SINGLE PROCESS GAS FEED LINE ARCHITECTURE
    7.
    发明公开

    公开(公告)号:US20240043999A1

    公开(公告)日:2024-02-08

    申请号:US17880310

    申请日:2022-08-03

    CPC classification number: C23C16/45561 C23C16/24 C23C16/45512

    Abstract: Exemplary semiconductor processing systems may a lid plate. A gas splitter may be seated on the lid plate. The gas splitter may include a top surface and a plurality of side surfaces. The gas splitter may defines a gas inlet, one or more gas outlets, and one or more gas lumens. The one or more gas lumens may extend between and fluidly couple the gas inlet with each of the one or more gas outlets. A primary gas weldment may extend to and fluidly couples to the gas inlet. A gas panel may include a first fluid source and a second fluid source that are each fluidly coupled with the primary gas weldment. One or more secondary gas weldments may extend between and fluidly couple each of the one or more gas outlets with a respective one of the plurality of processing chambers.

    HIGH CONDUCTANCE DIVERT LINE ARCHITECTURE
    8.
    发明公开

    公开(公告)号:US20240047232A1

    公开(公告)日:2024-02-08

    申请号:US17880885

    申请日:2022-08-04

    CPC classification number: H01L21/67017 H01L21/67167

    Abstract: Exemplary semiconductor processing systems may include a lid plate and a gas splitter. The gas splitter may be seated on the lid plate. The gas splitter may include a top surface and a plurality of side surfaces. The gas splitter may define a gas inlet, a gas outlet, a gas lumen that extends between and fluidly couples the gas inlet with the gas outlet, and a first divert lumen that is fluidly coupled with the gas lumen and that directs gases away from a processing chamber through a divert outlet. The semiconductor processing system may include a first divert weldment. The first divert weldment may extend from and fluidly couple to the divert outlet. The first divert weldment may include a first divert weldment outlet and a second divert weldment outlet.

    MANIFOLD FOR EQUAL SPLITTING AND COMMON DIVERT ARCHITECTURE

    公开(公告)号:US20230124246A1

    公开(公告)日:2023-04-20

    申请号:US17505323

    申请日:2021-10-19

    Abstract: Exemplary substrate processing systems may include a lid plate. The systems may include a gas splitter seated on the lid plate. The gas splitter may include a top surface and side surfaces. The gas splitter may define a first and second gas inlets, with each gas inlet extending through one side surface. The gas splitter may define first and second gas outlets extending through the top surface. The gas splitter may define first and second gas lumens that extend between and fluidly couple each gas inlet with corresponding gas outlets. The gas splitter may define mixing channels that include a mixing outlet extending through a side surface and a mixing inlet extending through the top surface. The systems may include output manifolds seated on the lid plate. The systems may include output weldments that fluidly couple each mixing outlet with a respective one of the output manifolds.

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