FORMING PUNCH-THROUGH STOPPER REGIONS IN FINFET DEVICES
    1.
    发明申请
    FORMING PUNCH-THROUGH STOPPER REGIONS IN FINFET DEVICES 有权
    在FINFET设备中形成PUNCH-THROUGH STOPPER区域

    公开(公告)号:US20160293734A1

    公开(公告)日:2016-10-06

    申请号:US14678874

    申请日:2015-04-03

    Abstract: In forming a punch-through stopper region in a fin field effect transistor (finFET) device, a substrate may be etched to form a pair of trenches that define a fin structure. A portion of a first dose of ions may be implanted into the substrate through a bottom wall of each trench to form a pair of first dopant regions that at least partially extend under a channel region of the fin structure. The substrate at the bottom wall of each trench may be etched to increase a depth of each trench. Etching the substrate at the bottom wall of each trench may remove a portion of each first dopant region under each trench. A remaining portion of the pair of first dopant regions under the fin structure may at least partially define the punch-through stopper region of the finFET device.

    Abstract translation: 在鳍状场效应晶体管(finFET)器件中形成穿通停止区域时,可蚀刻衬底以形成限定翅片结构的一对沟槽。 第一剂量的离子的一部分可以通过每个沟槽的底壁注入到衬底中,以形成至少部分地延伸在翅片结构的沟道区域下面的一对第一掺杂区域。 可以蚀刻每个沟槽的底壁处的衬底以增加每个沟槽的深度。 在每个沟槽的底壁处蚀刻衬底可以去除每个沟槽下的每个第一掺杂剂区域的一部分。 翅片结构下面的一对第一掺杂剂区域的剩余部分可以至少部分地限定finFET器件的穿通阻挡区域。

    GAS MIXTURE METHOD AND APPARATUS FOR GENERATING ION BEAM
    2.
    发明申请
    GAS MIXTURE METHOD AND APPARATUS FOR GENERATING ION BEAM 有权
    气体混合方法和用于生成离子束的装置

    公开(公告)号:US20140151572A1

    公开(公告)日:2014-06-05

    申请号:US13692461

    申请日:2012-12-03

    Abstract: A gas mixture method and apparatus of prolonging lifetime of an ion source for generating an ion beam particularly an ion beam containing carbon is proposed here. By mixing the dopant gas and the minor gas together to generate an ion beam, undesired reaction between the gas species and the ion source can be mitigated and thus lifetime of the ion source can be prolonged. Accordingly, quality of ion beam can be maintained.

    Abstract translation: 这里提出了一种用于产生离子束,特别是含有离子束的离子源的寿命延长的气体混合方法和装置。 通过将掺杂气体和次要气体混合在一起以产生离子束,可以减轻气体物质和离子源之间的不期望的反应,从而可以延长离子源的寿命。 因此,可以保持离子束的质量。

    MAGNETIC FIELD FLUCTUATION FOR BEAM SMOOTHING
    3.
    发明申请
    MAGNETIC FIELD FLUCTUATION FOR BEAM SMOOTHING 审中-公开
    用于光束吸收的磁场波动

    公开(公告)号:US20160225577A1

    公开(公告)日:2016-08-04

    申请号:US15097996

    申请日:2016-04-13

    Abstract: The time-averaged ion beam profile of an ion beam for implanting ions on a work piece may be smoothed to reduce noise, spikes, peaks, and the like and to improve dosage uniformity. Auxiliary magnetic field devices, such as electromagnets, may be located along an ion beam path and may be driven by periodic signals to generate a fluctuating magnetic field to smooth the ion beam profile (i.e., beam current density profile). The auxiliary magnetic field devices may be positioned outside the width and height of the ion beam, and may generate a non-uniform fluctuating magnetic field that may be strongest near the center of the ion beam where the highest concentration of ions may be positioned. The fluctuating magnetic field may cause the beam profile shape to change continuously, thereby averaging out noise over time.

