摘要:
Multilayered moldings, which comprise a laminate structure of (A) a layer of a polyphenylene sulfide resin (hereinafter referred to as PPS resin) composition and (B) a layer of a thermoplastic resin except PPS resins and which are characterized in that the PPS resin composition constituting the layer (A) comprises (A1) 100 parts by weight of a PPS resin, (A2) from 1 to 80 parts by weight of a thermoplastic resin having at least one functional group selected from epoxy groups, acid anhydride groups, carboxyl group and its salts, and carboxylate groups, and (A3) from 5 to 80 parts by weight of a thermoplastic resin that is similar in kind to the thermoplastic resin constituting the layer (B), have good hot water resistance, antifreeze resistance, chemical resistance, heat resistance, abrasion resistance, gas permeation resistance and interlayer adhesion.
摘要:
An electroconductive, multilayered hollow molding comprising at least two thermoplastic resin layers, in which at least one layer is a layer of (a) a thermoplastic resin composition consisting essentially of a polyphenylene sulfide resin; one layer is a layer of (b) a thermoplastic resin composition consisting essentially of a thermoplastic resin other than a polyphenylene sulfide resin; and at least one of the layers is a layer of an electroconductive, thermoplastic resin composition comprising an electroconductive filler and/or an electroconductive polymer, and a thermoplastic resin.
摘要:
The present invention is a polyphenylene sulfide resin composition comprising (a) a polyphenylene sulfide resin and (b) an olefin-based resin, and satisfying the following conditions (i) through (v): (i) The mixing ratio of the polyphenylene sulfide resin (a) and the olefin-based resin (b) is such that the amount of the polyphenylene sulfide resin (a) is in a range from 95 to 60 wt %, while the amount of the olefin-based resin (b) is in a range from 5 to 40 wt %, with the total weight of both the ingredients as 100 wt %; (hi) said olefin-based resin (b) comprising two copolymer: (b-1) an epoxy group-containing olefin copolymer and (b-2) an ethylene/(α-olefin copolymer obtained by copolymerizing ethylene and an α-olefin having 3 to 20 carbon atoms; (iii) as the morphology observed by an electron microscope, said polyphenylene sulfide resin (a) forms a continuous phase, and said olefin-based resin (b) forms a dispersion phase and has a core-shell structure having said ethylene/α-olefin copolymer (b-2) acting as a core component contained in said epoxy group-containing olefin copolymer (b-1) acting as a shell component: (iv) the melt flow rate measured at a temperature of 315.5° C. and at a load of 5000 g according to ASTM-D-1238 is in a range from 10 to 50 g/10 min; and (v) the notched impact strength measured at −40° C. according to ASTM-D-256 is 300 J/m or more. This invention provides a PPS resin composition excellent in flowability, impact properties and low-temperature roughness and suitable for injection molding.
摘要:
A polyphenylene sulfide resin composition including 100 parts by weight of a resin composition that consists of 99 to 60 wt % of a polyphenylene sulfide resin (a), and 1 to 40 wt % of at least one type of noncrystalline resin (b) selected from the group consisting of polyetherimide resin and polyether sulfone resin and 0.1 to 10 parts by weight of a compound (c) containing at least one group selected from epoxy group, amino group and isocyanate group, wherein the non-crystalline resin (b) forms an island phase and the number-average dispersed particle size of the noncrystalline resin (b) is 1,000 nm or less.
摘要:
A polyphenylene sulfide resin treated by thermal oxidation has a generated gas amount of 0.23 wt % or less when the resin is heated and melted in vacuum at 320° C. for 2 hours; a residual amount of 3.0 wt % or less as a residue when the resin is dissolved in an amount corresponding to 20 times the weight of the resin, of 1-chloronaphthalene at 250° C. for 5 minutes and, as the 1-chloronaphthalene solution, pressure-filtered in a still hot state by a PTFE membrane filter with a pore size of 1 μm or less; and a melt flow rate (measured at a temperature of 315.5° C. and at a load of 5000 g according to ASTM D-1238-70) of more than 100 g/10 min to 500 g/10 min.
