公开(公告)号：US20220333989A1

公开(公告)日：2022-10-20

申请号：US17234940

申请日：2021-04-20

Applicant: Applied Materials, Inc.

Inventor： Blake Erickson ,  Keith Berding ,  Michael Kutney ,  Zhaozhao Zhu ,  Tsung Feng Wu ,  Michael D. Willwerth ,  Jeffrey Ludwig

IPC: G01J3/32 ,  G01N21/25 ,  G01J3/02

Abstract: An apparatus includes a base component and collimators housed within the base component. The collimators correspond to collection cylinders for sampling optical emission spectroscopy (OES) signals with respect to locations of a wafer in an etch chamber. The apparatus further includes a guide, operatively coupled to the plurality of collimators, to guide the sampling of the OES signals along paths for sampling the OES signals.

公开(公告)号：US11415538B2

公开(公告)日：2022-08-16

申请号：US16812071

申请日：2020-03-06

Applicant: Applied Materials, Inc.

Inventor： Yaoling Pan ,  Patrick John Tae ,  Leonard Tedeschi ,  Michael D. Willwerth ,  Daniel Thomas McCormick

IPC: G01R27/26 ,  G01N27/22

Abstract: Embodiments disclosed herein include a sensor assembly. In an embodiment, the sensor assembly comprises a sensor module and a housing assembly. In an embodiment, the sensor module comprises a substrate, a capacitor with a first electrode and a second electrode on the substrate, and a capacitive-to-digital converter (CDC) electrically coupled to the first electrode and the second electrode. In an embodiment, the housing assembly is attached to the sensor module and comprises a shaft, wherein the shaft is hollow, and a cap over a first end of the shaft, wherein the cap has an opening to expose the capacitor.

公开(公告)号：US10790180B2

公开(公告)日：2020-09-29

申请号：US16576645

申请日：2019-09-19

Applicant: Applied Materials, Inc.

Inventor： Chih-Hsun Hsu ,  Tza-Jing Gung ,  Benjamin Schwarz ,  Shahid Rauf ,  Ankur Agarwal ,  Vijay D. Parkhe ,  Michael D. Willwerth ,  Zhiqiang Guo

IPC: H01L21/683 ,  H01J37/32

Abstract: Electrostatic chucks with variable pixelated magnetic field are described. For example, an electrostatic chuck (ESC) includes a ceramic plate having a front surface and a back surface, the front surface for supporting a wafer or substrate. A base is coupled to the back surface of the ceramic plate. A plurality of electromagnets is disposed in the base, the plurality of electromagnets configured to provide pixelated magnetic field tuning capability for the ESC.

公开(公告)号：US10290469B2

公开(公告)日：2019-05-14

申请号：US14293516

申请日：2014-06-02

Applicant: Applied Materials, Inc.

Inventor： Valentin N. Todorow ,  Gary Leray ,  Michael D. Willwerth ,  Li-Sheng Chiang

IPC: H05H1/46 ,  H01J37/32

Abstract: Embodiments of an apparatus having an improved coil antenna assembly that can provide enhanced plasma in a processing chamber is provided. The improved coil antenna assembly enhances positional control of plasma location within a plasma processing chamber, and may be utilized in etch, deposition, implant, and thermal processing systems, among other applications where the control of plasma location is desirable. In one embodiment, an electrode assembly configured to use in a semiconductor processing apparatus includes a RF conductive connector, and a conductive member having a first end electrically connected to the RF conductive connector, wherein the conductive member extends outward and vertically from the RF conductive connector.

公开(公告)号：US10257887B2

公开(公告)日：2019-04-09

申请号：US15840759

申请日：2017-12-13

Applicant: APPLIED MATERIALS, INC.

Inventor： Alexander Matyushkin ,  Dan Katz ,  John Holland ,  Theodoros Panagopoulos ,  Michael D. Willwerth

IPC: B05C13/00 ,  H05B3/00 ,  H01L21/67 ,  H01L21/683

Abstract: A substrate support assembly comprises a ceramic puck comprising a substrate receiving surface, and having embedded therein: (i) an electrode to generate an electrostatic force to retain a substrate placed on the substrate receiving surface; and (ii) a heater to heat the substrate, the heater comprising a plurality of spaced apart heater coils. A compliant layer bonds the ceramic puck to a base, the compliant layer comprising a silicon material. The base comprises a channel to circulate fluid therethrough, the channel having a channel inlet and a channel terminus.

公开(公告)号：US12009236B2

公开(公告)日：2024-06-11

申请号：US16391262

申请日：2019-04-22

Applicant: Applied Materials, Inc.

