公开(公告)号：US20180240654A1

公开(公告)日：2018-08-23

申请号：US15957827

申请日：2018-04-19

Applicant: Applied Materials, Inc.

Inventor： Soonam Park ,  Yufei Zhu ,  Edwin C. Suarez ,  Nitin K. Ingle ,  Dmitry Lubomirsky ,  Jiayin Huang

IPC: H01J37/32 ,  C23C16/44 ,  G01J3/02 ,  C23C16/50 ,  C23C16/52 ,  C23C16/455 ,  C23C16/452

CPC classification number: H01L21/32136 ,  C23C16/4405 ,  C23C16/452 ,  C23C16/45565 ,  C23C16/50 ,  C23C16/52 ,  G01J3/0218 ,  G01J3/443 ,  H01J37/32082 ,  H01J37/32532 ,  H01J37/3255 ,  H01J37/32935 ,  H01J37/32963 ,  H01J37/32972 ,  H01J37/3299 ,  H01L21/3065 ,  H01L21/31116 ,  H01L21/31138 ,  H01L21/67069 ,  H01L22/26

Abstract: In an embodiment, a plasma source includes a first electrode, configured for transfer of one or more plasma source gases through first perforations therein; an insulator, disposed in contact with the first electrode about a periphery of the first electrode; and a second electrode, disposed with a periphery of the second electrode against the insulator such that the first and second electrodes and the insulator define a plasma generation cavity. The second electrode is configured for movement of plasma products from the plasma generation cavity therethrough toward a process chamber. A power supply provides electrical power across the first and second electrodes to ignite a plasma with the one or more plasma source gases in the plasma generation cavity to produce the plasma products. One of the first electrode, the second electrode and the insulator includes a port that provides an optical signal from the plasma.

公开(公告)号：US20170229293A1

公开(公告)日：2017-08-10

申请号：US15581425

申请日：2017-04-28

Applicant: Applied Materials, Inc.

Inventor： Soonam Park ,  Yufei Zhu ,  Edwin C. Suarez ,  Nitin K. Ingle ,  Dmitry Lubomirsky ,  Jiayin Huang

IPC: H01J37/32 ,  H01L21/3213 ,  C23C16/455 ,  H01L21/66 ,  C23C16/505 ,  C23C16/52 ,  H01L21/311 ,  H01L21/67

Abstract: A method of conditioning internal surfaces of a plasma source includes flowing first source gases into a plasma generation cavity of the plasma source that is enclosed at least in part by the internal surfaces. Upon transmitting power into the plasma generation cavity, the first source gases ignite to form a first plasma, producing first plasma products, portions of which adhere to the internal surfaces. The method further includes flowing the first plasma products out of the plasma generation cavity toward a process chamber where a workpiece is processed by the first plasma products, flowing second source gases into the plasma generation cavity. Upon transmitting power into the plasma generation cavity, the second source gases ignite to form a second plasma, producing second plasma products that at least partially remove the portions of the first plasma products from the internal surfaces.

公开(公告)号：US11996315B2

公开(公告)日：2024-05-28

申请号：US16951823

申请日：2020-11-18

Applicant: APPLIED MATERIALS, INC.

Inventor： Abhishek Chowdhury ,  Harisha Sathyanarayana ,  Edwin C. Suarez ,  Siqing Lu ,  Nataraj Bhaskar Rao

IPC: H01L21/687 ,  C23C16/455 ,  C23C16/458 ,  H01L21/02 ,  H01L21/67 ,  H01L21/683

CPC classification number: H01L21/68721 ,  C23C16/45536 ,  C23C16/4582 ,  C23C16/4585 ,  H01L21/02656 ,  H01L21/67017 ,  H01L21/6833

Abstract: Embodiments of process kits for use in a process chamber are provided herein. In some embodiments, a cover ring for use in a process chamber includes: an annular body that includes an upper surface and a lower surface, an inner lip extending radially inward and downward from the annular body, and a plurality of protrusions extending downward from the inner lip and disposed at regular intervals along the inner lip, wherein lowermost surfaces of the plurality of protrusions together define a planar substrate contact surface.

