公开(公告)号：US20160084638A1

公开(公告)日：2016-03-24

申请号：US14923676

申请日：2015-10-27

Applicant: BONDTECH CO., LTD.

Inventor： Akira YAMAUCHI

IPC: G01B11/14

CPC classification number: H01L24/75 ,  G01B11/14 ,  H01L23/544 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/757 ,  H01L2224/81009 ,  H01L2224/81121 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81191 ,  H01L2224/81204 ,  H01L2224/81801 ,  H01L2224/83121 ,  H01L2924/0001 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0107 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/15788 ,  H01L2924/181 ,  H05K1/0269 ,  H05K3/303 ,  H05K2201/09918 ,  H05K2203/166 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

Abstract: A pressure application technique is provided that enables two objects to be pressurized (e.g., objects to be bonded) to be positioned with greater accuracy before having pressure applied thereto. The objects to be pressurized are moved relative to each other in a Z direction such that the objects are brought into contact with each other (step S13). Then, a horizontal positional shift ΔD between the objects to be pressurized is measured in the contact state of the objects to be pressurized (step S14). Thereafter, positioning of the objects to be pressurized is again performed by moving the objects to be pressurized relative to each other in the horizontal direction, as a result of which the positional shift ΔD is corrected (step S17).

Abstract translation: 提供了一种压力施加技术，其能够在施加压力之前使两个物体被加压（例如，待粘合的物体）以更高的准确度定位。 要加压的物体在Z方向上彼此相对移动，使得物体彼此接触（步骤S13）。 然后，在待加压物体的接触状态下测量待加压物体之间的水平位置移动量Dgr; D（步骤S14）。 此后，通过在水平方向上相对于彼此移动要加压的物体来再次执行要加压的物体的定位，结果校正位置偏移＆Dgr; D（步骤S17）。

公开(公告)号：US20240162063A1

公开(公告)日：2024-05-16

申请号：US18552650

申请日：2022-03-30

Applicant: BONDTECH CO., LTD.

Inventor： Akira YAMAUCHI

IPC: H01L21/67 ,  H01L21/18 ,  H01L21/687

CPC classification number: H01L21/67092 ,  H01L21/187 ,  H01L21/67259 ,  H01L21/68764

Abstract: A bonding device (1) includes a stage (141) to hold a substrate (W1), a head (142) arranged facing the stage (141) and configured to hold a substrate (W2), a head holder (111) to hold the head (142) on the opposite side to the stage (141) side of the head (142), the head holder (111) extending to the outer side of the head (142) and the stage (141) in a direction orthogonal to the Z-axis direction, three holder supports (1471) each to support the head holder (111) from one of three locations in an outer peripheral portion surrounding the stage (141), and three support drivers (146) to individually move the three holder supports (1471) in a −Z-direction in which the head holder (111) and the stage (141) come close to each other or a +Z-direction in which the head holder (111) and the stage (141) separate from each other.

公开(公告)号：US20240079373A1

公开(公告)日：2024-03-07

申请号：US18487068

申请日：2023-10-14

Applicant: Tadatomo SUGA ,  BONDTECH CO., LTD.

Inventor： Akira YAMAUCHI ,  Tadatomo SUGA

IPC: H01L23/00

CPC classification number: H01L24/74 ,  H01L24/80 ,  H01L2224/8022

Abstract: Bonding system for bonding a second article to a first article, comprising an activation treatment device that comprises an object supporter that supports objects comprising the second article, and a particle beam source that activates a bonding surface of the second article by irradiating the objects with a particle beam, the objects being set on one treatment surface without being opposed to each other, followed by performing activation treatment by the particle beam source; and a bond device that brings the second article, of which the bonding surface is activated by the activation treatment device, into contact with the first article, to thereby bond the second article to the first article, wherein the object supporter supports the objects in a posture in which a portion formed of a plurality of kinds of materials comprising the bonding surface of the second article in the objects is exposed to the particle beam source.

公开(公告)号：US20210320024A1

公开(公告)日：2021-10-14

申请号：US17261022

申请日：2019-07-02

Applicant: BONDTECH CO., LTD.

Inventor： Akira YAMAUCHI

IPC: H01L21/683 ,  H01L21/68

Abstract: This substrate bonding device (100) includes: a stage (401), a head (402), an electrostatic chuck that holds a peripheral portion of a substrate (301) while the stage (401) supports the substrate (301), a holder driver that drives the electrostatic chuck, and a controller (700). The electrostatic chuck is disposed in a first area on the stage (401) facing the peripheral portion of the substrate (301), and the holder driver drives the electrostatic chuck by applying voltage to the electrostatic chuck. The controller (700) controls the holder driver in such a manner that a peripheral portion of the substrate (301) is released from the electrostatic chuck when a peripheral portion of the substrate (301) is made to come into contact with a peripheral portion of the substrate (302) while a central portion of a bonding surface of the substrate (301) and a central portion of a bonding surface of the substrate (302) are in contact with each other.

公开(公告)号：US20210265300A1

公开(公告)日：2021-08-26

申请号：US17269513

申请日：2018-11-14

Applicant: Tadatomo SUGA ,  BONDTECH CO., LTD.

Inventor： Akira YAMAUCHI ,  Tadatomo SUGA

IPC: H01L23/00

Abstract: A chip bonding system including an activation treatment device including a frame holder and a particle beam source that irradiates a sheet, to which a chip held by the frame holder is stuck, with a particle beam, to thereby activate a bonding surface of the chip; and a bonding device that brings the chip, of which the bonding surface is activated by the activation treatment device, into contact with a substrate, to thereby bond the chip to the substrate. The frame holder supports a holding frame in a posture in which one side, to which the chip is stuck, in the sheet, of the holding frame that holds the sheet TE, which is formed of a resin, and to which the chip is stuck, is exposed to the particle beam source.