摘要:
A polyphenylene sulfide resin composition including 100 parts by weight of a resin composition that consists of 99 to 60 wt % of a polyphenylene sulfide resin (a), and 1 to 40 wt % of at least one type of noncrystalline resin (b) selected from the group consisting of polyetherimide resin and polyether sulfone resin and 0.1 to 10 parts by weight of a compound (c) containing at least one group selected from epoxy group, amino group and isocyanate group, wherein the non-crystalline resin (b) forms an island phase and the number-average dispersed particle size of the noncrystalline resin (b) is 1,000 nm or less.
摘要:
A process for producing a polyphenylene sulfide resin composition includes melt-kneading about 99 to about 60 wt % of a polyphenylene sulfide resin (a) and about 1 to about 40 wt % of a polyamide resin (b), and about 0.1 to 10 parts by weight of a compatibilizing agent (c) per 100 parts by weight in total of the polyphenylene sulfide resin (a) and the polyamide resin (b), using a double screw extruder with two or more kneading portions at a temperature of the range from a melting peak temperature of the polyphenylene sulfide resin+10° C. to a melting peak temperature of the polyphenylene sulfide resin+70° C., wherein the polyamide resin (b) is excluded nylon 46 and has a relative viscosity of 1.5 or more measuring in concentrated sulfuric acid at a concentration of 1% and at 25° C., wherein the compatibilizing agent (c) is a compound having one or more types of groups selected from epoxy groups, amino group and isocyanate group, and wherein the resin composition has a morphology that the polyphenylene sulfide resin (a) in the resin composition forms a sea phase while the polyamide resin (b) in the resin composition forms an island phase, and the number average dispersed particle size of the polyamide resin (b) is kept at less than about 500 nm after the resin composition is melted and allowed to reside at 300° C. for 30 minutes.
摘要:
A process for producing a polyphenylene sulfide resin with properties of (1) 0.3 wt % or less in the amount of the volatile gas generated when heated and melted at 320° C. in vacuum for 2 hours, (2) 0.3 wt % or less in the ash content achieved when incinerated at 550° C., (3) 4.0 wt % or less in the residue amount achieved when a solution with 1 part by weight of the polyphenylene sulfide resin dissolved in 20 parts by weight of 1-chloronaphthalene is pressure-filtered by a PTFE membrane filter with a pore size of 1 μm at 250° C. for 5 minutes, and (4) higher than 500 g/10 min in melt flow rate (according to ASTM D-1238-70: measured at a temperature of 315.5° C. and at a load of 5000 g), by acid-treating a polyphenylene sulfide resin in an acid treatment step and subsequently treating it for thermal oxidation in a thermal oxidation step.
摘要:
The invention provides a polyphenylene sulfide resin composition including: 1 to 100 parts by weight of an olefin elastomer (B); and 0.01 to 10 parts by weight of a carboxylic acid amide wax mixture (C), relative to 100 parts by weight of a polyphenylene sulfide resin (A), wherein the carboxylic acid amide wax mixture (C) is obtained by adding 0.01 to 5 parts by weight of an antioxidant to 100 parts by weight of a carboxylic acid amide wax produced by reaction of a higher aliphatic monocarboxylic acid, a polybasic acid and a diamine.
摘要:
A process for producing a polyphenylene sulfide resin composition includes melt-kneading about 99 to about 60 wt % of a polyphenylene sulfide resin (a) and about 1 to about 40 wt % of a polyamide resin (b), and about 0.1 to 10 parts by weight of a compatibilizing agent (c) per 100 parts by weight in total of the polyphenylene sulfide resin (a) and the polyamide resin (b), using a double screw extruder with two or more kneading portions at a temperature of the range from a melting peak temperature of the polyphenylene sulfide resin+10° C. to a melting peak temperature of the polyphenylene sulfide resin+70° C., wherein the polyamide resin (b) is excluded nylon 46 and has a relative viscosity of 1.5 or more measuring in concentrated sulfuric acid at a concentration of 1% and at 25° C., wherein the compatibilizing agent (c) is a compound having one or more types of groups selected from epoxy groups, amino group and isocyanate group, and wherein the resin composition has a morphology that the polyphenylene sulfide resin (a) in the resin composition forms a sea phase while the polyamide resin (b) in the resin composition forms an island phase, and the number average dispersed particle size of the polyamide resin (b) is kept at less than about 500 nm after the resin composition is melted and allowed to reside at 300° C. for 30 minutes.