公开(公告)号：US20180056455A1

公开(公告)日：2018-03-01

申请号：US15562195

申请日：2016-03-31

Applicant: Alpha Assembly Solutions Inc.

Inventor： Ramakrishna Hosur Venkatagiriyappa ,  Morgana De Avila Ribas ,  Barun Das ,  Harish Hanchina Siddappa ,  Sutapa Mukherjee ,  Siuli Sarkar ,  Bawa Singh ,  Rahul Raut ,  Ranjit Pandher

IPC: B23K35/36 ,  C08K5/549 ,  C08K3/04 ,  B23K35/02 ,  H01L23/00 ,  H01L23/29

Abstract: A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein: the organic medium comprises a polymer; the filler comprises one or more of graphene, functionalized graphene, graphene oxide, a polyhedral oligomeric silsesquioxane, graphite, a 2D material, aluminum oxide, zinc oxide, aluminum nitride, boron nitride, silver, nano fibers, carbon fibers, diamond, carbon nanotubes, silicon dioxide and metal-coated particles, and the composition comprises from 0.001 to 40 wt. % of the filler based on the total weight of the composition.

公开(公告)号：US09786629B2

公开(公告)日：2017-10-10

申请号：US14908986

申请日：2014-07-31

Applicant: Alpha Assembly Solutions Inc.

Inventor： Ramakrishna Hosur Venkatagiriyappa ,  Sutapa Mukherjee ,  Harish Hanchina Siddappa ,  Morgana De Avila Ribas ,  Siuli Sarkar ,  Bawa Singh ,  Rahul Raut

IPC: H01L21/56 ,  H01L23/29 ,  H01L23/00 ,  H01L21/66 ,  H05K3/28 ,  H05K3/34

CPC classification number: H01L24/81 ,  H01L21/563 ,  H01L22/12 ,  H01L23/293 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L2224/13101 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81011 ,  H01L2224/81024 ,  H01L2224/81026 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2224/81908 ,  H01L2224/83855 ,  H01L2224/92125 ,  H01L2924/0133 ,  H05K3/284 ,  H05K3/3436 ,  H05K3/3489 ,  H05K2201/10734 ,  H05K2201/10977 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/00

Abstract: Dual-side reinforcement (DSR) materials and methods for semiconductor fabrication. The DSR materials exhibit the properties of conventional underfill materials with enhanced stability at room temperature.

公开(公告)号：US10682732B2

公开(公告)日：2020-06-16

申请号：US15562195

申请日：2016-03-31

Applicant: Alpha Assembly Solutions Inc.

Inventor： Ramakrishna Hosur Venkatagiriyappa ,  Morgana De Avila Ribas ,  Barun Das ,  Harish Hanchina Siddappa ,  Sutapa Mukherjee ,  Siuli Sarkar ,  Bawa Singh ,  Rahul Raut ,  Ranjit Pandher

IPC: C09J163/00 ,  C08L63/00 ,  C08K3/00 ,  C08K3/04 ,  C08K3/34 ,  C08K5/54 ,  C08K9/00 ,  B23K35/36 ,  B23K1/00 ,  B23K35/02 ,  H01L23/29 ,  H01L23/00 ,  C08K5/00 ,  C08K3/013 ,  B23K1/20 ,  C08K7/02 ,  B23K35/00 ,  C08K5/549 ,  B32B27/38 ,  B23K101/42

Abstract: A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein: the organic medium comprises a polymer; the filler comprises one or more of graphene, functionalized graphene, graphene oxide, a polyhedral oligomeric silsesquioxane, graphite, a 2D material, aluminum oxide, zinc oxide, aluminum nitride, boron nitride, silver, nano fibers, carbon fibers, diamond, carbon nanotubes, silicon dioxide and metal-coated particles, and the composition comprises from 0.001 to 40 wt. % of the filler based on the total weight of the composition.

公开(公告)号：US20190143461A9

公开(公告)日：2019-05-16

申请号：US15562195

申请日：2016-03-31

Applicant: Alpha Assembly Solutions Inc.

Inventor： Ramakrishna Hosur Venkatagiriyappa ,  Morgana De Avila Ribas ,  Barun Das ,  Harish Hanchina Siddappa ,  Sutapa Mukherjee ,  Siuli Sarkar ,  Bawa Singh ,  Rahul Raut ,  Ranjit Pandher

IPC: B23K35/36 ,  C08K5/549 ,  C08K3/04 ,  B23K35/02 ,  H01L23/00 ,  H01L23/29

Abstract: A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein: the organic medium comprises a polymer; the filler comprises one or more of graphene, functionalized graphene, graphene oxide, a polyhedral oligomeric silsesquioxane, graphite, a 2D material, aluminum oxide, zinc oxide, aluminum nitride, boron nitride, silver, nano fibers, carbon fibers, diamond, carbon nanotubes, silicon dioxide and metal-coated particles, and the composition comprises from 0.001 to 40 wt. % of the filler based on the total weight of the composition.