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公开(公告)号：US20220375735A1
公开(公告)日：2022-11-24
申请号：US17714502
申请日：2022-04-06
Applicant: Applied Materials, Inc.
Inventor： Soundarrajan JEMBULINGAM , Jian Janson CHEN , Jeonghoon OH
Abstract: Methods and apparatus for processing a substrate using improved shield configurations are provided herein. For example, a process kit for use in a physical vapor deposition chamber comprises a shield comprising an inner wall comprising an upper portion having a first wavy fin configuration and a bottom portion having a second wavy fin configuration different from the first wavy fin configuration such that a surface area of the shield is about 1400 in2 to about 1410 in2.
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公开(公告)号：US20220297258A1
公开(公告)日：2022-09-22
申请号：US17204832
申请日：2021-03-17
Applicant: Applied Materials, Inc.
Inventor： Jeonghoon OH , Steven M. ZUNIGA
IPC: B24B37/30 , B24B37/04 , B24B37/10 , H01L21/321 , H01L21/768
Abstract: A substrate polishing apparatus includes a processing station including a plurality of polishing platens having a polishing pad thereon, and a substrate support configured to hold a substrate therein, wherein the substrate support is positionable to simultaneously position a substrate supported therein against polishing pads on at least two of the plurality of polishing platens. The processing station can form a standalone polishing system, or be one of at least two processing statins in a polishing tool, where at least one other polishing station includes a polishing platen to support a polishing pad thereon.
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公开(公告)号：US20190099857A1
公开(公告)日：2019-04-04
申请号：US16149939
申请日：2018-10-02
Applicant: Applied Materials, Inc.
Inventor： Jeonghoon OH , Charles C. GARRETSON , Eric LAU , Andrew NAGENGAST , Steven M. ZUNIGA , Edwin C. SUAREZ , Huanbo ZHANG , Brian J. BROWN
IPC: B24B37/32 , H01L21/687
Abstract: Embodiments herein relate to a retaining ring for use in a polishing process. The retaining ring includes an annular body having an upper surface and a lower surface. An inner surface is connected to the upper surface and the lower surface. The inner surface includes one or more surfaces that are used to retain a substrate during processing. The one or more surfaces have an angle relative to a central axis of the retaining ring. The inner surface also includes a plurality of facets. Channels are disposed within the retaining ring to allow passage of a polishing fluid from an inner surface to an outer surface of the retaining ring disposed opposite of the inner surface.
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公开(公告)号：US20150099437A1
公开(公告)日：2015-04-09
申请号：US14505231
申请日：2014-10-02
Applicant: Applied Materials, Inc.
Inventor： Daniel L. MARTIN , Jeonghoon OH , Simon YAVELBERG
IPC: B24B37/32 , C23C16/02 , C23C16/455
CPC classification number: B24B37/32 , B05D1/08 , B05D1/60 , B05D7/52 , C09D127/18 , C09D165/04
Abstract: A retaining ring for a polishing system is disclosed. The retaining ring has a process-resistant coating over a portion thereof. The process-resistant coating is a thin, smooth, conformal layer that is resistant to wear and chemical attack. The process-resistant coating is formed by a method that includes vapor deposition from a precursor gas mixture, which may deposit polyparaxyxylene from a gas mixture comprising paracyclophane. Adhesion of the process-resistant coating to the retaining ring may be enhanced by treating the surface of the ring prior to forming the coating. Resistance of the coating to the process may be further enhanced by treating the surface of the coating with an etching or deposition gas to impart texture.
Abstract translation: 公开了一种用于抛光系统的保持环。 保持环在其一部分上具有耐加工涂层。 耐加工涂层是一种薄而光滑的共形层，耐磨损和化学侵蚀。 耐加工涂层通过包括从前体气体混合物的气相沉积的方法形成，前体气体混合物可以从包含对环磷烷的气体混合物中沉积聚对二甲苯。 可以通过在形成涂层之前处理环的表面来增强耐保护涂层对保持环的粘合性。 通过用蚀刻或沉积气体处理涂层的表面以赋予纹理，可以进一步提高涂层对该方法的耐受性。
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公开(公告)号：US20220339755A1
公开(公告)日：2022-10-27
申请号：US17851497
申请日：2022-06-28
Applicant: Applied Materials, Inc.
Inventor： Jeonghoon OH , Charles C. GARRETSON , Eric LAU , Andrew NAGENGAST , Steven M. ZUNIGA , Edwin C. SUAREZ , Huanbo ZHANG , Brian J. BROWN
IPC: B24B37/32 , H01L21/687
Abstract: Embodiments herein relate to a retaining ring for use in a polishing process. The retaining ring includes an annular body having an upper surface and a lower surface. An inner surface is connected to the upper surface and the lower surface. The inner surface includes one or more surfaces that are used to retain a substrate during processing. The one or more surfaces have an angle relative to a central axis of the retaining ring. The inner surface also includes a plurality of facets. Channels are disposed within the retaining ring to allow passage of a polishing fluid from an inner surface to an outer surface of the retaining ring disposed opposite of the inner surface.
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Patent Agency Ranking
公开(公告)号：US20200294778A1
公开(公告)日：2020-09-17
申请号：US16890573
申请日：2020-06-02
Applicant: Applied Materials, Inc.
