公开(公告)号：US20160107295A1

公开(公告)日：2016-04-21

申请号：US14885950

申请日：2015-10-16

Applicant: Applied Materials, Inc.

Inventor： Rajeev BAJAJ ,  Daniel REDFIELD ,  Mahendra C. ORILALL ,  Boyi FU ,  Aniruddh KHANNA ,  Jason G. FUNG ,  Mario CORNEJO ,  Ashwin CHOCKALINGAM ,  Mayu YAMAMURA ,  Veera Raghava Reddy KAKIREDDY ,  Ashavani KUMAR ,  Venkatachalam HARIHARAN ,  Gregory E. MENK ,  Fred C. REDEKER ,  Nag B. PATIBANDLA ,  Hou T. NG ,  Robert E. DAVENPORT ,  Amritanshu SINHA

IPC: B24D18/00 ,  B24D3/28

CPC classification number: B24D18/00 ,  B24D3/28 ,  B33Y10/00 ,  B33Y80/00

Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.

公开(公告)号：US20210107116A1

公开(公告)日：2021-04-15

申请号：US17114633

申请日：2020-12-08

Applicant: Applied Materials, Inc.

Inventor： Rajeev BAJAJ ,  Daniel REDFIELD ,  Mahendra C. ORILALL ,  Boyi FU ,  Aniruddh Jagdish KHANNA ,  Jason G. FUNG ,  Ashwin CHOCKALINGAM ,  Mayu YAMAMURA ,  Veera Raghava Reddy KAKIREDDY ,  Gregory E. MENK ,  Nag B. PATIBANDLA

IPC: B24D11/00 ,  B24B37/22 ,  B24B37/24 ,  B24B37/26 ,  B24D11/04 ,  B24D3/28

Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.

公开(公告)号：US20200147750A1

公开(公告)日：2020-05-14

申请号：US16746065

申请日：2020-01-17

Applicant: Applied Materials, Inc.

Inventor： Rajeev BAJAJ ,  Kasiraman KRISHNAN ,  Mahendra C. ORILALL ,  Daniel REDFIELD ,  Fred C. REDEKER ,  Nag B. PATIBANDLA ,  Gregory E. MENK ,  Jason G. FUNG ,  Russell Edward PERRY ,  Robert E. DAVENPORT

IPC: B24B37/26 ,  B24D18/00 ,  B24B37/22 ,  B24B37/20 ,  B33Y80/00 ,  B29C64/112 ,  B24B37/24

Abstract: Embodiments of the disclosure generally provide polishing pads having a composite pad body and methods for forming the polishing pads. In one embodiment, the composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.

公开(公告)号：US20180043613A1

公开(公告)日：2018-02-15

申请号：US15722810

申请日：2017-10-02

Applicant: Applied Materials, Inc.

Inventor： Kasiraman KRISHNAN ,  Daniel REDFIELD ,  Russell Edward PERRY ,  Gregory E. MENK ,  Rajeev BAJAJ ,  Fred C. REDEKER ,  Nag B. PATIBANDLA ,  Mahendra C. ORILALL ,  Jason G. FUNG

IPC: B24B37/26 ,  B24B37/22 ,  B29L31/00 ,  B29K105/16

Abstract: A polishing article manufacturing system includes a feed section and a take-up section, the take-up section comprising a supply roll having a polishing article disposed thereon for a chemical mechanical polishing process, a print section comprising a plurality of printheads disposed between the feed section and the take-up section, and a curing section disposed between the feed section and the take-up section, the curing section comprising one or both of a thermal curing device and an electromagnetic curing device.

公开(公告)号：US20170203408A1

公开(公告)日：2017-07-20

申请号：US15287665

申请日：2016-10-06

Applicant: Applied Materials, Inc.

Inventor： Sivapackia GANAPATHIAPPAN ,  Boyi FU ,  Ashwin CHOCKALINGAM ,  Daniel REDFIELD ,  Rajeev BAJAJ ,  Mahendra C. ORILALL ,  Hou T. NG ,  Jason G. FUNG ,  Mayu YAMAMURA

IPC: B24B37/24

CPC classification number: B24B37/24

Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. Embodiments of the disclosure further provide a polishing pad with polymeric layers that may be interpenetrating polymer networks.

公开(公告)号：US20160013480A1

公开(公告)日：2016-01-14

申请号：US14771126

申请日：2014-03-05

Applicant: Applied Materials, Inc.

Inventor： Godfrey SIKHA ,  Subramanya P. HERLE ,  Connie P. WANG ,  Zheng WANG ,  Dongli ZENG ,  Fei C. WANG ,  Mahendra C. ORILALL

IPC: H01M4/36 ,  H01M4/131 ,  H01M4/136 ,  H01M4/1391 ,  H01M4/58 ,  H01M4/485 ,  H01M4/505 ,  H01M4/525 ,  H01M4/04 ,  H01M4/62

CPC classification number: H01M4/366 ,  H01M4/0404 ,  H01M4/0409 ,  H01M4/043 ,  H01M4/0435 ,  H01M4/131 ,  H01M4/136 ,  H01M4/1391 ,  H01M4/1397 ,  H01M4/364 ,  H01M4/485 ,  H01M4/505 ,  H01M4/525 ,  H01M4/5825 ,  H01M4/622 ,  H01M4/623 ,  H01M4/661 ,  H01M2004/021 ,  H01M2004/028

Abstract: Implementations of the present invention relate generally to high-capacity energy storage devices and methods and apparatus for fabricating high-capacity energy storage devices. In one implementation, a method for forming a multi-layer cathode structure is provided. The method comprises providing a conductive substrate, depositing a first slurry mixture comprising a cathodically active material to form a first cathode material layer over the conductive substrate, depositing a second slurry mixture comprising a cathodically active material to form a second cathode material layer over the first cathode material layer, and compressing the as-deposited first cathode material layer and the second cathode material layer to achieve a desired porosity.

