公开(公告)号：US20250060321A1

公开(公告)日：2025-02-20

申请号：US18234777

申请日：2023-08-16

Applicant: Applied Materials, Inc.

Inventor： Elias Anthony Martinez ,  Sidharth Bhatia ,  Sarah Michelle Bobek ,  Ka Shun Wong ,  Zhi Wang ,  Martin J. Seamons ,  Raj Singu ,  Abdul Aziz Khaja ,  Ganesh Balasubramanian ,  Mark McTaggart Wylie

IPC: G01N21/95 ,  G01N35/00

Abstract: Disclosed are systems and techniques for fast and efficient detection of defects in wafers, including a system that has a factory interface (FI) coupled to a wafer carrier and a load lock chamber. The FI includes a robot fetches a wafer from the wafer carrier and deliver the first wafer to an aligner device. The aligner device imparts rotational motion to the wafer and identifies, using the rotational motion of the wafer, a position of a reference feature of the wafer. The FI further includes an optical inspection system that collects, during the rotational motion imparted to the wafer, an imaging data for the first wafer. The system further includes a processing device that performs evaluation, using the imaging data, of a presence of defect(s) in the wafer, and evaluates suitability of the wafer for wafer processing.

公开(公告)号：US20250028294A1

公开(公告)日：2025-01-23

申请号：US18223506

申请日：2023-07-18

Applicant: Applied Materials, Inc.

Inventor： Piyush Kumar Pandey ,  Prabal Sen ,  Ganapathy Saravanavel ,  Himadri Shekhar Hansda ,  Mohammed Dilkash Azam ,  Sidharth Bhatia

IPC: G05B19/18 ,  G05B23/02

Abstract: A method includes obtaining first data indicative of a measured profile of a substrate. The method further includes obtaining second data indicative of a profile of a reference substrate. The method further includes determining a corrected substrate profile based on the first data and the second data. The method further includes performing a corrective action based on the corrected substrate profile.

公开(公告)号：US20240176334A1

公开(公告)日：2024-05-30

申请号：US18070453

申请日：2022-11-28

Applicant: Applied Materials, Inc.

Inventor： Sidharth Bhatia ,  Roger Lindley ,  Upendra Ummethala ,  Thomas Li ,  Michael Howells ,  Steven Babayan ,  Mimi-Diemmy Dao

IPC: G05B19/418

CPC classification number: G05B19/41865 ,  G05B19/4188 ,  G05B19/41885 ,  G05B2219/45031

Abstract: A method includes receiving, by a processing device, first trace data associated with a first processing chamber, wherein the first processing chamber satisfies one or more performance metrics. The method further includes generating target trace data based on the first trace data associated with the first processing chamber. The method further includes receiving second trace data associated with a second processing chamber, wherein the second processing chamber does not satisfy the one or more performance metrics. The method further includes generating, based on the target trace data and the second trace data, a first recommended corrective action associated with the second processing chamber, wherein the first recommended corrective action includes updating one or more equipment constants of the second processing chamber. The method further includes performing the first recommended corrective action.

公开(公告)号：US20240061409A1

公开(公告)日：2024-02-22

申请号：US18495724

申请日：2023-10-26

Applicant: Applied Materials, Inc.

Inventor： Garrett Ho-Yee Sin ,  Sidharth Bhatia ,  Katty Marie Lydia Gamon Guyomard ,  Shawyon Jafari ,  Heng-Cheng Pai ,  Pramod Nambiar ,  Paul Lukas Brillhart ,  Ilker Durukan

IPC: G05B19/418 ,  G06N20/00 ,  G01N33/00 ,  G06F30/398

CPC classification number: G05B19/41875 ,  G06N20/00 ,  G01N33/00 ,  G06F30/398 ,  G06F2119/22

Abstract: A method includes identifying sets of part data associated with substrate processing equipment. Each of the sets of part data includes corresponding part values and a corresponding part identifier. Each of the sets of part data is associated with hardware parameters of a corresponding equipment part of substrate processing equipment. The method further includes generating sets of aggregated data. Each of the sets of aggregated data includes a corresponding set of part data of the sets of part data and a corresponding set of additional non-part data of sets of non-part data. The method further includes causing, based on the sets of aggregated data, performance of a corrective action associated with the substrate processing equipment.

公开(公告)号：US20220260978A1

公开(公告)日：2022-08-18

申请号：US17177978

申请日：2021-02-17

Applicant: Applied Materials, Inc.

Inventor： Garrett Ho-Yee Sin ,  Sidharth Bhatia ,  Katty Marie Lydia Gamon Guyomard ,  Shawyon Jafari ,  Heng-Cheng Pai ,  Pramod Nambiar ,  Paul Lukas Brillhart ,  Ilker Durukan

IPC: G05B19/418 ,  G06N20/00 ,  G01N33/00 ,  G06F30/398

Abstract: A method includes receiving part data associated with a corresponding part of substrate processing equipment, sensor data associated with one or more corresponding substrate processing operations performed by the substrate processing equipment to produce one or more corresponding substrates, and metrology data associated with the one or more corresponding substrates produced by the one or more corresponding substrate processing operations performed by the substrate processing equipment that includes the corresponding part. The method further includes generating sets of aggregated part-sensor-metrology data including a corresponding set of part data, a corresponding set of sensor data, and a corresponding set of metrology data. The method further includes causing analysis of the sets of aggregated part-sensor-metrology data to generate one or more outputs to perform a corrective action associated with the corresponding part of the substrate processing equipment.