Inventor： Brian T. WEST , Michael S. COX , Jeonghoon OH
Abstract: Implementations of the present disclosure relate to a sputtering target for a sputtering chamber used to process a substrate. In one implementation, a sputtering target for a sputtering chamber is provided. The sputtering target comprises a sputtering plate with a backside surface having radially inner, middle and outer regions and an annular-shaped backing plate mounted to the sputtering plate. The backside surface has a plurality of circular grooves which are spaced apart from one another and at least one arcuate channel cutting through the circular grooves and extending from the radially inner region to the radially outer region of sputtering plate. The annular-shaped backing plate defines an open annulus exposing the backside surface of the sputtering plate.
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公开(公告)号：US20180342378A1
公开(公告)日：2018-11-29
申请号：US16048919
申请日：2018-07-30
Applicant: Applied Materials, Inc.
Inventor： Brian T. WEST , Michael S. COX , Jeonghoon OH
Abstract: Implementations of the present disclosure relate to a sputtering target for a sputtering chamber used to process a substrate. In one implementation, a sputtering target for a sputtering chamber is provided. The sputtering target comprises a sputtering plate with a backside surface having radially inner, middle and outer regions and an annular-shaped backing plate mounted to the sputtering plate. The backside surface has a plurality of circular grooves which are spaced apart from one another and at least one arcuate channel cutting through the circular grooves and extending from the radially inner region to the radially outer region of sputtering plate. The annular-shaped backing plate defines an open annulus exposing the backside surface of the sputtering plate.
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公开(公告)号：US20180250788A1
公开(公告)日：2018-09-06
申请号：US15891722
申请日：2018-02-08
Applicant: Applied Materials, Inc.
Inventor： Eric LAU , Chih Chung CHOU , Charles C. GARRETSON , Jeonghoon OH , King Yi HEUNG
IPC: B24B7/22 , B24B13/005 , B24B49/10 , B24B37/07
CPC classification number: B24B7/228 , B24B13/005 , B24B37/07 , B24B49/10 , H01L21/304 , H01L21/30625 , H01L21/31053 , H01L21/3212 , H01L22/20
Abstract: A method is provided to minimize travel distance and time between correction locations on a substrate when polishing a local area of a substrate, such as a semiconductor wafer, using a location specific polishing module. A correction profile is determined and a recipe based on the correction profile is used to polish a substrate. A polishing pad assembly traverses between a first correction location and a second correction location using the combined motion of a substrate support chuck and a support arm coupled at a first end thereof to the polishing pad assembly. The chuck rotates about a center axis thereof. The positioning arm may sweep about a vertical axis disposed through a second end of the support arm. The combined motion of the chuck and the positioning arm causes the polishing pad assembly to form a spiral shaped polishing path on the substrate.
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公开(公告)号：US20170274497A1
公开(公告)日：2017-09-28
申请号：US15456320
申请日：2017-03-10
Applicant: Applied Materials, Inc.
Inventor： Eric LAU , Hui CHEN , King Yi HEUNG , Wei-Cheng LEE , Chih Chung CHOU , Edwin C. SUAREZ , Garrett Ho Yee SIN , Charles C. GARRETSON , Jeonghoon OH
Abstract: A polishing module including a chuck having a substrate receiving surface and a perimeter, and one or more polishing pad assemblies positioned about the perimeter of the chuck, wherein each of the one or more polishing pad assemblies are coupled to an actuator that provides movement of the respective polishing pad assemblies in one or more of a sweep direction, a radial direction, and a oscillating mode relative to the substrate receiving surface and are limited in radial movement to about less than one-half of the radius of the chuck as measured from the perimeter of the chuck.
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10.发明申请公开(公告)号：US20160059377A1
公开(公告)日：2016-03-03
申请号：US14470852
申请日：2014-08-27
Applicant: Applied Materials, Inc.
Inventor： Jeonghoon OH , Steven M. ZUNIGA , Andrew NAGENGAST , Samuel Chu-Chiang HSU , Gautam Shashank DANDAVATE
CPC classification number: B24B37/107 , B24B37/11 , B24B37/30
Abstract: A polishing head for chemical mechanical planarization is provided. The polishing head includes a housing and a flexible membrane secured to the housing. At least a first, second, and third pressurizable chamber are disposed in the housing and each chamber contacts the flexible membrane. A first pressure delivery channel couples to the first chamber. A second pressure delivery channel couples to the third chamber. A first pressure feed line couples the first pressure delivery channel to the second chamber. A second pressure feed line couples the second pressure delivery channel to the second chamber. A first manually movable plug interfaces with the first pressure feed line to allow or block pressure from the first pressure delivery channel to the second chamber. A second manually movable plug interfaces with the second pressure feed line to allow or block pressure from the first pressure delivery channel to the second chamber.
Abstract translation: 提供了用于化学机械平面化的抛光头。 抛光头包括壳体和固定到壳体的柔性膜。 至少第一，第二和第三可加压室设置在壳体中，并且每个室接触柔性膜。 第一压力输送通道耦合到第一室。 第二压力输送通道联接到第三室。 第一压力供给管线将第一压力输送通道连接到第二室。 第二压力供给管线将第二压力输送通道连接到第二室。 第一可手动插头与第一压力进料管线接合以允许或阻止来自第一压力输送通道到第二室的压力。 第二可手动插头与第二压力进料管线接口，以允许或阻止来自第一压力输送通道到第二室的压力。
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