公开(公告)号：US20240408621A1

公开(公告)日：2024-12-12

申请号：US18207457

申请日：2023-06-08

Applicant: Applied Materials, Inc.

Inventor： Shashidhara Patel H B ,  Muhannad Mustafa ,  Amit Sahu ,  Sanjeev Baluja

IPC: B05B1/00 ,  B05B1/24 ,  H01L21/02

Abstract: Process chamber lids, processing chambers and methods using the lids are described. In some embodiments, the lid includes a showerhead with a plurality of heater segments in a peripheral region thereof. The heated showerhead minimizes temperature non-uniformity and/or minimizes heat less near the peripheral edge of a processed wafer.

公开(公告)号：US20240344608A1

公开(公告)日：2024-10-17

申请号：US18209762

申请日：2023-06-14

Applicant: Applied Materials, Inc.

Inventor： Shashidhara Patel H B ,  Nagaraj Naik ,  Muhannad Mustafa ,  Bin Cao ,  Sanjeev Baluja ,  Aditya Chuttar ,  Jae Hwa Park

IPC: F16J15/00 ,  F16J15/02

CPC classification number: F16J15/002 ,  F16J15/024

Abstract: Sealing bodies comprising a first body having a top surface and a bottom surface defining a thickness thereof. An inlet conduit and an outlet conduit are in fluid communication with one or more of the top surface, the bottom surface, or a top channel formed in the top surface or a bottom channel formed in the bottom surface.

公开(公告)号：US20240304470A1

公开(公告)日：2024-09-12

申请号：US18665683

申请日：2024-05-16

Applicant: Applied Materials, Inc.

Inventor： Akshay Gunaji ,  Tejas Umesh Ulavi ,  Sanjeev Baluja

IPC: H01L21/67 ,  C23C16/455 ,  C23C16/46 ,  F27D5/00 ,  H01L21/687 ,  H05B3/22

CPC classification number: H01L21/67103 ,  C23C16/45544 ,  C23C16/46 ,  F27D5/0037 ,  H01L21/68771 ,  H05B3/22

Abstract: A heater assembly having a top seal and a second seal configured to account for deviation in processing heights and motor runoff of a heater standoff. The top seal is positioned between a shield plate and a top plate and the bottom seal is positioned between a heater mounting base and the heater standoff.

公开(公告)号：US12087555B2

公开(公告)日：2024-09-10

申请号：US18083301

申请日：2022-12-16

Applicant: Applied Materials, Inc.

Inventor： Kalyanjit Ghosh ,  Shailendra Srivastava ,  Tejas Ulavi ,  Yusheng Zhou ,  Amit Kumar Bansal ,  Sanjeev Baluja

IPC: H01J37/32 ,  B08B7/00 ,  H01L21/67 ,  H01L21/683 ,  H01L21/687 ,  G03F7/42

CPC classification number: H01J37/32495 ,  H01J37/32862 ,  H01L21/67017 ,  B08B7/0021 ,  G03F7/427 ,  H01J37/32834 ,  H01L21/67028 ,  H01L21/6831 ,  H01L21/68742

Abstract: Implementations disclosed herein generally relate to systems and methods of protecting a substrate support in a process chamber from cleaning fluid during a cleaning process. The method of cleaning the process chamber includes positioning in the process chamber a cover substrate above a substrate support and a process kit that separates a purge volume from a process volume. The method of cleaning includes flowing a purge gas in the purge volume to protect the substrate support and flowing a cleaning fluid to a process volume above the cover substrate, flowing the cleaning fluid in the process volume to an outer flow path, and to an exhaust outlet in the chamber body. The purge volume is maintained at a positive pressure with respect to the process volume to block the cleaning fluid from the purge volume.

公开(公告)号：US12057333B2

公开(公告)日：2024-08-06

申请号：US17466403

申请日：2021-09-03

Applicant: Applied Materials, Inc.

Inventor： Kenneth Brian Doering ,  Vivek B. Shah ,  Ashutosh Agarwal ,  Sanjeev Baluja ,  Shrihari Sampathkumar ,  Chunlei Zhang

IPC: H01L21/67 ,  H01L21/66

CPC classification number: H01L21/67248 ,  H01L22/12 ,  H01L22/30 ,  H01L21/67103

Abstract: Metrology slot plates, processing chamber lids and processing chambers having metrology slot plates are described. Each of the metrology slot plates independently comprises one or more of a plate blank, a reflectometer, a capacitance sensor, a gas flow meter, a manometer, a pyrometer, a distance sensor (laser) or an emissometer.

公开(公告)号：US12018376B2

公开(公告)日：2024-06-25

申请号：US17024946

申请日：2020-09-18

Applicant: Applied Materials, Inc.

