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公开(公告)号:US20240401194A1
公开(公告)日:2024-12-05
申请号:US18676023
申请日:2024-05-28
Applicant: ASM IP Holding B.V.
Inventor: Shuaidi Zhang , Mustafa Muhammad , Moataz Bellah Mousa , Paul Ma , Jonathan Bakke , Todd Robert Dunn , Eric James Shero , Jereld Lee Winkler , YoungChol Byun , Shubham Garg , Jacqueline Wrench
IPC: C23C16/448 , C23C16/455 , C23C16/52 , H01L21/67
Abstract: The current disclosure relates to example method, system and apparatus for coupling a delivery vessel disposed at a first location on a substrate processing platform to a remote refill vessel disposed in a second location remote from the substrate processing platform via a first chemical delivery line, storing a chemical in the remote refill vessel in a first phase, changing the chemical in the remote refill vessel to a second phase, transporting the chemical in the second phase, to the delivery vessel via the first chemical delivery line, heating the first chemical delivery line to a first temperature equal to or above a phase change temperature of the chemical, and coupling the delivery vessel to an accumulator via a second chemical delivery line.
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公开(公告)号:US20240254629A1
公开(公告)日:2024-08-01
申请号:US18631858
申请日:2024-04-10
Applicant: ASM IP Holding B.V.
Inventor: Ankit Kimtee , Rohan Vijay Rane , Herbert Terhorst , Eric James Shero , Jereld Lee Winkler , Michael Schmotzer , Shuyang Zhang , Todd Robert Dunn , Shubham Garg
IPC: C23C16/458 , C23C16/46
CPC classification number: C23C16/4586 , C23C16/46
Abstract: A susceptor assembly includes a heater pedestal and a cap coupled to the heater pedestal. The cap can include one or mor through holes to facilitate purging and/or reduce dead volumes associated with the susceptor assemblies. Reactor systems including such assemblies are also disclosed.
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公开(公告)号:US11972969B2
公开(公告)日:2024-04-30
申请号:US18130543
申请日:2023-04-04
Applicant: ASM IP Holding B.V.
Inventor: Surojit Ganguli , Todd Robert Dunn , Ankit Kimtee
CPC classification number: H01L21/681 , G01N21/0303 , H01L29/0665
Abstract: A laser alignment fixture for a reactor system may be used to align components of the reactor system to allow for a uniform deposition of a thin film onto a substrate. The laser alignment fixture may include: a lid assembly; and a plurality of laser and sensor assemblies. The laser alignment fixture may align at least: a flow control ring, a susceptor, and a side wall of the reactor system.
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公开(公告)号:US20230207377A1
公开(公告)日:2023-06-29
申请号:US18087871
申请日:2022-12-23
Applicant: ASM IP Holding B.V.
Inventor: Rohan Vijay Rane , Herbert Terhorst , Eric James Shero , Ankit Kimtee , Jereld Lee Winkler , Michael Schmotzer , Shuyang Zhang , Todd Robert Dunn , Shubham Garg
IPC: H01L21/687 , C23C16/44
CPC classification number: H01L21/68735 , C23C16/4408 , H01L21/68785
Abstract: A semiconductor processing device comprises a susceptor assembly comprising a wafer support configured to support a wafer. The wafer support comprises a wafer support body configured to support the wafer, a purge channel extending laterally from an inner portion of the wafer support body to an outer portion of the wafer support body, a first plenum channel disposed at the outer portion of the wafer support and in fluid communication with the purge channel, and an outlet to deliver purge gas to an edge of the wafer, the outlet in fluid communication with the first plenum channel, a purge gas supply hole on a surface opposite to the wafer support body. The purge gas supply hole is in fluid communication with the purge channel, and a plurality of first purge holes fluidly communicated with the first plenum channel and the purge channel.
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公开(公告)号:US20240218506A1
公开(公告)日:2024-07-04
申请号:US18395801
申请日:2023-12-26
Applicant: ASM IP Holding B.V.
Inventor: Eric James Shero , Jonathan Bakke , Arjav Prafulkumar Vashi , Todd Robert Dunn , Paul Ma , Jacqueline Wrench , Jereld Lee Winkler , Shuaidi Zhang , Shubham Garg , YoungChol Byun
IPC: C23C16/448 , C23C16/455 , C23C16/52
CPC classification number: C23C16/448 , C23C16/45557 , C23C16/45561 , C23C16/52
Abstract: The substrate processing system includes a delivery vessel having a first inner volume, disposed in a first location on a substrate processing platform, a remote refill vessel in fluid communication with the delivery vessel via a chemical delivery line, the remote refill vessel comprising a second inner volume greater than the first inner volume and disposed in a second location remote from the substrate processing platform, and a first heating device or a first pressurizing device, or a combination thereof, proximate the remote refill vessel, operable to heat or pressurize, or a combination thereof, a chemical disposed in the remote refill vessel sufficient to change a phase of the chemical from a first phase to a second phase.
