摘要:
An optical semiconductor device includes an SiC substrate having an n-type conductivity, and an AlGaN buffer layer having an n-type conductivity formed on the SiC substrate with a composition represented as AlxGa1-xN, wherein the AlGaN buffer layer has a carrier density in the range between 3×1018–1×1020 cm−3, and the compositional parameter x is larger than 0 but smaller than 0.4 (0
摘要翻译:光学半导体器件包括具有n型导电性的SiC衬底和在SiC衬底上形成的具有n型导电性的AlGaN缓冲层,其组成表示为Al x Ga 1 -X N,其中所述AlGaN缓冲层的载流子浓度在3×10 18 -1×10 -3 cm -3 -3之间的范围内, ,组成参数x大于0但小于0.4(0
摘要:
A lateral mode controlling layer made of AlN having a thickness of more than 0 nm but less than 300 nm is formed in at least one cladding layer of an n-type cladding layer and a p-type cladding layer or formed between the at least one cladding layer and the active layer. Also, a mask layer is formed on a substrate, then an AlN layer is formed to cover it, and then the AlN layer is lifted off by using a solution for etching. the mask layer. Accordingly, lateral mode control of the group III-V compound semiconductor laser can be facilitated, the aspect ratio of the beam shape can be improved, and the damage caused by the Al layer growth and the patterning can be reduced.
摘要:
A method for fabricating a light-emitting device includes: forming a first semiconductor layer on a substrate; foaming an active layer on the first semiconductor layer; forming a second semiconductor layer on the active layer, the second semiconductor layer having a conduction type opposite to that of the first semiconductor layer; and forming a recess so as to be penetrated through up to the first semiconductor layer from the second semiconductor layer by a first etching; and forming an inversely tapered shape to an inner wall of the recess by a second etching using an etching solution.
摘要:
A substrate is made of SiC. A plurality of AlxGa1−xN patterns (0≦x≦1) is formed on a surface of the substrate and dispersively distributed in an in-plane of the substrate. An AlyGa1−yN buffer layer (0≦y≦1) covers the surface of the substrate and the AlxGa1−xN patterns. A laser structure is formed on the AlyGa1−yN buffer layer. Since the AlGaN buffer layer is grown by using the AlGaN patterns as seed crystals, a dislocation density of a predetermined region in the AlGaN buffer layer can be lowered. The characteristics of a laser structure can be improved by forming the laser structure above the region having a low dislocation density. Since the AlGaN pattern has electric conductivity, the device resistance can be suppressed from being increased.
摘要翻译:衬底由SiC制成。 在基板的表面上形成多个Al x Ga 1-x N图案(0 <= x <= 1),并且分散地分布在基板的平面内。 AlyGa1-yN缓冲层(0 <= y <= 1)覆盖衬底的表面和Al x Ga 1-x N图案。 在AlyGa1-yN缓冲层上形成激光结构。 由于通过使用AlGaN图案作为晶种生长AlGaN缓冲层,所以可以降低AlGaN缓冲层中的预定区域的位错密度。 可以通过在低位错密度的区域上形成激光结构来改善激光器结构的特性。 由于AlGaN图案具有导电性,所以可以抑制器件电阻的增加。
摘要:
A semiconductor growing apparatus including: a susceptor having a main face and a side face, the main face receiving a substrate for growing a semiconductor layer, and the side face having a groove; a heating element for heating the susceptor.
摘要:
A semiconductor device includes: an AlN layer provided on a substrate; a Si-doped GaN layer provided on the AlN layer; an undoped GaN layer provided on the Si-doped GaN layer; and an operation layer provided on the undoped GaN layer.
摘要:
A semiconductor growing apparatus including: susceptor having a main face and a side face, the main face receiving a substrate for growing a semiconductor layer, and the side face having a groove; a heating element for heating the susceptor.
摘要:
A semiconductor light emitting device includes a second semiconductor layer, an active layer, a third semiconductor layer and a pair of electrodes. The second semiconductor layer is formed directly on the principal pane of a substrate or via a first semiconductor layer. The active layer is formed on the second semiconductor layer and has an energy band gap which is smaller than the energy band gap of the second semiconductor layer. The active layer is made of a semiconductor having an uniaxial anisotropy. The third semiconductor layer is formed on the active layer and has the energy band gap which is larger than the energy band gap of the active layer. The pair of electrodes supplies current to the second semiconductor layer, the active layer, and the third semiconductor layer in the film thickness direction. The film thickness direction of at least the active layer is different from the axis of the uniaxial anisotropy.