    Abstract translation: 用于在工件上注入离子的离子束的时间平均离子束轮廓可以被平滑以减少噪声,峰值,峰值等并且改善剂量均匀性。 诸如电磁体的辅助磁场装置可以沿着离子束路径设置,并且可以由周期性信号驱动以产生波动的磁场来平滑离子束轮廓(即,束电流密度分布)。 辅助磁场装置可以位于离子束的宽度和高度之外,并且可以产生在离子束的中心附近可能最强的不均匀的波动磁场,其中可以定位最高浓度的离子。 波动的磁场可能导致光束轮廓形状连续变化,从而使噪声随时间平均化。

    METHOD FOR ION IMPLANTATION
    4.
    发明申请
    METHOD FOR ION IMPLANTATION 有权
    离子植入方法

    公开(公告)号:US20160133469A1

    公开(公告)日:2016-05-12

    申请号:US14752522

    申请日:2015-06-26

    Abstract: A method for an ion implantation is provided. First, a non-parallel ion beam is provided. Thereafter, a relative motion between a workpiece and the non-parallel ion beam, so as to enable each region of the workpiece to be implanted by different portions of the non-parallel ion beam successively. Particularly, when at least one three-dimensional structure is located on the upper surface of the workpiece, both the top surface and the side surface of the three-dimensional structure may be implanted properly by the non-parallel ion beam when the workpiece is moved across the non-parallel ion beam one and only one times. Herein, the non-parallel ion beam can be a divergent ion beam or a convergent ion beam (both may be viewed as the integrated divergent beam), also can be generated directly from an ion source or is modified from a parallel ion beam, a divergent ion beam or a convergent ion beam.

    Abstract translation: 提供了一种用于离子注入的方法。 首先,提供非平行离子束。 此后,工件和非平行离子束之间的相对运动,以使得工件的每个区域能够被不平行离子束的不同部分连续地注入。 特别地,当至少一个三维结构位于工件的上表面上时,当工件移动时,可以通过非平行离子束适当地注入三维结构的顶表面和侧表面 跨越非平行离子束一次,仅一次。 这里,非平行离子束可以是发散离子束或会聚离子束(两者均可视为积分发散光束),也可以直接从离子源产生或者从平行离子束修饰, 发散离子束或会聚离子束。

    MAGNETIC FIELD FLUCTUATION FOR BEAM SMOOTHING
    5.
    发明申请
    MAGNETIC FIELD FLUCTUATION FOR BEAM SMOOTHING 有权
    用于光束吸收的磁场波动

    公开(公告)号:US20140212595A1

    公开(公告)日:2014-07-31

    申请号:US13769189

    申请日:2013-02-15

    Abstract: The time-averaged ion beam profile of an ion beam for implanting ions on a work piece may be smoothed to reduce noise, spikes, peaks, and the like and to improve dosage uniformity. Auxiliary magnetic field devices, such as electromagnets, may be located along an ion beam path and may be driven by periodic signals to generate a fluctuating magnetic field to smooth the ion beam profile (i.e., beam current density profile). The auxiliary magnetic field devices may be positioned outside the width and height of the ion beam, and may generate a non-uniform fluctuating magnetic field that may be strongest near the center of the ion beam where the highest concentration of ions may be positioned. The fluctuating magnetic field may cause the beam profile shape to change continuously, thereby averaging out noise over time.

    Abstract translation: 用于在工件上注入离子的离子束的时间平均离子束轮廓可以被平滑以减少噪声,峰值,峰值等并且改善剂量均匀性。 诸如电磁体的辅助磁场装置可以沿着离子束路径设置,并且可以由周期性信号驱动以产生波动的磁场来平滑离子束轮廓(即,束电流密度分布)。 辅助磁场装置可以位于离子束的宽度和高度之外,并且可以产生在离子束的中心附近可能最强的不均匀的波动磁场,其中可以定位最高浓度的离子。 波动的磁场可能导致光束轮廓形状连续变化,从而使噪声随时间平均化。

    RIBBON BEAM ANGLE ADJUSTMENT IN AN ION IMPLANTATION SYSTEM

    公开(公告)号:US20250062097A1

    公开(公告)日:2025-02-20

    申请号:US18939181

    申请日:2024-11-06

    Abstract: The present disclosure relates generally to ion implantation, and more particularly, to systems and processes for adjusting a ribbon beam angle of an ion implantation system. An exemplary ion implantation system includes an ion source configured to generate a ribbon beam, a wafer chuck configured to hold a wafer during implantation by the ribbon beam, a dipole magnet disposed between the ion source and the wafer chuck, and a controller. The dipole magnet includes at least two coils configured to adjust a ribbon beam angle of the ribbon beam at one or more locations along a path of the ribbon beam between the ion source and the wafer held in the wafer chuck. The controller is configured to control the ion source, the wafer chuck, and the dipole magnet.