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公开(公告)号:US11742189B2
公开(公告)日:2023-08-29
申请号:US16251534
申请日:2019-01-18
Applicant: ASM IP Holding B.V.
Inventor: Carl Louis White , Mohith Verghese , Eric James Shero , Todd Robert Dunn
IPC: H01J37/32
CPC classification number: H01J37/32899 , H01J37/3244 , H01J37/32513 , H01J37/32715 , H01J37/32733
Abstract: Multi-zone reactors, systems including a multi-zone reactor, and methods of using the systems and reactors are disclosed. Exemplary multi-zone reactors include a movable susceptor assembly and a moveable plate. The movable susceptor assembly and movable plate can move vertically between reaction zones of a reactor to expose a substrate to multiple processes or reactants.
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公开(公告)号:US20230245911A1
公开(公告)日:2023-08-03
申请号:US18130543
申请日:2023-04-04
Applicant: ASM IP Holding B.V.
Inventor: Surojit Ganguli , Todd Robert Dunn , Ankit Kimtee
CPC classification number: H01L21/681 , G01N21/0303 , H01L29/0665
Abstract: A laser alignment fixture for a reactor system may be used to align components of the reactor system to allow for a uniform deposition of a thin film onto a substrate. The laser alignment fixture may include: a lid assembly; and a plurality of laser and sensor assemblies. The laser alignment fixture may align at least: a flow control ring, a susceptor, and a side wall of the reactor system.
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公开(公告)号:US20220380895A1
公开(公告)日:2022-12-01
申请号:US17816052
申请日:2022-07-29
Applicant: ASM IP HOLDING B.V.
Inventor: Raj Singu , Todd Robert Dunn , Carl Louis White , Herbert Terhorst , Eric James Shero , Bhushan Zope
IPC: C23C16/458 , C23C16/455 , C23C16/46 , H01L21/687
Abstract: A workpiece susceptor body can include a front face configured to support a workpiece, a back face opposite the front face, a workpiece contact zone at least partially forming a support boundary on an inner portion of the front face, and a plurality of axial channels disposed within the susceptor body. The workpiece contact zone can be disposed radially inward of an outer edge of a workpiece positioned on the front face in a processing configuration. Each of the plurality of axial channels may connect to corresponding openings extending into an outer portion of the front face. Each of the openings may be disposed radially outward of the workpiece contact zone of the susceptor body.
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公开(公告)号:US20200299836A1
公开(公告)日:2020-09-24
申请号:US16813527
申请日:2020-03-09
Applicant: ASM IP HOLDING B.V.
Inventor: Dinkar Nandwana , Jereld Lee Winkler , Eric James Shero , Todd Robert Dunn , Carl Louis White
IPC: C23C16/44 , C23C16/455 , H01L21/67
Abstract: Herein disclosed are systems and methods related to semiconductor processing device including a manifold including a bore configured to deliver a gas to a reaction chamber, the manifold including a first block mounted to a second block, the first and second mounted blocks cooperating to at least partially define the bore. A supply channel provides fluid communication between a gas source and the bore, and the supply channel is disposed at least partially in the second block. A metallic seal is disposed about the bore at an interface between the first and second block. Advantageously, the metallic seal improves sealing between the interface between the first block and the second block.
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公开(公告)号:US10683571B2
公开(公告)日:2020-06-16
申请号:US14188760
申请日:2014-02-25
Applicant: ASM IP Holding B.V.
Inventor: Lucian C. Jdira , Herbert Terhorst , Michael Halpin , Carl White , Todd Robert Dunn , Eric Shero , Melvin Verbass , Christopher Wuester , Kyle Fondurulia
IPC: C23C16/455 , H01L21/67 , H01J37/32
Abstract: A gas inlet system for a wafer processing reactor includes a tubular gas manifold conduit adapted to be connected to a gas inlet port of the wafer processing reactor; and gas feeds including a first feed for feeding a first gas into the tubular gas manifold conduit and a second feed for feeding a second gas into the tubular gas manifold conduit. Each feed has two or more injection ports connected to the tubular gas manifold conduit at a first axial position of the tubular gas manifold conduit, and the injection ports of each of the gas feeds are evenly distributed along a circumference of the tubular gas manifold conduit at the first axial position.
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