公开(公告)号：US20240174457A1

公开(公告)日：2024-05-30

申请号：US18552632

申请日：2022-03-30

Applicant: BONDTECH CO., LTD.

Inventor： Akira YAMAUCHI

IPC: B65G49/06

CPC classification number: B65G49/067 ,  B65G2207/28 ,  B65G2249/02

Abstract: A bonding system is a bonding system that bonds two substrates and includes: a bonder (1) that executes a positioning process of performing positioning of the two substrates under reduced pressure, and then executes a contact process of bringing the two substrates into contact under reduced pressure; and a conveying device (84) that conveys, to the bonder (1), the two substrates to be bonded to each other. Then, the bonder (1) executes the positioning process and the contact process mentioned earlier in a state where the conveying device (84) is separated from the bonder (1).

公开(公告)号：US20240079374A1

公开(公告)日：2024-03-07

申请号：US18487071

申请日：2023-10-14

Applicant: Tadatomo SUGA ,  BONDTECH CO., LTD.

Inventor： Akira YAMAUCHI ,  Tadatomo SUGA

IPC: H01L23/00

CPC classification number: H01L24/74 ,  H01L24/80 ,  H01L2224/8022

Abstract: Bonding system that bonds each of a plurality of second articles to a first article, wherein each of the plurality of second articles is a chip comprising an uneven portion on a circumference closer to a bonding surface to be bonded to the first article, the bonding system comprises: a device for supplying a second article that supplies the plurality of second articles; a bond device that bonds the plurality of second articles to the first article by bringing the plurality of second articles into contact with the first article; and a device for transporting a second article that transports, to the bond device, at least one of the plurality of second articles supplied from the device for supplying a second article, and the device for transporting a second article comprises a holder for holding a second article that holds the uneven portion of the at least one second article.

公开(公告)号：US20240009984A1

公开(公告)日：2024-01-11

申请号：US18245895

申请日：2021-09-10

Applicant: Tadatomo SUGA ,  BONDTECH CO., LTD.

Inventor： Akira YAMAUCHI ,  Tadatomo SUGA

IPC: B32B37/12 ,  B32B38/10 ,  B32B37/10

CPC classification number: B32B37/12 ,  B32B38/10 ,  B32B37/10 ,  B32B2309/04 ,  B32B2309/12 ,  B32B2310/14 ,  B32B2310/0881

Abstract: A substrate bonding method for bonding two substrates includes an activation treatment step of, by subjecting at least one of bonding surfaces to be bonded to each other of respective ones of the two substrates to at least one of reactive ion etching using nitrogen gas and irradiation of nitrogen radicals, activating the bonding surface, a gas exposure step of, after the activation treatment step, exposing the bonding surfaces of the two substrates to gas containing water within a preset standard time, and a bonding step of bonding the two substrates that have the bonding surfaces activated in the activation treatment step.

公开(公告)号：US20230154770A1

公开(公告)日：2023-05-18

申请号：US18157147

申请日：2023-01-20

Applicant: BONDTECH CO., LTD.

Inventor： Akira YAMAUCHI

IPC: H01L21/67 ,  B29C35/08 ,  B29C45/14 ,  H01L21/02 ,  H01L21/56 ,  H01L21/677 ,  H01L21/68 ,  H01L21/683 ,  H01L21/66 ,  H01L23/544 ,  H01L23/00 ,  H05K13/04

CPC classification number: H01L21/67144 ,  B29C35/0805 ,  B29C45/14065 ,  B29C45/14655 ,  H01L21/02057 ,  H01L21/565 ,  H01L21/67017 ,  H01L21/67051 ,  H01L21/67098 ,  H01L21/6715 ,  H01L21/67259 ,  H01L21/67742 ,  H01L21/681 ,  H01L21/6838 ,  H01L22/12 ,  H01L23/544 ,  H01L24/75 ,  H01L24/81 ,  H05K13/0413 ,  B29C2035/0827 ,  B29L2031/3406

Abstract: A resin shaping device configured to cure a resin placed in a mold in a state in which the mold is pressed against a substrate, the resin shaping device comprising: a substrate holding unit configured to hold the substrate in an orientation such that a forming face for forming a resin part on the substrate faces vertically downward; a head configured to hold the mold from vertically below; a head drive unit configured to cause the head to face a position for formation of a resin part on the substrate, and then cause vertically upward movement of the head so that the head approaches the substrate holding unit and presses the mold from vertically below the substrate; and a resin curing unit configured to cure the resin placed in the mold in a state in which the mold is pressed against the substrate.

公开(公告)号：US20230030272A1

公开(公告)日：2023-02-02

申请号：US17788957

申请日：2020-02-07

Applicant: BONDTECH CO., LTD.

Inventor： Akira YAMAUCHI

IPC: H01L23/00 ,  H01L25/075

Abstract: A bonding device measures a position deviation amount of the chip with respect to the substrate in a state where the chip and the substrate are in contact, and corrects and moves the chip relatively to the substrate in such a way as to reduce the position deviation amount, based on the measured position deviation amount. Then, the bonding device fixes the chip to the substrate by irradiating a resin portion of the chip with an ultraviolet ray and curing the resin portion when the position deviation amount of the chip with respect to the substrate is equal to or less than a position deviation amount threshold value.