    RIBBON BEAM ANGLE ADJUSTMENT IN AN ION IMPLANTATION SYSTEM

    公开(公告)号:US20230005701A1

    公开(公告)日:2023-01-05

    申请号:US17366308

    申请日:2021-07-02

    Abstract: The present disclosure relates generally to ion implantation, and more particularly, to systems and processes for adjusting a ribbon beam angle of an ion implantation system. An exemplary ion implantation system includes an ion source configured to generate a ribbon beam, a wafer chuck configured to hold a wafer during implantation by the ribbon beam, a dipole magnet disposed between the ion source and the wafer chuck, and a controller. The dipole magnet includes at least two coils configured to adjust a ribbon beam angle of the ribbon beam at one or more locations along a path of the ribbon beam between the ion source and the wafer held in the wafer chuck. The controller is configured to control the ion source, the wafer chuck, and the dipole magnet.

    ION IMPLANTATION SYSTEM AND PROCESS

    公开(公告)号:US20170110287A1

    公开(公告)日:2017-04-20

    申请号:US14883538

    申请日:2015-10-14

    Abstract: Ion implantation systems and processes are disclosed. An exemplary ion implantation system may include an ion source, an extraction manipulator, a magnetic analyzer, and an electrode assembly. The extraction manipulator may be configured to generate an ion beam by extracting ions from the ion source. A cross-section of the generated ion beam may have a long dimension and a short dimension orthogonal to the long dimension of the ion beam. The magnetic analyzer may be configured to focus the ion beam in an x-direction parallel to the short dimension of the ion beam. The electrode assembly may be configured to accelerate or decelerate the ion beam. One or more entrance electrodes of the electrode assembly may define a first opening and the electrode assembly may be positioned relative to the magnetic analyzer such that the ion beam converges in the x-direction as the ion beam enters through the first opening.

    LOWER DOSE RATE ION IMPLANTATION USING A WIDER ION BEAM
    9.
    发明申请
    LOWER DOSE RATE ION IMPLANTATION USING A WIDER ION BEAM 有权
    使用更宽的离子束降低剂量离子植入

    公开(公告)号:US20150371857A1

    公开(公告)日:2015-12-24

    申请号:US14312617

    申请日:2014-06-23

    Abstract: In an exemplary process for lower dose rate ion implantation of a work piece, an ion beam may be generated using an ion source and an extraction manipulator. The extraction manipulator may be positioned at a gap distance from an exit aperture of the ion source. A current of the ion beam exiting the extraction manipulator may be maximized when the extraction manipulator is positioned at an optimal gap distance from the exit aperture. The gap distance at which the extraction manipulator is positioned from the exit aperture may differ from the optimal gap distance by at least 10 percent. A first potential may be applied to a first set of electrodes. An x-dimension of the ion beam may increase as the ion beam passes through the first set of electrodes. The work piece may be positioned in the ion beam to implant ions into the work piece.

    Abstract translation: 在用于工件的较低剂量率离子注入的示例性过程中,可以使用离子源和提取操纵器来产生离子束。 提取操纵器可以位于离离子源的出口孔的间隙距离处。 当提取操纵器定位在与出射孔的最佳间隙距离处时,离开提取操纵器的离子束的电流可以最大化。 提取操纵器从出口孔定位的间隙距离可以不同于最佳间隙距离至少10%。 可以将第一电位施加到第一组电极。 当离子束通过第一组电极时,离子束的x维度可能增加。 工件可以位于离子束中以将离子注入到工件中。

    DECELERATION APPARATUS FOR RIBBON AND SPOT BEAMS
    10.
    发明申请
    DECELERATION APPARATUS FOR RIBBON AND SPOT BEAMS 有权
    RIBBON和SPOT BEA的减速装置

    公开(公告)号:US20150136967A1

    公开(公告)日:2015-05-21

    申请号:US14605985

    申请日:2015-01-26

    Abstract: A deceleration apparatus capable of decelerating a short spot beam or a tall ribbon beam is disclosed. In either case, effects tending to degrade the shape of the beam profile are controlled. Caps to shield the ion beam from external potentials are provided. Electrodes whose position and potentials are adjustable are provided, on opposite sides of the beam, to ensure that the shape of the decelerating and deflecting electric fields does not significantly deviate from the optimum shape, even in the presence of the significant space-charge of high current low-energy beams of heavy ions.

    Abstract translation: 公开了一种减速装置,能够使短点光束或高色带光束减速。 在任一种情况下,都会控制趋向于降低光束轮廓形状的效果。 提供了用于将离子束屏蔽到外部电位的盖子。 其位置和电位可调的电极设置在梁的相对两侧,以确保减速和偏转电场的形状不会显着偏离最佳形状,即使存在显着的空间电荷高 目前低能量的重离子束。

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