公开(公告)号：US09966240B2

公开(公告)日：2018-05-08

申请号：US14514222

申请日：2014-10-14

Applicant: Applied Materials, Inc.

Inventor： Soonam Park ,  Yufei Zhu ,  Edwin C. Suarez ,  Nitin K. Ingle ,  Dmitry Lubomirsky ,  Jiayin Huang

IPC: H01J37/32 ,  G01J3/02 ,  C23C16/50 ,  C23C16/44 ,  C23C16/452 ,  C23C16/455 ,  C23C16/52

CPC classification number: H01J37/32972 ,  C23C16/4405 ,  C23C16/452 ,  C23C16/45565 ,  C23C16/50 ,  C23C16/52 ,  G01J3/0218 ,  G01J3/443 ,  H01J37/32082 ,  H01J37/32532 ,  H01J37/3255

Abstract: In an embodiment, a plasma source includes a first electrode, configured for transfer of one or more plasma source gases through first perforations therein; an insulator, disposed in contact with the first electrode about a periphery of the first electrode; and a second electrode, disposed with a periphery of the second electrode against the insulator such that the first and second electrodes and the insulator define a plasma generation cavity. The second electrode is configured for movement of plasma products from the plasma generation cavity therethrough toward a process chamber. A power supply provides electrical power across the first and second electrodes to ignite a plasma with the one or more plasma source gases in the plasma generation cavity to produce the plasma products. One of the first electrode, the second electrode and the insulator includes a port that provides an optical signal from the plasma.

公开(公告)号：US10707061B2

公开(公告)日：2020-07-07

申请号：US15581425

申请日：2017-04-28

Applicant: Applied Materials, Inc.

Inventor： Soonam Park ,  Yufei Zhu ,  Edwin C. Suarez ,  Nitin K. Ingle ,  Dmitry Lubomirsky ,  Jiayin Huang

IPC: H01J37/32 ,  H01L21/66 ,  H01L21/311 ,  H01L21/3213 ,  H01L21/67 ,  C23C16/455 ,  C23C16/50 ,  C23C16/505 ,  C23C16/52

Abstract: A method of conditioning internal surfaces of a plasma source includes flowing first source gases into a plasma generation cavity of the plasma source that is enclosed at least in part by the internal surfaces. Upon transmitting power into the plasma generation cavity, the first source gases ignite to form a first plasma, producing first plasma products, portions of which adhere to the internal surfaces. The method further includes flowing the first plasma products out of the plasma generation cavity toward a process chamber where a workpiece is processed by the first plasma products, flowing second source gases into the plasma generation cavity. Upon transmitting power into the plasma generation cavity, the second source gases ignite to form a second plasma, producing second plasma products that at least partially remove the portions of the first plasma products from the internal surfaces.

公开(公告)号：US10589399B2

公开(公告)日：2020-03-17

申请号：US15461944

申请日：2017-03-17

Applicant: Applied Materials, Inc.

Inventor： Jeonghoon Oh ,  Edwin C. Suarez ,  Jason Garcheung Fung ,  Eric Lau ,  King Yi Heung ,  Ashwin Murugappan Chockalingam ,  Daniel Redfield ,  Charles C. Garretson ,  Thomas H. Osterheld

IPC: B24B37/26 ,  B24B37/10

Abstract: A chemical mechanical polishing system includes a substrate support configured to hold a substrate, a polishing pad assembly include a membrane and a polishing pad portion having a polishing surface, a polishing pad carrier, and a drive system configured to cause relative motion between the substrate support and the polishing pad carrier. The polishing pad portion is joined to the membrane on a side opposite the polishing surface. The polishing surface has a width parallel to the polishing surface at least four times smaller than a diameter of the substrate. An outer surface of the polishing pad portion includes at least one recess and at least one plateau having a top surface that provides the polishing surface. The polishing surface has a plurality of edges defined by intersections between side walls of the at least one recess and a top surface of the at least one plateau.

公开(公告)号：US20200058516A1

公开(公告)日：2020-02-20

申请号：US16665834

申请日：2019-10-28

Applicant: Applied Materials, Inc.