Inventor： Ashutosh Agarwal ,  Tejas Ulavi ,  Sanjeev Baluja

IPC: C23C16/52 ,  C23C16/458 ,  H01L21/67 ,  H01L21/687

CPC classification number: C23C16/52 ,  C23C16/4583 ,  H01L21/67103 ,  H01L21/67248 ,  H01L21/68764 ,  H01L21/68771

Abstract: Process chambers and methods for leveling a motor shaft and substrate support plane are described. The process chamber includes a motor shaft connected to the process chamber with a plurality of motor bolts. A first plurality of sensors is arranged at about the same radial distance from the rotational axis and at different angular positions relative to the rotational axis and a second plurality of sensors are arranged to measure the support plane. An angle-dependent motor leveling profile is determined and shim values for the motor bolts are determined to level the motor shaft. The support plane is measured using the second plurality of sensors to level the support plane perpendicular to the motor shaft.

公开(公告)号：US11682576B2

公开(公告)日：2023-06-20

申请号：US17845230

申请日：2022-06-21

Applicant: Applied Materials, Inc.

Inventor： Tejas Ulavi ,  Sanjeev Baluja ,  Dhritiman Subha Kashyap

IPC: H01T23/00 ,  H01L21/683 ,  H01L21/67

CPC classification number: H01L21/6833 ,  H01L21/67103

Abstract: Substrate supports comprising a top plate positioned on a shaft are described. The top plate including a primary heating element a first depth from the surface of the top plate, a inner zone heating element a second depth from the surface of the top plate and an outer zone heating element a third depth from the surface of the top plate. Substrate support assemblies comprising a plurality of substrate supports and methods of processing a substrate are also disclosed.

公开(公告)号：US11586789B2

公开(公告)日：2023-02-21

申请号：US17224545

申请日：2021-04-07

Applicant: Applied Materials, Inc.

Inventor： Dhritiman Subha Kashyap ,  Chaowei Wang ,  Kartik Shah ,  Kevin Griffin ,  Karthik Ramanathan ,  Hanhong Chen ,  Joseph AuBuchon ,  Sanjeev Baluja

IPC: G06F30/27 ,  G06F30/10

Abstract: Methods, software systems and processes to develop surrogate model-based optimizers for controlling and optimizing flow and pressure of purges between a showerhead and a heater having a substrate support to control non-uniformity inherent in a processing chamber due to geometric configuration and process regimes. The flow optimizer process utilizes experimental data from optimal process space coverage models, generated simulation data and statistical machine learning tools (i.e. regression models and global optimizers) to predict optimal flow rates for any user-specified process regime.

公开(公告)号：US11532462B2

公开(公告)日：2022-12-20

申请号：US16855126

申请日：2020-04-22

Applicant: Applied Materials, Inc.

Inventor： Kalyanjit Ghosh ,  Shailendra Srivastava ,  Tejas Ulavi ,  Yusheng Zhou ,  Amit Kumar Bansal ,  Sanjeev Baluja

IPC: H01J37/32 ,  H01L21/67 ,  B08B7/00 ,  H01L21/683 ,  H01L21/687 ,  G03F7/42

Abstract: Implementations disclosed herein generally relate to systems and methods of protecting a substrate support in a process chamber from cleaning fluid during a cleaning process. The method of cleaning the process chamber includes positioning in the process chamber a cover substrate above a substrate support and a process kit that separates a purge volume from a process volume. The method of cleaning includes flowing a purge gas in the purge volume to protect the substrate support and flowing a cleaning fluid to a process volume above the cover substrate, flowing the cleaning fluid in the process volume to an outer flow path, and to an exhaust outlet in the chamber body. The purge volume is maintained at a positive pressure with respect to the process volume to block the cleaning fluid from the purge volume.

公开(公告)号：US11508611B2

公开(公告)日：2022-11-22

申请号：US16664396

申请日：2019-10-25

Applicant: Applied Materials, Inc.

Inventor： Kalyanjit Ghosh ,  Mayur G. Kulkarni ,  Sanjeev Baluja ,  Praket P. Jha ,  Krishna Nittala

IPC: H01L21/687 ,  C23C16/458

Abstract: Implementations disclosed herein generally provide a lift pin that can improve the deposition rate and uniform film thickness above lift pin areas. In one implementation, the lift pin includes a first end coupling to a shaft, the first end having a pin head, and the pin head having a top surface, wherein the top surface is planar and flat, and a second end coupling to the shaft, the second end having a flared portion, wherein the flared portion has an outer surface extended along a direction that is at an angle of about 110° to about 140° with respect to a longitudinal axis of the lift pin.