公开(公告)号：US20240355687A1

公开(公告)日：2024-10-24

申请号：US18762536

申请日：2024-07-02

Applicant: Applied Materials, Inc.

Inventor： Sidharth Bhatia ,  Jie Feng ,  Dermot Cantwell

IPC: H01L21/66 ,  G01B7/06 ,  G01N21/41 ,  G06N3/08 ,  G06Q50/04 ,  G06T7/00 ,  G11C11/16 ,  H01J37/32 ,  H01L21/02 ,  H01L21/67

CPC classification number: H01L22/12 ,  G06N3/08 ,  G06Q50/04 ,  H01L21/02 ,  H01L21/67253 ,  G01B7/105 ,  G01N21/41 ,  G06T7/0004 ,  G11C11/1675 ,  H01J37/32458 ,  Y02P90/30

Abstract: A method includes: identifying target film property data; causing, based on the target film property data, orthonormal vector based principal component analysis (PCA) to be performed to obtain output; and causing, based on the output, processing of substrates to meet the target film property data.

公开(公告)号：USD1045924S1

公开(公告)日：2024-10-08

申请号：US29907881

申请日：2024-01-09

Applicant: Applied Materials, Inc.

Designer： Sidharth Bhatia ,  Zhaozhao Zhu ,  Jeffrey Yat Shan Au ,  Shawn Levesque ,  Michael Howells ,  Raja Sekhar Jetti

Abstract: FIG. 1 is a front view of a first image in a sequence of a portion of a display panel with a graphical user interface; and,
FIG. 2 is a second image thereof.
The broken line showing of various regions of a graphical user interface in each of the views form no part of the claimed design. The broken line showing of the display screen is for illustrative purposes only and forms no part of the claimed design.
The appearance of the transitional image sequentially transitions between the images shown in FIGS. 1-2. The process or period in which one image transitions to another image forms no part of the claimed design.

公开(公告)号：US12080519B2

公开(公告)日：2024-09-03

申请号：US17843830

申请日：2022-06-17

Applicant: Applied Materials, Inc.

Inventor： Jie Yu ,  Yue Guo ,  Kartik Ramaswamy ,  Tao Zhang ,  Shahid Rauf ,  John Forster ,  Sidharth Bhatia ,  Rong Gang Zheng

IPC: H01J37/32

CPC classification number: H01J37/32183 ,  H01J37/32926

Abstract: Embodiments disclosed herein include a dynamic load simulator. In an embodiment, the dynamic load simulator comprises an impedance load, a reverse match network, and a smart RF controller. In an embodiment, the smart RF controller comprises a dynamic load generator, and a reverse match controller.

公开(公告)号：US11853042B2

公开(公告)日：2023-12-26

申请号：US17177978

申请日：2021-02-17

Applicant: Applied Materials, Inc.

Inventor： Garrett Ho-Yee Sin ,  Sidharth Bhatia ,  Katty Marie Lydia Gamon Guyomard ,  Shawyon Jafari ,  Heng-Cheng Pai ,  Pramod Nambiar ,  Paul Lukas Brillhart ,  Ilker Durukan

IPC: G05B19/418 ,  G06N20/00 ,  G01N33/00 ,  G06F30/398 ,  G06F119/22 ,  G06F119/18

CPC classification number: G05B19/41875 ,  G01N33/00 ,  G06F30/398 ,  G06N20/00 ,  G01N2033/0095 ,  G05B2219/31264 ,  G05B2219/32179 ,  G05B2219/45031 ,  G06F2119/18 ,  G06F2119/22

Abstract: A method includes receiving part data associated with a corresponding part of substrate processing equipment, sensor data associated with one or more corresponding substrate processing operations performed by the substrate processing equipment to produce one or more corresponding substrates, and metrology data associated with the one or more corresponding substrates produced by the one or more corresponding substrate processing operations performed by the substrate processing equipment that includes the corresponding part. The method further includes generating sets of aggregated part-sensor-metrology data including a corresponding set of part data, a corresponding set of sensor data, and a corresponding set of metrology data. The method further includes causing analysis of the sets of aggregated part-sensor-metrology data to generate one or more outputs to perform a corrective action associated with the corresponding part of the substrate processing equipment.

公开(公告)号：US20230295799A1

公开(公告)日：2023-09-21

申请号：US17696794

申请日：2022-03-16

Applicant: Applied Materials, Inc.

Inventor： Jeffrey Yat Shan Au ,  Sidharth Bhatia ,  Zhaozhao Zhu ,  Nicholas Ryan Pica ,  Varoujan Chakarian ,  Chenfei Hu

IPC: C23C16/44 ,  G01N21/01 ,  C23C16/52 ,  G01N21/94

CPC classification number: C23C16/4401 ,  G01N21/01 ,  C23C16/52 ,  G01N21/94 ,  G01N2021/0181 ,  G01N2021/8416

Abstract: A method includes receiving, by a processing device, first data from an optical sensor of a processing chamber. The method further includes processing the first data to obtain second data. The second data includes an indication of a condition of a coating on an interior surface of the processing chamber. The method further includes generating an indication of performance of a processing operation of the processing chamber in view of the second data. The method further includes causing performance of a corrective action in view of the indication of performance of the processing chamber.