Inventor： Soonam Park ,  Yufei Zhu ,  Edwin C. Suarez ,  Nitin K. Ingle ,  Dmitry Lubomirsky ,  Jiayin Huang

IPC: H01L21/3213 ,  H01J37/32 ,  C23C16/52 ,  C23C16/455 ,  C23C16/452 ,  C23C16/44 ,  H01L21/66 ,  H01L21/67 ,  H01L21/311 ,  H01L21/3065 ,  C23C16/50 ,  G01J3/02 ,  G01J3/443

Abstract: In an embodiment, a plasma source includes a first electrode, configured for transfer of one or more plasma source gases through first perforations therein; an insulator, disposed in contact with the first electrode about a periphery of the first electrode; and a second electrode, disposed with a periphery of the second electrode against the insulator such that the first and second electrodes and the insulator define a plasma generation cavity. The second electrode is configured for movement of plasma products from the plasma generation cavity therethrough toward a process chamber. A power supply provides electrical power across the first and second electrodes to ignite a plasma with the one or more plasma source gases in the plasma generation cavity to produce the plasma products. One of the first electrode, the second electrode and the insulator includes a port that provides an optical signal from the plasma.

公开(公告)号：US20160240402A1

公开(公告)日：2016-08-18

申请号：US15139243

申请日：2016-04-26

Applicant: Applied Materials, Inc.

Inventor： Soonam Park ,  Yufei Zhu ,  Edwin C. Suarez ,  Nitin K. Ingle ,  Dmitry Lubomirsky ,  Jiayin Huang

IPC: H01L21/67 ,  H01J37/32 ,  C23C16/455 ,  C23C16/50

CPC classification number: H01J37/32972 ,  C23C16/455 ,  C23C16/45536 ,  C23C16/45559 ,  C23C16/50 ,  C23C16/505 ,  C23C16/52 ,  H01J37/32082 ,  H01J37/32119 ,  H01J37/32357 ,  H01J37/3244 ,  H01J37/32532 ,  H01J37/3255 ,  H01J37/32623 ,  H01J2237/334 ,  H01L21/31116 ,  H01L21/32137 ,  H01L21/67069 ,  H01L21/67253 ,  H01L22/26

Abstract: A method of conditioning internal surfaces of a plasma source includes flowing first source gases into a plasma generation cavity of the plasma source that is enclosed at least in part by the internal surfaces. Upon transmitting power into the plasma generation cavity, the first source gases ignite to form a first plasma, producing first plasma products, portions of which adhere to the internal surfaces. The method further includes flowing the first plasma products out of the plasma generation cavity toward a process chamber where a workpiece is processed by the first plasma products, flowing second source gases into the plasma generation cavity. Upon transmitting power into the plasma generation cavity, the second source gases ignite to form a second plasma, producing second plasma products that at least partially remove the portions of the first plasma products from the internal surfaces.

公开(公告)号：USD1064005S1

公开(公告)日：2025-02-25

申请号：US29848745

申请日：2022-08-04

Applicant: Applied Materials, Inc.

Designer： Abhishek Chowdhury ,  Nataraj Bhaskar Rao ,  Edwin C. Suarez ,  Harisha Sathyanarayana ,  Diego Ramiro Puente Sotomayor ,  Qanit Takmeel ,  Mohammad Kamruzzaman Chowdhury ,  Arun Chakravarthy Chakravarthy

公开(公告)号：USD1038049S1

公开(公告)日：2024-08-06

申请号：US29758812

申请日：2020-11-18

Applicant: APPLIED MATERIALS, INC.

Designer： Abhishek Chowdhury ,  Harisha Sathyanarayana ,  Edwin C. Suarez ,  Siqing Lu ,  Nataraj Bhaskar Rao

Abstract: FIG. 1 is a bottom isometric view of a cover ring for use in a semiconductor processing chamber in accordance with some embodiments.
FIG. 2 is a top plan view thereof.
FIG. 3 is a bottom plan view thereof.
FIG. 4 is a front elevation view thereof.
FIG. 5 is a back elevation view thereof.
FIG. 6 is a right side elevation view thereof; and,
FIG. 7 is a left side elevation view thereof.
The broken lines in the drawings illustrate portions of the cover ring for use in a semiconductor processing chamber that form no part of the claimed design.