Abstract translation: 本发明的实施方式大体上涉及用于制造高容量能量存储装置的大容量能量存储装置和方法和装置。 在一个实施方案中，提供了一种形成多层阴极结构的方法。 该方法包括提供导电衬底，沉积包括阴极活性材料的第一浆料混合物以在导电衬底上形成第一阴极材料层;沉积包含阴极活性材料的第二浆料混合物，以在第一衬底上形成第二阴极材料层 阴极材料层，并且压制沉积的第一阴极材料层和第二阴极材料层以获得所需的孔隙率。

公开(公告)号：US20200055161A1

公开(公告)日：2020-02-20

申请号：US16661400

申请日：2019-10-23

Applicant: Applied Materials, Inc.

Inventor： Ashwin CHOCKALINGHAM ,  Mahendra C. ORILALL ,  Mayu YAMAMURA ,  Boyi FU ,  Rajeev BAJAJ ,  Daniel REDFIELD

IPC: B24B37/20 ,  B24B37/26 ,  B24B37/24 ,  H01L21/306

Abstract: Implementations described herein generally relate to polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes. More particularly, implementations disclosed herein relate to composite polishing articles having graded properties. In one implementation, a polishing article is provided. The polishing article comprises one or more exposed first regions formed from a first material and having a first zeta potential and one or more second exposed regions formed from a second material and having a second zeta potential, wherein the first zeta potential is different from the second zeta potential.

公开(公告)号：US20180009079A1

公开(公告)日：2018-01-11

申请号：US15546068

申请日：2016-01-29

Applicant: Applied Materials, Inc.

Inventor： Robert D. TOLLES ,  Mahendra C. ORILALL ,  Fred C. REDEKER ,  Rajeev BAJAJ

IPC: B24B37/22 ,  B24B37/24

Abstract: The present disclosure relates generally to a polishing article, and apparatus and methods of chemical mechanical polishing substrates using the polishing article. In some embodiments, the polishing article, such as a polishing pad, includes multiple layers in which one or more layers (i.e., at least the top layer) includes a plurality of nano-fibers that a positioned to contact a substrate during a polishing process. In one embodiment, a polishing article comprises a layer having a thickness less than about 0.032 inches, and the layer comprising fibers having a diameter of about 10 nanometers to about 200 micro meters.

公开(公告)号：US20170120416A1

公开(公告)日：2017-05-04

申请号：US15298766

申请日：2016-10-20

Applicant: Applied Materials, Inc.

Inventor： Ashwin CHOCKALINGAM ,  Mahendra C. ORILALL ,  Mayu YAMAMURA ,  Boyi FU ,  Rajeev BAJAJ ,  Daniel REDFIELD

IPC: B24B37/20 ,  H01L21/306

CPC classification number: B24B37/20 ,  H01L21/30625

Abstract: Implementations described herein generally relate to polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes. More particularly, implementations disclosed herein relate to composite polishing articles having graded properties. In one implementation, a polishing article is provided. The polishing article comprises one or more exposed first regions formed from a first material and having a first zeta potential and one or more second exposed regions formed from a second material and having a second zeta potential, wherein the first zeta potential is different from the second zeta potential.

公开(公告)号：US20160101500A1

公开(公告)日：2016-04-14

申请号：US14695778

申请日：2015-04-24

Applicant: Applied Materials, Inc.

Inventor： Jason Garcheung FUNG ,  Rajeev BAJAJ ,  Kasiraman KRISHNAN ,  Mahendra C. ORILALL ,  Fred C. REDEKER ,  Russell Edward PERRY ,  Gregory E. MENK ,  Daniel REDFIELD

IPC: B24B37/26 ,  B24B55/02 ,  B24B37/015

CPC classification number: B24B37/26 ,  B24B37/015 ,  B24B55/02

Abstract: A polishing pad for chemical mechanical polishing is provided. The polishing pad includes a base region having a supporting surface. The polishing pad further includes a plurality of polishing features forming a polishing surface, the polishing surface opposing the supporting surface. The polishing pad further includes one or more channels formed in an interior region of the polishing pad and extending at least partly around a center of the polishing pad, wherein each channel is fluidly coupled to at least one port.

Abstract translation: 提供了用于化学机械抛光的抛光垫。 抛光垫包括具有支撑表面的基底区域。 抛光垫还包括形成抛光表面的多个抛光特征，抛光表面与支撑表面相对。 抛光垫还包括形成在抛光垫的内部区域中并且至少部分地围绕抛光垫的中心延伸的一个或多个通道，其中每个通道流体地联接到至少一个端口。