitin Desai , Anna Lifton , Nirmalya Kumar Chaki
IPC: C09K5/14 , C01G5/00 , C09C1/62 , C09C3/08 , B82Y30/00 , B22F1/05 , B22F1/16 , B22F1/052 , B22F1/102
Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.
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公开(公告)号：US20190194517A1
公开(公告)日：2019-06-27
申请号：US16289789
申请日：2019-03-01
Applicant: Alpha Assembly Solutions Inc.
Inventor： Shamik Ghosal , Ranjit Pandher , Oscar Khaselev , Ravi Bhatkal , Rahul Raut , Bawa Singh , Morgana de Avila Ribas , Siuli Sarkar , Sutapa Mukherjee , Sathish Kumar , Remya Chandran , Pavan Vishwanath , Ashok Pachamuthu , Monnir Boureghda , Nitin Desai , Anna Lifton , Nirmalya Kumar Chaki
CPC classification number: C09K5/14 , B22F1/0011 , B22F1/0014 , B22F1/0018 , B22F1/0062 , B22F1/0074 , B22F1/02 , B22F2001/0066 , B82Y30/00 , C01G5/00 , C01P2002/72 , C01P2002/88 , C01P2004/04 , C01P2004/53 , C01P2004/61 , C01P2004/64 , C01P2006/22 , C01P2006/32 , C01P2006/40 , C09C1/62 , C09C3/08 , H01L2924/0002 , H01L2924/00
Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.
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