Inventor： Yaoling Pan ,  Patrick John Tae ,  Michael D. Willwerth ,  Leonard M. Tedeschi ,  Daniel Sang Byun ,  Philip Allan Kraus ,  Phillip A. Criminale ,  Changhun Lee ,  Rajinder Dhindsa ,  Andreas Schmid ,  Denis M. Koosau

IPC: H01L21/67 ,  H01J37/32 ,  H01L21/66 ,  H03K17/955

CPC classification number: H01L21/67259 ,  H01J37/32477 ,  H01J37/3288 ,  H01L22/12 ,  H03K17/955 ,  H01J2237/022

Abstract: The present disclosure generally relates to a method and apparatus for determining a metric related to erosion of a ring assembly used in an etching within a plasma processing chamber. In one example, the apparatus is configured to obtain a metric indicative of erosion on an edge ring disposed on a substrate support assembly in a plasma processing chamber. A sensor obtains the metric for the edge ring. The metric correlates to the quantity of erosion in the edge ring. In another example, the ring sensor may be arranged outside of a periphery of a substrate support assembly. The metric may be acquired by the ring sensor through a plasma screen.

公开(公告)号：US20230258500A1

公开(公告)日：2023-08-17

申请号：US18138914

申请日：2023-04-25

Applicant: Applied Materials, Inc.

Inventor： Blake Erickson ,  Keith Berding ,  Michael Kutney ,  Zhaozhao Zhu ,  Tsung Feng Wu ,  Michael D. Willwerth ,  Jeffrey Ludwig

IPC: G01J3/32 ,  G01J3/02 ,  G01N21/25 ,  G01N21/68 ,  G01N21/95

CPC classification number: G01J3/32 ,  G01J3/0291 ,  G01N21/255 ,  G01N21/68 ,  G01N21/9501

Abstract: An apparatus includes a base component and a plurality of collimators housed within the base component. Each collimator of the plurality of collimators corresponds to a respective location of a plurality of locations of a wafer in an etch chamber. The plurality of locations includes a center location of the wafer, a plurality of inner ring locations along an inner ring of the wafer associated with a first set of radially symmetric optical emission spectroscopy (OES) signal sampling paths, and a plurality of outer ring locations along an outer ring of the wafer associated with a second set of radially symmetric OES signal sampling paths.

公开(公告)号：US11668602B2

公开(公告)日：2023-06-06

申请号：US17234940

申请日：2021-04-20

Applicant: Applied Materials, Inc.

Inventor： Blake Erickson ,  Keith Berding ,  Michael Kutney ,  Zhaozhao Zhu ,  Tsung Feng Wu ,  Michael D. Willwerth ,  Jeffrey Ludwig

IPC: G01J3/32 ,  G01J3/02 ,  G01N21/25 ,  G01N21/68 ,  G01N21/95

CPC classification number: G01J3/32 ,  G01J3/0291 ,  G01N21/255 ,  G01N21/68 ,  G01N21/9501

Abstract: An apparatus includes a base component and collimators housed within the base component. The collimators correspond to collection cylinders for sampling optical emission spectroscopy (OES) signals with respect to locations of a wafer in an etch chamber. The apparatus further includes a guide, operatively coupled to the plurality of collimators, to guide the sampling of the OES signals along paths for sampling the OES signals.

公开(公告)号：US20210278360A1

公开(公告)日：2021-09-09

申请号：US16812071

申请日：2020-03-06

Applicant: Applied Materials, Inc.

Inventor： Yaoling Pan ,  Patrick John Tae ,  Leonard Tedeschi ,  Michael D. Willwerth ,  Daniel Thomas McCormick

IPC: G01N27/22

Abstract: Embodiments disclosed herein include a sensor assembly. In an embodiment, the sensor assembly comprises a sensor module and a housing assembly. In an embodiment, the sensor module comprises a substrate, a capacitor with a first electrode and a second electrode on the substrate, and a capacitive-to-digital converter (CDC) electrically coupled to the first electrode and the second electrode. In an embodiment, the housing assembly is attached to the sensor module and comprises a shaft, wherein the shaft is hollow, and a cap over a first end of the shaft, wherein the cap has an opening to expose the capacitor.

公开(公告)号：US20190115240A1

公开(公告)日：2019-04-18

申请号：US16213594

申请日：2018-12-07

Applicant: Applied Materials, Inc.

Inventor： Hung Sang Kim ,  Michael D. Willwerth

IPC: H01L21/683 ,  H01L21/67 ,  C23C16/458 ,  H01J37/32

Abstract: A gas flow is described to reduce condensation with a substrate processing chuck. In one example, a workpiece holder in the chamber having a puck to carry the workpiece for fabrication processes, a top plate thermally coupled to the puck, a cooling plate fastened to and thermally coupled to the top plate, the cooling plate having a cooling channel to carry a heat transfer fluid to transfer heat from the cooling plate, a base plate fastened to the cooling plate opposite the puck, and a dry gas inlet of the base plate to supply a dry gas under pressure to a space between the base plate and the cooling plate to drive ambient air from between the base plate and the cooling plate.